Abstract: A reflow furnace (1) has a decompression chamber (5), and air bubbles contained in a molten solder on a substrate (7) are removed in this decompression chamber (5). The substrate (7) supported on a first conveying rail (8) is fed into the decompression chamber (5) by a first conveyance rod (18). The substrate (7) in the decompression chamber (5) is taken out by a second conveyance rod (32) and is conveyed to the exit of the reflow furnace (1) while being supported on the second conveying rail (9). Before the treatment of substrates (7) having different widths, the width of the first conveying rail (8) and the width of the second conveying rail (9) are adjusted. During this adjustment, the second conveyance rod (32) is displaced in the width direction of the substrate (7), with the second conveyance rod (32) kept in the decompression chamber (5), and in association with this, the spacing between right and left rail portions (12a, 12a) in the decompression chamber (5) is adjusted.

Abstract: A conveyor apparatus which allows a workpiece to be carried in and out of a desired process and lends itself to easy maintenance as well is provided. A conveyor apparatus (13) includes a first conveyance mechanism (13A) capable of carrying a board (7) into a desired process and a second conveyance mechanism (13B) capable of carrying the board (7) out of the desired process.

Abstract: The apparatus of the present application reduces poor soldering having gas left there at when soldering. in a reflow soldering apparatus for soldering electronic components mounted on a board by heated atmospheric gas while transferring the printed circuit board with the electronic components within preheating chambers and reflow chambers. Reflow chamber in order within a furnace, a pressure reducing chamber capable of reducing a pressure of the atmospheric gas is installed in the reflow chamber where the heated atmospheric gas circulates in the chamber, and gas involved in a heated and melted soldering part on the printed circuit board is removed at the pressure reducing chamber.

Abstract: A conveyor apparatus includes a pusher piece (19) fixed to a conveying rod (18) adapted to reciprocate along a board conveyance path, and a switching mechanism adapted to switch the pushing piece, by turning the conveying rod a predetermined angle, between an engaged position where the pusher piece (19) engages with a rear end face of a board (7) and a retracted position where the pusher piece (19) does not interfere with the board (7). The switching mechanism includes a guide member (23) provided with a guide hole (24) adapted to guide a guide rod (22). The guide hole (24) is made up of first and second guide holes (25 and 26) configured to extend in parallel to each other in a conveyance direction and slanted coupling guide holes (27, 27) adapted to couple ends of the first and second guide holes (25 and 26). When the conveying rod (18) reciprocates, the guide rod (22) makes a round of the closed-loop guide hole (24).

Abstract: A reflow furnace (1) has a decompression chamber (5), and air bubbles contained in a molten solder on a substrate (7) are removed in this decompression chamber (5). The substrate (7) supported on a first conveying rail (8) is fed into the decompression chamber (5) by a first conveyance rod (18). The substrate (7) in the decompression chamber (5) is taken out by a second conveyance rod (32) and is conveyed to the exit of the reflow furnace (1) while being supported on the second conveying rail (9). Before the treatment of substrates (7) having different widths, the width of the first conveying rail (8) and the width of the second conveying rail (9) are adjusted. During this adjustment, the second conveyance rod (32) is displaced in the width direction of the substrate (7), with the second conveyance rod (32) kept in the decompression chamber (5), and in association with this, the spacing between right and left rail portions (12a, 12a) in the decompression chamber (5) is adjusted.

Abstract: A conveyor apparatus includes a pusher piece (19) fixed to a conveying rod (18) adapted to reciprocate along a board conveyance path, and a switching mechanism adapted to switch the pushing piece, by turning the conveying rod a predetermined angle, between an engaged position where the pusher piece (19) engages with a rear end face of a board (7) and a retracted position where the pusher piece (19) does not interfere with the board (7). The switching mechanism includes a guide member (23) provided with a guide hole (24) adapted to guide a guide rod (22). The guide hole (24) is made up of first and second guide holes (25 and 26) configured to extend in parallel to each other in a conveyance direction and slanted coupling guide holes (27, 27) adapted to couple ends of the first and second guide holes (25 and 26). When the conveying rod (18) reciprocates, the guide rod (22) makes a round of the closed-loop guide hole (24).

Abstract: A conveyor apparatus which allows a workpiece to be carried in and out of a desired process and lends itself to easy maintenance as well is provided. A conveyor apparatus (13) includes a first conveyance mechanism (13A) capable of carrying a board (7) into a desired process and a second conveyance mechanism (13B) capable of carrying the board (7) out of the desired process.

