Abstract: An arc welding method includes welding a steel sheet while alternately switching feeding of a welding wire between forward feeding and backward feeding. The welding wire contains, in mass % with respect to a total mass to the welding wire, C: more than 0 and 0.30 or less, Si: 0.01 to 0.30, Mn: 0.5 to 2.5, S: 0.001 to 0.020, Ti: 0.05 to 0.30, and optional elements with the remainder being Fe and unavoidable impurities, and a value obtained by 2×[Ti]/[Si]?50×[S] is more than 1.0. The welding is performed by using a shielding gas containing CO2 gas in an amount of 80 vol. % or more with respect to a total volume of the shielding gas at a frequency of 40 Hz or more and 200 Hz or less, where one cycle for determining the frequency is one forward feeding and one backward feeding.

Abstract: An arc welding solid wire includes: a steel material; and a copper plating layer formed on a surface of the steel material, in which an amount of Cu in the steel material and the copper plating layer is 0.05 mass % to 0.30 mass % with respect to a total mass of the wire, a surface of the wire is coated with 0.05 g to 0.20 g of oil with respect to 1 kg of the wire, and on a surface of the copper plating layer, an arithmetic average roughness Rac in a circumferential direction is 0.25 µm to 1.00 µm, and an arithmetic average roughness Ral in a longitudinal direction is 0.07 µm to 0.50 µm.

Abstract: A wire for gas-shielded arc welding includes, based on a total mass of the wire C: 0.01 mass % or more and 0.10 mass % or less, Si: 0.05 mass % or more and 0.55 mass % or less, Mn: 1.60 mass % or more and 2.40 mass % or less, Ti: 0.05 mass % or more and 0.25 mass % or less, Cu: 0.30 mass % or less, Al: 0.10 mass % or less, P: 0.025 mass % or less, and S: 0.010 mass % or less with the remainder being Fe and inevitable impurities. In addition, the following relationship is satisfied: 0.1?[Ti]/[Si]?3.0, where [Si] is the content of Si (mass %) based on the total mass of the wire and [Ti] is the content of Ti (mass %) based on the total mass of the wire.

Abstract: An arc welding method includes performing welding by using a gas and a solid wire. The gas contains Ar. The solid wire includes a steel core wire and a copper plating film formed on a surface of the steel core wire, and the copper plating film has an average grain diameter of 600 nm or less.

Abstract: A wire for gas-shielded arc welding includes, based on a total mass of the wire: C: 0.01 mass % or more and 0.10 mass % or less, Si: 0.05 mass % or more and 0.55 mass % or less, Mn: 1.60 mass % or more and 2.40 mass % or less, Ti: 0.05 mass % or more and 0.25 mass % or less, Cu: 0.01 mass % or more and 0.30 mass % or less, S: 0.001 mass % or more and 0.020 mass % or less, N: 0.0045 mass % or more and 0.0150 mass % or less, Al: 0.10 mass % or less, and P: 0.025 mass % or less, with the remainder being Fe and inevitable impurities. In the wire, the following relationship is satisfied: 0.1?[Ti]/[Si]?3.0, where [Si] is the content of Si (mass %) and [Ti] is the content of Ti (mass %).

Abstract: A wire for gas-shielded arc welding includes, based on a total mass of the wire: C: 0.01 mass % or more and 0.10 mass % or less, Si: 0.05 mass % or more and 0.55 mass % or less, Mn: 1.60 mass % or more and 2.40 mass % or less, Ti: 0.05 mass % or more and 0.25 mass % or less, Cu: 0.01 mass % or more and 0.30 mass % or less, S: 0.001 mass % or more and 0.020 mass % or less, N: 0.0045 mass % or more and 0.0150 mass % or less, Al: 0.10 mass % or less, and P: 0.025 mass % or less, with the remainder being Fe and inevitable impurities. In the wire, the following relationship is satisfied: 0.1?[Ti]/[Si]?3.0, where [Si] is the content of Si (mass %) and [Ti] is the content of Ti (mass %).

Abstract: An arc welding method includes performing welding by using a gas and a solid wire. The gas contains Ar. The solid wire includes a steel core wire and a copper plating film formed on a surface of the steel core wire, and the copper plating film has an average grain diameter of 600 nm or less.

Abstract: A cleaning tape has a base tape made of a synthetic resin and a cleaning layer formed on a surface of this base tape. The cleaning layer has a binding agent and a large number of spherical particles dispersed in the binding agent in a single particle layer. Such a cleaning tape is capable of removing very small unwanted protrusions and particles on the surface of a target object such as a magnetic hard disk without forming scratches.

Abstract: A semiconductor integrated circuit device and a display apparatus each having enhanced electromagnetic immunity realized using a simple configuration are provided. The semiconductor integrated circuit device has a group of registers, an interface circuit, and a timing generation circuit. The signal processing circuit has a signal processing function which is set by setting information stored in the group of registers. The timing generation circuit generates a periodic timing signal and supplies it to the interface circuit. The interface circuit periodically, based on the timing signal, writes setting information inputted from an external terminal to the group of registers.

