Patents by Inventor Yasuyuki Yokoe

Yasuyuki Yokoe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140370245
    Abstract: A method for manufacturing a shaped product includes 1) heating at least three prepregs having a thickness of 0.3 mm to 5.0 mm each including reinforcing fibers having an average fiber length of 3 to 100 mm and a thermoplastic resin, 2) arranging those prepregs so as to constitute at least two layers including P layer and Q layer which are in contact with each other, and 3) then pressing those layers to manufacture one shaped product. A prepreg (p1) in the P layer and a prepreg (q1) in the Q layer are arranged such that at least a part thereof overlaps with each other, and two or more prepregs in the same layer are arranged so as not to be in contact with each other.
    Type: Application
    Filed: December 20, 2012
    Publication date: December 18, 2014
    Applicant: Teijin Limited
    Inventors: Yasunori Nagakura, Yasuyuki Yokoe, Yutaka Kondou, Motoomi Arakawa
  • Patent number: 8211537
    Abstract: The present invention discloses a resin composition and a prepreg produced using the resin composition. The resin composition comprises, as essential components: 100 parts by mass of a component (A) which is an epoxy resin; 41 to 80 parts by mass of a component (B) which is thermoplastic resin particles; and 20 to 50 parts by mass (in terms of diaminodiphenylsulfone) of a component (C) which is diaminodiphenylsulfone microencapsulated with a coating agent. The thermoplastic resin particles (B) comprise at least thermoplastic resin particles (B1) having an average particle diameter of 1 to 50 ?m and thermoplastic resin particles (B2) having an average particle diameter of 2 to 100 ?m at a mass ratio of 3:1 to 1:3. The average particle diameter ratio D2/D1 of the average particle diameter D2 of the thermoplastic resin particles (B2) to the average particle diameter D1 of the thermoplastic resin particles (B1) is 2 or more.
    Type: Grant
    Filed: April 11, 2008
    Date of Patent: July 3, 2012
    Assignee: Toho Tenax Co., Ltd.
    Inventors: Yasuyuki Yokoe, Toru Kaneko, Hiroshi Numata, Takeshi Shimada
  • Publication number: 20100183862
    Abstract: The present invention discloses: a resin composition comprising, as essential components, 100 parts by mass of a component (A) which is an epoxy resin, 41 to 80 parts by mass of a component (B) which is thermoplastic resin particles, and 20 to 50 parts by mass (in terms of diaminodiphenylsulfone) of a component (C) which is diaminodiphenylsulfone microencapsulated with a coating agent, in which resin composition the thermoplastic resin particles (B) comprise at least thermoplastic resin particles (B1) having an average particle diameter of 1 to 50 ?m and thermoplastic resin particles (B2) having an average particle diameter of 2 to 100 ?m at a mass ratio of 3:1 to 1:3 and the average particle diameter ratio D2/D1 of the average particle diameter D2 of the thermoplastic resin particles (B2) to the average particle diameter D1 of the thermoplastic resin particles (B1) is 2 or more, and a prepreg produced using the resin composition.
    Type: Application
    Filed: April 11, 2008
    Publication date: July 22, 2010
    Applicant: TOHO TENAX CO., LTD.
    Inventors: Yasuyuki Yokoe, Toru Kaneko, Hiroshi Numata, Takeshi Shimada
  • Publication number: 20090233094
    Abstract: A radiation-curing resin composition that includes a resin component that includes an epoxy resin and/or oxetane resin having a naphthalene structure or a biphenyl structure, a boron-based diaryliodonium salt polymerization initiator represented by a specific formula at 0.005 to 0.5 mol per kg of the resin component, and a viscosity adjusting agent, the resin composition having a viscosity at 50° C. of at least 50 Pa·s, and a prepreg obtained by impregnating a fiber reinforcement with such a resin composition. This resin composition has excellent reactivity, and a prepreg formed from this resin composition and a fiber reinforcement is used for producing a composite material/member suitable for the aerospace field in particular.
    Type: Application
    Filed: September 6, 2006
    Publication date: September 17, 2009
    Applicant: TOHO TENAX CO., LTD.
    Inventor: Yasuyuki Yokoe