Abstract: Provided is a resin composition for a fiber-reinforced composite material that has low tackiness when turned into a prepreg, has satisfactory handleability, and can be suppressed in deformation at the time of its release from a mold in a PCM method. The resin composition is a resin composition for a fiber-reinforced composite material including, as essential components: a liquid epoxy resin (A); a novolac-type epoxy resin (B); a polymer component (C) having a molecular weight of 10,000 or more; dicyandiamide (D); and an imidazole-based curing aid (E), wherein the resin composition includes 10 parts by mass to 35 parts by mass of the liquid epoxy resin (A), and 10 parts by mass to 25 parts by mass of the polymer component (C) out of 100 parts by mass of the total of the components (A) to (E), and has a glass transition temperature of 0° C. or more before its curing.

Abstract: A resin composition for a fiber-reinforced composite material that makes it possible to improve productivity by suppressing deformation at the time of removal from a mold, in particular, in the PCM method, while achieving both rapid curing and storage stability. The resin composition for a fiber-reinforced composite material includes an epoxy resin (A) including a phenol novolac epoxy resin and a bisphenol A epoxy resin; a phenoxy resin (B); dicyandiamide (C); an imidazole-based curing aid (D); and a phenol-based curing accelerator (E) as essential components, wherein the phenol novolac epoxy resin of the epoxy resin (A) constitutes 40 parts by mass to 75 parts by mass, the bisphenol A epoxy resin constitutes 10 parts by mass to 35 parts by mass, and the phenoxy resin (B) constitutes 5 parts by mass to 15 parts by mass in the total of 100 parts by mass of the components (A) to (E).

Abstract: Provided is a resin composition for a fiber-reinforced composite material that has low tackiness when turned into a prepreg, has satisfactory handleability, and can be suppressed in deformation at the time of its release from a mold in a PCM method. The resin composition is a resin composition for a fiber-reinforced composite material including, as essential components: a liquid epoxy resin (A); a novolac-type epoxy resin (B); a polymer component (C) having a molecular weight of 10,000 or more; dicyandiamide (D); and an imidazole-based curing aid (E), wherein the resin composition includes 10 parts by mass to 35 parts by mass of the liquid epoxy resin (A), and 10 parts by mass to 25 parts by mass of the polymer component (C) out of 100 parts by mass of the total of the components (A) to (E), and has a glass transition temperature of 0° C. or more before its curing.

Abstract: A resin composition for a fiber-reinforced composite material that makes it possible to improve productivity by suppressing deformation at the time of removal from a mold, in particular, in the PCM method, while achieving both rapid curing and storage stability. The resin composition for a fiber-reinforced composite material includes an epoxy resin (A) including a phenol novolac epoxy resin and a bisphenol A epoxy resin; a phenoxy resin (B); dicyandiamide (C); an imidazole-based curing aid (D); and a phenol-based curing accelerator (E) as essential components, wherein the phenol novolac epoxy resin of the epoxy resin (A) constitutes 40 parts by mass to 75 parts by mass, the bisphenol A epoxy resin constitutes 10 parts by mass to 35 parts by mass, and the phenoxy resin (B) constitutes 5 parts by mass to 15 parts by mass in the total of 100 parts by mass of the components (A) to (E).

Abstract: Disclosed is a photosensitive resin composition capable of displaying satisfactory patterning performance against an alkaline developer and yielding a cured film of a sufficiently low coefficient of linear thermal expansion. The photosensitive resin composition contains a photopolymerization initiator and a polyimide precursor obtained by the reaction of an ester-containing diamine such as 4-aminophenyl 4?-aminobenzoate, a biphenyl-based diamine such as 4,4?-diamino-2,2?-dimethylbiphenyl, and an unsaturated group-containing diamine such as 4,4?-diamino-2,2?-divinylbiphenyl with an acid anhydride such as pyromellitic dianhydride. The content of the structural unit derived from the unsaturated group-containing diamine in the polyimide precursor is 5-60 mol %.

Abstract: Disclosed is a photosensitive resin composition capable of displaying satisfactory patterning performance against an alkaline developer and yielding a cured film of a sufficiently low coefficient of linear thermal expansion. The photosensitive resin composition contains a photopolymerization initiator and a polyimide precursor obtained by the reaction of an ester-containing diamine such as 4-aminophenyl 4?-aminobenzoate, a biphenyl-based diamine such as 4,4?-diamino-2,2?-dimethylbiphenyl, and an unsaturated group-containing diamine such as 4,4?-diamino-2,2?-divinylbiphenyl with an acid anhydride such as pyromellitic dianhydride. The content of the structural unit derived from the unsaturated group-containing diamine in the polyimide precursor is 5-60 mol %.

Abstract: A carrier tape capable of being formed by means of a die apparatus readily manufactured and exhibiting increased durability. The carrier tape is formed thereon with a plurality of receiving recesses for respectively receiving semiconductor packages therein in a manner to be spaced from each other at predetermined intervals in a longitudinal direction thereof. The receiving recesses are each provided at four corners thereof with shelf sections in a manner to be expanded outwardly from an opening of the receiving recess in a plane direction, so that the shelf sections may have an increased area. The shelf sections act to support a periphery of a bottom surface of the semiconductor package thereon. The receiving recess is also provided with positioning sections for positioning the semiconductor package in the plane direction while keeping sides of the semiconductor package in contact therewith. The positioning sections are respectively arranged between an adjacent two of the shelf sections.

Abstract: An embossed carrier tape capable of accurately accomplishing an automatic inspection of leads or the like of an electronic component by means of a camera. The carrier tape is formed with a plurality of receiving recesses in which electronic components are to be received, respectively. The receiving recesses are each formed at a lower portion of each of side surfaces thereof opposite to leads of the electronic component with an inclined surface. Such construction results in the leads being abutted against the inclined surface, to thereby be subjected to positional regulation if the electronic component is undesirably moved during inspection thereof. This permits a reflected image of the leads from the side surface of the receiving recess to be substantially separated from a directly-viewed image thereof during an inspection of the electronic component by image processing using a camera, to thereby ensure accurate judgment of any defect of the electronic component, such as bending of the leads or the like.