Patents by Inventor Yat-Kiu-Kent Fung

Yat-Kiu-Kent Fung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroplating of niobium titanium
    Patent number: 11938554
    Abstract: A structure, such as a cable assembly, is provided that has a Nb/Ti substrate and a metal layer electroplated on a portion of the Nb/Ti substrate, wherein the metal layer has a metal capable of being soldered to, such as copper, and a metal coaxial connector soldered to the metal layer.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: March 26, 2024
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Danielle DeGraw, Yat-Kiu-Kent Fung, James Robert Rozen
  • ELECTROPLATING OF NIOBIUM TITANIUM
    Publication number: 20210296749
    Abstract: The subject disclosure relates to electroplating niobium titanium (Nb/Ti) with a metal capable of being soldered to. According to an embodiment, a structure is provided that comprises a Nb/Ti substrate and a metal layer plated on a portion of the Nb/Ti substrate. The metal layer comprises an electroplated metal layer plated on the portion of the Nb/Ti substrate using electroplating. The metal layer can comprise a metal capable of being soldered to, such as copper. In another embodiment, a cable assembly is provided that comprises a niobium titanium wire, a metal layer plated on a first portion of the niobium titanium wire, and a metal coaxial connector soldered to the metal layer.
    Type: Application
    Filed: June 9, 2021
    Publication date: September 23, 2021
    Inventors: Danielle DeGraw, Yat-Kiu-Kent Fung, James Robert Rozen
  • Electroplating of niobium titanium
    Patent number: 11075435
    Abstract: The subject disclosure relates to electroplating niobium titanium (Nb/Ti) with a metal capable of being soldered to. According to an embodiment, a structure is provided that comprises a Nb/Ti substrate and a metal layer plated on a portion of the Nb/Ti substrate. The metal layer comprises an electroplated metal layer plated on the portion of the Nb/Ti substrate using electroplating. The metal layer can comprise a metal capable of being soldered to, such as copper. In another embodiment, a cable assembly is provided that comprises a niobium titanium wire, a metal layer plated on a first portion of the niobium titanium wire, and a metal coaxial connector soldered to the metal layer.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: July 27, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Danielle DeGraw, Yat-Kiu-Kent Fung, James Robert Rozen
  • ELECTROPLATING OF NIOBIUM TITANIUM
    Publication number: 20200136223
    Abstract: The subject disclosure relates to electroplating niobium titanium (Nb/Ti) with a metal capable of being soldered to. According to an embodiment, a structure is provided that comprises a Nb/Ti substrate and a metal layer plated on a portion of the Nb/Ti substrate. The metal layer comprises an electroplated metal layer plated on the portion of the Nb/Ti substrate using electroplating. The metal layer can comprise a metal capable of being soldered to, such as copper. In another embodiment, a cable assembly is provided that comprises a niobium titanium wire, a metal layer plated on a first portion of the niobium titanium wire, and a metal coaxial connector soldered to the metal layer.
    Type: Application
    Filed: October 25, 2018
    Publication date: April 30, 2020
    Inventors: Danielle DeGraw, Yat-Kiu-Kent Fung, James Robert Rozen