Patents by Inventor Yat Siew Han

Yat Siew Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220007516
    Abstract: A method of fabricating at least one electronic circuit component comprises: patterning a conductive material on a fibrous substrate by aerosol jet printing in a pattern corresponding to said at least one electronic circuit component; and sintering the conductive material by hot air sintering. The fibrous substrate may be paper, for example cellulose fibre paper.
    Type: Application
    Filed: April 21, 2021
    Publication date: January 6, 2022
    Applicant: Singapore University of Technology and Design
    Inventors: Shaoying Huang, Yidan Chen, Yat Siew Han