Abstract: A cleaning tape has a base tape made of a synthetic resin and a cleaning layer formed on a surface of this base tape. The cleaning layer has a binding agent and a large number of spherical particles dispersed in the binding agent in a single particle layer. Such a cleaning tape is capable of removing very small unwanted protrusions and particles on the surface of a target object such as a magnetic hard disk without forming scratches.

Abstract: A method for efficient production of a welding solid wire free of copper plating. The method consists of drawing by means of roller dies with the help of a dry solid lubricant for drawing which is at least either of sodium stearate or potassium stearate, removing the lubricant from the wire surface by means of a washing device, and applying a lubricant for wire feeding to the surface of the drawn wire by means of an oiling device. High-speed drawing by means of roller dies makes a stock wire into a welding solid wire having the diameter of the finished wire or nearly finished wire. The drawing step is followed by the washing step and the lubricant applying step, which are all accomplished in-line.

Abstract: Polishing slurry is caused to be present between a surface of a soft magnetic layer and a polishing tool such as a polishing pad and the surface of the soft magnetic layer and the polishing tool are moved relative to each other. The polishing slurry contains silica particles as abrading particles, compounds containing carboxylic acid and amino polycarboxylic acid and an oxidizing agent as a polishing accelerator, organic and/or inorganic compound of phosphoric acid, nitride and/or nitrite as an anti-corrosion agent and a pH conditioner such that the slurry has pH value between 4 and 11.

Abstract: Texturing marks are formed on the surface of a substrate of a magnetic hard disk first by forming approximately concentric circular preliminary marks in a first step and then forming in a second step approximately concentric circular texturing marks on the surface of the substrate based on the preliminary marks formed in the first step. The surface after the texturing marks are formed in the second step has average surface roughness in the range of 1 ? or more and 6 ? or less and a ratio of maximum surface roughness to the average surface roughness in the range of less than 10. A foamed tape and a lubricant not containing any abrading particles are used in the second step.

Abstract: A perpendicular magnetic recording disk is produced by polishing to make smoother both surfaces of a substrate and sequentially forming a soft magnetic layer, a perpendicular recording layer and a protective layer on each of the polished surfaces of the substrate. The surfaces of the soft magnetic layers are polished by a fixed particle polishing method to be made smoother, and the perpendicular recording layers is formed on the smoothed surfaces of the soft magnetic layers either directly or with an intermediate layer in between.

Abstract: A method for efficient production of a welding solid wire free of copper plating. The method consists of drawing by means of roller dies with the help of a dry solid lubricant for drawing which is at least either of sodium stearate or potassium stearate, removing the lubricant from the wire surface by means of a washing device, and applying a lubricant for wire feeding to the surface of the drawn wire by means of an oiling device. High-speed drawing by means of roller dies makes a stock wire into a welding solid wire having the diameter of the finished wire or nearly finished wire. The drawing step is followed by the washing step and the lubricant applying step, which are all accomplished in-line.

Abstract: A plating-free solid wire for arc welding has pits opening on its circumference, and wider inside than at each opening, and/or pits having a portion non-irradiated with an externally incoming light. A sulfide and a polyisobutene-containing oil are present in the pits and/or on the wire surface, the latter being present in an amount of 0.1-2 g/10 kg of wire. Twenty or more pits are present in total per and along wire circumference. The effective pit length ratio is 0.5% inclusive-50% exclusive. 0.1-2 g of the oil is present per 10 kg of wire. 0.01-0.5 g/10 kg of 0.1-10-&mgr;m-particle-dia MoS2 is present in “bottleneck-like and/or cave-like pits”, on the wire surface or immediately under the wire surface. A 2-10 mass ppm/total wire mass of K compound in K is present in the pits and/or on the wire surface. These ensure good feedability and lubricating properties, and less spatters.

Abstract: A plating-free solid wire for arc welding has pits opening on its circumference, and wider inside than at each opening, and/or pits having a portion non-irradiated with an externally incoming light. A sulfide and a polyisobutene-containing oil are present in the pits and/or on the wire surface, the latter being present in an amount of 0.1-2 g/10 kg of wire. Twenty or more pits are present in total per and along wire circumference. The effective pit length ratio is 0.5% inclusive-50% exclusive. 0.1-2 g of the oil is present per 10 kg of wire. 0.01-0.5 g/10 kg of 0.1-10-&mgr;m-particle-dia MoS2 is present in “bottleneck-like and/or cave-like pits”, on the wire surface or immediately under the wire surface. A 2-10 mass ppm/total wire mass of K compound in K is present in the pits and/or on the wire surface. These ensure good feedability and lubricating properties, and less spatters.