Abstract: To provide a heat-resistant resin composition which has excellent heat resistance, does not show a reduced mechanical strength such as flexural strength even after being passed rough a reflow furnace and heat-treated under high temperature conditions, and also has an excellent flame retardancy; a production method of the heat-resistant resin composition; a heat-resistant resin-molded article; and a surface mount electronic component. The heat-resistant resin composition includes a polyarylene sulfide resin (A) and an aromatic polyamide (B) having terephthalic acid amide as an essential structural unit at a former/latter ratio of 70/30 to 95/5 by mass. In a molded article composed of the heat-resistant resin composition, the average diameter of holes formed by etching a broken-out section of the molded article with an organic solvent is 0.1 to 1.0 ?m, where the broken-out section is observed on a scanning electron microscope (2,500 times).

Abstract: What is offered is: a polyarylene sulfide resin composition which includes 100 mass parts of a polyarylene sulfide resin (A), 0.1 to 8 mass parts of a metal fine particle (B) containing at least one metal species selected from the group consisting of copper, nickel, and zinc, and 0.1 to 5 mass parts of a thermoplastic elastomer (C); and a piping member for fluid obtained by molding of the pertinent resin composition. This piping member for fluid is useful for water-supply pipes, water-heater pipes, and the like in cold weather climates, as it is high in toughness at low-temperature, inhibits damage or rupture of pipes due to freezing, and also inhibits occurrence of creep deformation at high temperature.

Abstract: The present invention relates to a polyarylene sulfide resin composition, which comprises polyarylene sulfide (A) and polyamide (B) as essential components, and further includes an organic phosphorus compound (C), which is selected from the group consisting of an aromatic phosphite compound and an aromatic phosphonate compound, and an inorganic phosphorus compound (D), which is selected from the group consisting from a metal salt of phosphorous acid and a metal salt of hypophosphoric acid as essential components, in addition to the polyarylene sulfide (A) and the polyamide (B); a manufacturing method thereof; and a surface mount electronic component. The polyarylene sulfide resin composition has excellent heat resistance, does not decrease mechanical properties such as bending strength even if heating treatment is performed under the high temperature condition by passing through a reflow furnace, and has excellent flame retardance.

Abstract: The present invention relates to a polyarylene sulfide resin composition, which comprises polyarylene sulfide (A) and polyamide (B) as essential components, and further includes an organic phosphorus compound (C), which is selected from the group consisting of an aromatic phosfite compound and an aromatic phosphonaite compound, and an inorganic phosphorus compound (D), which is selected from the group consisting from a metal salt of phosphorous acid and a metal salt of hypophosphoric acid as essential components, in addition to the polyarylene sulfide (A) and the polyamide (B); a manufacturing method thereof; and a surface mount electronic component. The polyarylene sulfide resin composition has excellent heat resistance, does not decrease mechanical properties such as bending strength even if heating treatment is performed under the high temperature condition by passing through a reflow furnace, and has excellent flame retardance.

Abstract: To provide a heat-resistant resin composition which has excellent heat resistance, does not show a reduced mechanical strength such as flexural strength even after being passed rough a reflow furnace and heat-treated under high temperature conditions, and also has an excellent flame retardancy; a production method of the heat-resistant resin composition; a heat-resistant resin-molded article; and a surface mount electronic component. The heat-resistant resin composition includes a polyarylene sulfide resin (A) and an aromatic polyamide (B) having terephthalic acid amide as an essential structural unit at a former/latter ratio of 70/30 to 95/5 by mass. In a molded article composed of the heat-resistant resin composition, the average diameter of holes formed by etching a broken-out section of the molded article with an organic solvent is 0.1 to 1.0 ?m, where the broken-out section is observed on a scanning electron microscope (2,500 times).