Patents by Inventor Yau Kin Hon

Yau Kin Hon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190092104
    Abstract: A system in a device includes an electronic module configured to perform a function associated with the device, a power generation apparatus for generating electrical energy in response to motion of the device, and a switch element interposed between the electronic module and the power generation device. The switch element switches from a first state to a second state when the power generation apparatus generates the electrical energy. The electronic module is in a powered-off mode in which a power storage device is disconnected from the electronic module whenever the switch element is in the first state. The electronic module is switched to a powered-on mode in which the power storage device is in electrically connected to the electronic module whenever the switch element is in the second state.
    Type: Application
    Filed: September 27, 2017
    Publication date: March 28, 2019
    Inventors: Firoz Ahmed, Yau Kin Hon, Lianjun Liu, Raghavendra N. Sridhar
  • Patent number: 9116165
    Abstract: A microelectromechanical system (MEMS) package is disclosed herein. The MEMS package includes a movable mass. The MEMS package further includes a first and second sense electrodes spaced apart from the movable mass. The first and second sense electrodes are configured to be electrically coupled with a controller. The MEMS package further includes a first test electrode and a second test electrode spaced apart from the movable mass. The first and the second test electrodes are configured to be electrically connected to first and second external electrical connectors, respectively. The first and second test electrodes are biased at a first voltage and a second voltage, respectively, when the first and second external electrical connectors are connected to external voltage sources.
    Type: Grant
    Filed: March 27, 2012
    Date of Patent: August 25, 2015
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Mark E. Schlarmann, Yau Kin Hon, Eric W. Tisinger
  • Publication number: 20130257445
    Abstract: A microelectromechanical system (MEMS) package is disclosed herein. The MEMS package includes a movable mass. The MEMS package further includes a first and second sense electrodes spaced apart from the movable mass. The first and second sense electrodes are configured to be electrically coupled with a controller. The MEMS package further includes a first test electrode and a second test electrode spaced apart from the movable mass. The first and the second test electrodes are configured to be electrically connected to first and second external electrical connectors, respectively. The first and second test electrodes are biased at a first voltage and a second voltage, respectively, when the first and second external electrical connectors are connected to external voltage sources.
    Type: Application
    Filed: March 27, 2012
    Publication date: October 3, 2013
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Mark E. Schlarmann, Yau Kin Hon, Eric W. Tisinger