Abstract: A cathode ray tube having degaussing coils attached to an outer side of a glass vessel of a funnel part of a main body of the cathode ray tube, in which the degaussing coils each include a flattened part, extended along the outer front surface at a front side of a funnel part, a circular part having a circular cross-section and a transition part interconnecting the end parts of the flattened part and the circular part and changed in cross-section shape from a flattened rectangle to a circle. The degaussing coil may has shape flattened partially to reduce the outer size of the cathode ray tube and includes a plastic case for retaining the coil in the flattened shape. The degaussing coil is stabilized in shape and is not deformed during transport while its attachability with respect to the cathode ray tube may be improved.

Abstract: According to the present invention, as improvement in the adhesion of inner leads with a packaging resin in a resin-sealed semiconductor device is attained by spreading leads on or near the circuit-forming face of a pellet, or on or near the main non-circuit-forming face of the pellet to extend the lengths of the inner leads on or under the pellet.

Abstract: According to the present invention, as improvement in the adhesion of inner leads with a packaging resin in a resin-sealed semiconductor device is attained by spreading leads on or near the circuit-forming face of a pellet, or on or near the main non-circuit-forming face of the pellet to extend the lengths of the inner leads on or under the pellet.

Abstract: According to the present invention, as improvement in the adhesion of inner leads with a packaging resin in a resin-sealed semiconductor device is attained by spreading leads on or near the circuit-forming face of a pellet, or on or near the main non-circuit-forming face of the pellet to extend the lengths of the inner leads on or under the pellet.

Abstract: A wire bonding apparatus which can variously change the shape of a loop of a bonding wire and can restrict the loop shape in accordance with specifications of an article being wire bonded. In the wire bonding apparatus, a wire guide unit moving both vertically and transversely, independently of a bonding tool, is disposed in proximity of the bonding tool which moves relative to the article to be wire bonded and which connects the wire between a first bonding region and the second bonding region. A mechanism is provided which changes the shape of the loop of the bonding wire when the wire guide unit moves vertically and transversely.

Abstract: A plastic article having improved surface characteristics comprises a plastic body having adhered thereon a cross-linked film of a composition comprising (A) 10 to 90 parts by weight of a cross-linking unsaturated compound having a molecular weight of M and containing in the molecule N polymerizable ethylenically unsaturated radicals (N being an integer of 2 or more), the ratio of said molecular weight, M, to said number, N, of ethylenically unsaturated radicals (M/N) being about 49 to about 600, (B) 90 to 10 parts by weight of an unsaturated monomer containing in the molecule at least one radical copolymerizable with said component (A) and at least one acid radical, and (C) up to 20 parts by weight of other copolymerizable unsaturated compounds, the total of (A), (B) and (C) being 100 parts by weight, at least a part of the acid radicals contained in the film having been converted into alkali salts thereof, said cross-linked film having a thickness of 5 to 500 .mu..