Patents by Inventor Yating WAN

Yating WAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • USE OF BACTERIA IN CHILDREN DEVELOPMENT ASSESSMENT AND TREATMENT
    Publication number: 20230226123
    Abstract: Provided are methods for treating symptoms of autism spectrum disorder (ASD) in a human child. Methods for determining risk for A SD in human children, methods for assessing developmental age of children and for treating children in need thereof, kits and compositions for use in these methods are also provided.
    Type: Application
    Filed: June 15, 2021
    Publication date: July 20, 2023
    Inventors: Siew Chien NG, Ka Leung Francis CHAN, Zhilu XU, Yating WAN
  • Monolithic integrated quantum dot photonic integrated circuits
    Patent number: 11693178
    Abstract: A photonic integrated circuit (PIC) includes a semiconductor substrate, one or more passive components, and one or more active components. The one or more passive components are fabricated on the semiconductor substrate, wherein the passive components are fabricated in a III-V type semiconductor layer. The one or more active components are fabricated on top of the one or more passive components, wherein optical signals are communicated between the one or more active components via the one or more passive components.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: July 4, 2023
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: John E. Bowers, Arthur Gossard, Daehwan Jung, Justin Norman, Chen Shang, Yating Wan
  • MONOLITHIC INTEGRATED QUANTUM DOT PHOTONIC INTEGRATED CIRCUITS
    Publication number: 20220390669
    Abstract: A photonic integrated circuit (PIC) includes a semiconductor substrate, one or more passive components, and one or more active components. The one or more passive components are fabricated on the semiconductor substrate, wherein the passive components are fabricated in a III-V type semiconductor layer. The one or more active components are fabricated on top of the one or more passive components, wherein optical signals are communicated between the one or more active components via the one or more passive components.
    Type: Application
    Filed: August 8, 2022
    Publication date: December 8, 2022
    Inventors: John E. BOWERS, Arthur GOSSARD, Daehwan JUNG, Justin NORMAN, Chen SHANG, Yating WAN
  • Monolithic integrated quantum dot photonic integrated circuits
    Patent number: 11435524
    Abstract: A photonic integrated circuit (PIC) includes a semiconductor substrate, one or more passive components, and one or more active components. The one or more passive components are fabricated on the semiconductor substrate, wherein the passive components are fabricated in a III-V type semiconductor layer. The one or more active components are fabricated on top of the one or more passive components, wherein optical signals are communicated between the one or more active components via the one or more passive components.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: September 6, 2022
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: John E. Bowers, Arthur Gossard, Daehwan Jung, Justin Norman, Chen Shang, Yating Wan
  • MONOLITHIC INTEGRATED QUANTUM DOT PHOTONIC INTEGRATED CIRCUITS
    Publication number: 20210208336
    Abstract: A photonic integrated circuit (PIC) includes a semiconductor substrate, one or more passive components, and one or more active components. The one or more passive components are fabricated on the semiconductor substrate, wherein the passive components are fabricated in a III-V type semiconductor layer. The one or more active components are fabricated on top of the one or more passive components, wherein optical signals are communicated between the one or more active components via the one or more passive components.
    Type: Application
    Filed: May 24, 2019
    Publication date: July 8, 2021
    Inventors: John E. BOWERS, Arthur GOSSARD, Daehwan JUNG, Justin NORMAN, Chen SHANG, Yating WAN