Abstract: The apparatus of the present application reduces poor soldering having gas loft there at when soldering. In a reflow soldering apparatus for soldering electronic components mounted on a board by heated atmospheric gas while transferring the printed circuit board with the electronic components within preheating chambers and reflow chambers. Reflow chamber in order within a furnace, a pressure reducing chamber capable of reducing a pressure of the atmospheric gas is installed in the reflow chamber where the heated atmospheric gas circulates in the chamber, and gas involved in a heated and melted soldering part on the printed circuit board is removed at the pressure reducing chamber.

Abstract: In a reflow soldering apparatus comprising a conveyor 4 to transport circuit boards 5 mounted with electronic components into multiple chambers 1, 2 and 3, and fans 6 installed in the chambers 1, 2 and 3, the centers of the impellers in the adjacent fans 6 are not on a single perpendicular plane along the transport line of the conveyor and arrayed offset to the left and right. This apparatus may also employ a structure wherein the centers of the impellers in the adjacent fans are not on a single horizontal plane and arrayed offset up and down. Further, it may also employ a structure wherein the fans are arranged with their rotation shafts inclined.

Abstract: A reflow soldering apparatus using circulated heated gas to solder electronic components to a printed circuit board while transporting the printed circuit board mounted with electronic components on a conveyor chain. A plurality of gas passages for inflow of heated gas which have openings facing the circuit board, are provided at intervals in the transport direction of the conveyor chain. A first passage is provided for the flow of heated gas into the fan from an opening different from the opening for inflow and formed in the intermediate portion of the gas passage, and a second passage is provided for the flow of heated gas into the fan from openings formed on both ends of the gas passage.

Abstract: An apparatus for heating a printed circuit board includes a conveyor (2) to transport a printed circuit board (1), and a heating chamber (3) through which the printed circuit board on the conveyor passes. The surrounding wall (9) of the heating chamber has vacuum layers (12) (13) for heat insulation, and a reinforcing rib (19) is fastened to the surrounding wall. A member for preventing collapse of the surrounding wall is inserted and secured in the vacuum layer in the surrounding wall. The member includes a stainless steel channel member (17) and a heat insulating plate (18) with a rectangular cross section. White cotton used as a member (20) for intercepting radiant heat is installed within the vacuum layer in the surrounding wall, and a radiant heat reflective layer (22) of aluminum foil, etc. is installed on the surface of the surrounding wall facing the heating chamber.

Abstract: A reflow soldering apparatus uses circulated heated gas to solder electronic components to a printed circuit board while transporting the printed circuit board mounted with electronic components on a conveyor chain. A plurality of gas passages for inflow of heated gas which have openings facing the circuit board, are provided at intervals in the transport direction of the conveyor chain. A first passage is provided for the flow of heated gas into the fan from an opening different from the opening for inflow and formed in the intermediate portion of the gas passage, and a second passage is provided for the flow of heated gas into the fan from openings formed on both ends of the gas passage.

Abstract: A transport mechanism for printed circuit boards is comprised of two endless drive members, movable carriers installed between these two drive members and one pair of parallel guide rails to support the carriers while moving in a horizontal state. The drive members extend diagonally between horizontal upper and lower runs on both ends of the mechanism. The carriers are installed at fixed intervals along the length of the drive members. The carriers are also provided with a roller member on both sides of the carrier to run on the upper part of the guide rail. The guide rail is further installed diagonally along the diagonal portion of the drive members at fixed intervals in order to support the carrier horizontally while in a diagonal state of movement.

Abstract: A reflow soldering method and the apparatus thereof is described for soldering a base board having electronic elements located thereon by an inert gas circulated through heater means in a plurality of chambers while the base board is transported through all the chambers, the inert gas being circulated by ventilating means driven by drive means, the method and the apparatus thereof comprising a shield case for enclosing at least the chambers, the ventilating means and the drive means to shut off the same from an outer air and refrigerating means for cooling down the inert gas in the shield case.

Abstract: A reflow soldering method and the apparatus thereof is disclosed, wherein an air flowing fan is provided at the bottom of the apparatus, that is, below a work transporting conveyor so as to produce a minus pressure to draw or pull air into the apparatus in a manner that the drawn air may flow in a constant volume and at a constant speed from up to down through a predetermined path and flow down through a heater provided in the path to be heated up substantially to a set temperature of the heater. The heated air further flows down to contact a work such as a base board having electronic parts mounted thereon and transported by the conveyor and heat up the work.