Abstract: A scanning microscope unit includes: a light source for outputting irradiation light; a photodetector; a MEMS mirror for scanning an irradiation light over an observation object, and for guiding an observation light toward the photodetector; a scanning lens for guiding the irradiation light scanned by the MEMS mirror, to a microscope optical system, and for guiding the observation light imaged by the microscope optical system, to the MEMS mirror; and a frame member formed in a frame shape to define an opening, and disposed on a side of the microscope optical system with respect to the scanning lens such that the irradiation light and the observation light pass through the opening. The frame member includes a calibration portion provided in a side portion defining the opening, and for generating calibration light including a sensitivity wavelength of the photodetector in response to an incidence of the irradiation light.

Abstract: An air-conditioning system includes a second control device that is communicable with a first control device that controls a first system including a first air-conditioning device by first communication using a first communication protocol, to control a second system including a second air-conditioning device by second communication using a second communication protocol different from the first communication protocol, in which the second control device is communicable with the first control device by third communication using an XML communication protocol, acquires first control information from the first control device by the third communication, the first control information being used for controlling the first system, creates second control information based on the first control information acquired by the third communication, the second control information causing the second system to execute control corresponding to control of the first system.

Abstract: A confocal microscope unit according to an embodiment includes: a first subunit which includes a light source, a pinhole plate, and a photodetector; a second subunit which includes a light source, a pinhole plate, and a photodetector; a scan mirror which scans excitation light output from the first and second subunits on a sample via a microscope optical system and guides fluorescence generated from the sample in response to the excitation light and focused by the microscope optical system to the first and second subunits; and a main housing which is attachable to a connection port and to which the scan mirror, the first subunit, and the second subunit are fixed, wherein the first subunit and the second subunit are disposed in the main housing so that incident angles of two excitation lights to the scan mirror are displaced from each other by a predetermined angle.

Abstract: A confocal microscope unit according to an embodiment includes: a first subunit which includes a light source, a pinhole plate, and a photodetector; a second subunit which includes a light source, a pinhole plate, and a photodetector; a scan mirror which scans excitation light on a sample and guides fluorescence generated from the sample to the first and second subunits; a scan lens which guides the excitation light and guides the fluorescence to the scan mirror; and a main housing which is attachable to a connection port and to which the scan mirror, the scan lens, and the subunits are fixed, wherein the first subunit includes a dichroic mirror that separates the excitation light and fluorescence handled by the own unit from those handled by the second subunit.

Abstract: Embodiments are for a confocal microscope unit attached to a connection port of a microscope including: light sources which output irradiation light to a sample to be observed; photodetectors which detect observation light generated from a sample in response to the irradiation light; a scan mirror which scans the irradiation light on the sample and guides the observation light generated from the sample to the photodetectors; a scan lens which guides the irradiation light scanned by the scan mirror to the microscope optical system and guides the observation light focused by the microscope optical system to the scan mirror; a lens barrel to which the scan lens is fixed; an attachment portion which attaches the lens barrel to the connection port; and a movable portion which supports the lens barrel so that an angle of the lens barrel with respect to the attachment portion is changeable.

Abstract: An optical measuring device includes an integrator formed with an incident opening on which excitation light is to be incident and an exit opening from which measurement light is to exit, a light guide unit for guiding the measurement light that exits from the exit opening, and a light detecting unit for detecting the measurement light guided by the light guide unit. The light guide unit includes a plurality of light guide members arranged so that incident end surfaces of the light guide members face the inside of the integrator through the exit opening. The light detecting unit detects the measurement light that is guided by at least one of the plurality of light guide members. Light-receiving regions of the plurality of light guide members on the incident end surface side overlap with each other in the integrator.

Abstract: An optical measuring device includes an integrator formed with an incident opening on which excitation light is to be incident and an exit opening from which measurement light is to exit, a light guide unit for guiding the measurement light that exits from the exit opening, and a light detecting unit for detecting the measurement light guided by the light guide unit. The light guide unit includes a plurality of light guide members arranged so that incident end surfaces of the light guide members face the inside of the integrator through the exit opening. The light detecting unit detects the measurement light that is guided by at least one of the plurality of light guide members. Light-receiving regions of the plurality of light guide members on the incident end surface side overlap with each other in the integrator.

Abstract: A hydraulic shock absorber includes a valve body having a second valve which is fixed to the valve body on a central axis CL side of the second valve and covers an open end of a second oil passage in the valve body. The second valve is deformable in a direction away from the valve body when the valve is applied with force from the valve body side. The second valve is configured: (a) to include a first through-hole formed in a circumferential direction thereof, (b) have lower stiffness, with respect to force from the valve body side, on a second through-hole side than on a third through-hole side and (c) such that a first corner portion C1 of the first through-hole has higher stiffness than a second corner portion C2 of the first through-hole positioned on the third through-hole side.

Abstract: A hydraulic shock absorber includes a valve body having a second valve which is fixed to the valve body on a central axis CL side of the second valve and covers an open end of a second oil passage in the valve body. The second valve is deformable in a direction away from the valve body when the valve is applied with force from the valve body side. The second valve is configured: (a) to include a first through-hole formed in a circumferential direction thereof, (b) have lower stiffness, with respect to force from the valve body side, on a second through-hole side than on a third through-hole side and (c) such that a first corner portion C1 of the first through-hole has higher stiffness than a second corner portion C2 of the first through-hole positioned on the third through-hole side.

Abstract: In a semiconductor device having a MEMS according to this invention, a plurality of units having movable portions for constituting a MEMS are monolithically mounted on a semiconductor substrate on which an integrated circuit including a driving circuit, sensor circuit, memory, and processor is formed. Each unit has a processor, memory, driving circuit, and sensor circuit.

Abstract: In a semiconductor device having a MEMS according to this invention, a plurality of units having movable portions for constituting a MEMS are monolithically mounted on a semiconductor substrate on which an integrated circuit including a driving circuit, sensor circuit, memory, and processor is formed. Each unit has a processor, memory, driving circuit, and sensor circuit.

Abstract: In a micromachine according to this invention, a polyimide film is formed on the surface of each electrode. The polyimide film is formed as follows. A substrate having each electrode and a counterelectrode are dipped in an electrodeposition polyimide solution, and a positive voltage is applied to the electrode. A material dissolved in the electrodeposition polyimide solution is deposited on a surface of the positive-voltage-applied electrode that is exposed in the solution, thus forming a polyimide film on the surface.

Abstract: In a semiconductor device having a MEMS according to this invention, a plurality of units having movable portions for constituting a MEMS are monolithically mounted on a semiconductor substrate on which an integrated circuit including a driving circuit, sensor circuit, memory, and processor is formed. Each unit has a processor, memory, driving circuit, and sensor circuit.

Abstract: In a method of manufacturing a surface shape recognition sensor, first and second interconnections are formed on a semiconductor substrate. An interlayer dielectric film on the semiconductor substrate covers the interconnections. A first metal film is electrically connected to the interconnections through first and second through holes in the interlayer dielectric film. A first mask pattern on the first metal film covers predetermined first and second regions corresponding to the through holes, respectively. The exposed first metal film is selectively removed to form a sensor electrode and connection electrode film, formed of the first metal film, in the first and second regions, respectively. An insulating passivation film on the interlayer dielectric film covers the sensor electrode and connection electrode film. A third through hole in the passivation film reaches the connection electrode film. A second metal film on the passivation film is in contact with the exposed connection electrode film.

Abstract: In a micromachine according to this invention, a polyimide film is formed on the surface of each electrode. The polyimide film is formed as follows. A substrate having each electrode and a counterelectrode are dipped in an electrodeposition polyimide solution, and a positive voltage is applied to the electrode. A material dissolved in the electrodeposition polyimide solution is deposited on a surface of the positive-voltage-applied electrode that is exposed in the solution, thus forming a polyimide film on the surface.

Abstract: An optical switch device includes at least an optical switch element and driving control circuit. In the optical switch element, a fixed electrode portion is arranged, via a dielectric layer, on a semiconductor substrate on which an integrated circuit is formed. A mirror structure has a plate-shaped movable portion arranged above the fixed electrode portion while opposing the fixed electrode portion. A reflecting portion is formed at least at part of the movable portion to reflect light. A support member is fixed around the fixed electrode portion on the semiconductor substrate via a dielectric layer and supports the mirror structure. The driving control circuit is incorporated in the integrated circuit to drive the optical switch element by applying a predetermined potential to the movable portion and fixed electrode portion.

Abstract: A micromachine manufacturing method according to this invention includes at least the movable portion formation step of selectively etching a single-crystal silicon layer by using a movable portion formation mask pattern as a mask, thereby forming on the single-crystal silicon layer a movable portion which is coupled to the surrounding single-crystal silicon layer via a coupling portion on a buried oxide, the movable portion protective film formation step of forming a movable portion protective film on the single-crystal silicon layer so as to cover the movable portion while the movable portion is formed on the buried oxide, and the step of forming a buried protective film which covers the movable portion exposed in the substrate opening and movable portion opening, and the single-crystal silicon layer around the movable portion while the movable portion protective film is formed.

Abstract: A micromachine manufacturing method according to this invention includes at least the movable portion formation step of selectively etching a single-crystal silicon layer by using a movable portion formation mask pattern as a mask, thereby forming on the single-crystal silicon layer a movable portion which is coupled to the surrounding single-crystal silicon layer via a coupling portion on a buried oxide, the movable portion protective film formation step of forming a movable portion protective film on the single-crystal silicon layer so as to cover the movable portion while the movable portion is formed on the buried oxide, and the step of forming a buried protective film which covers the movable portion exposed in the substrate opening and movable portion opening, and the single-crystal silicon layer around the movable portion while the movable portion protective film is formed.

Abstract: In a semiconductor device having a MEMS according to this invention, a plurality of units having movable portions for constituting a MEMS are monolithically mounted on a semiconductor substrate on which an integrated circuit including a driving circuit, sensor circuit, memory, and processor is formed. Each unit has a processor, memory, driving circuit, and sensor circuit.

Abstract: In a micromachine according to this invention, a polyimide film is formed on the surface of each electrode. The polyimide film is formed as follows. A substrate having each electrode and a counterelectrode are dipped in an electrodeposition polyimide solution, and a positive voltage is applied to the electrode. A material dissolved in the electrodeposition polyimide solution is deposited on a surface of the positive-voltage-applied electrode that is exposed in the solution, thus forming a polyimide film on the surface.