Abstract: A substrate having multiple metal layers is disclosed. The substrate includes a plurality of metal layers disposed in different levels. The plurality of metal layers includes a lower metal layer, a middle metal layer situated overlying the lower layer, and an upper metal layer situated overlying the middle metal layer. A solder mask covers the upper metal layer. A reference plane is arranged in the lower metal layer. A trio of signal traces is arranged in the middle metal layer. The trio of signal traces comprises at least a pair of differential signal traces. A plurality of reference nets is arranged in the middle metal layer.

Abstract: The present invention provides a USB interface circuit comprising a USB transceiver and at least two USB controllers of different protocol types; wherein at least one USB transceiver is selectively coupled to at least two USB controllers and is controlled by only one of the at least two USB controllers at the same time. The invention also provides a USB device.

Abstract: A substrate having multiple metal layers is disclosed. The substrate includes a plurality of metal layers disposed in different levels. The plurality of metal layers includes a lower metal layer, a middle metal layer situated overlying the lower layer, and an upper metal layer situated overlying the middle metal layer. A solder mask covers the upper metal layer. A reference plane is arranged in the lower metal layer. A trio of signal traces is arranged in the middle metal layer. The trio of signal traces comprises at least a pair of differential signal traces. A plurality of reference nets is arranged in the middle metal layer.

Abstract: A printed circuit board (PCB) assembly includes a PCB having a core substrate, a plurality of conductive traces on a first surface of the PCB, and a ground layer on the second surface of the PCB. The conductive traces comprise a pair of differential signal traces. An intervening reference trace is disposed between the differential signal traces. A connector is disposed at one end of the plurality of conductive traces. A semiconductor package is mounted on the first surface at the other end of the plurality of conductive traces.

Abstract: A printed circuit board (PCB) assembly includes a PCB having a core substrate, a plurality of conductive traces on a first surface of the PCB, and a ground layer on the second surface of the PCB. The conductive traces comprise a pair of differential signal traces. An intervening reference trace is disposed between the differential signal traces. A connector is disposed at one end of the plurality of conductive traces. A semiconductor package is mounted on the first surface at the other end of the plurality of conductive traces.

Abstract: A printed circuit board (PCB) assembly includes a PCB having a core substrate, a plurality of conductive traces on a first surface of the PCB, and a ground layer on the second surface of the PCB. The conductive traces comprise a pair of differential signal traces. An intervening reference trace is disposed between the differential signal traces. A connector is disposed at one end of the plurality of conductive traces. A semiconductor package is mounted on the first surface at the other end of the plurality of conductive traces.

Abstract: A printed circuit board (PCB) assembly includes a PCB having a core substrate, a plurality of conductive traces on a first surface of the PCB, and a ground layer on the second surface of the PCB. The conductive traces comprise a pair of differential signal traces. An intervening reference trace is disposed between the differential signal traces. A connector is disposed at one end of the plurality of conductive traces. A semiconductor package is mounted on the first surface at the other end of the plurality of conductive traces.

Abstract: A signal processing system and related method are disclosed. The signal processing system includes a signal processing module, powered by a low supply voltage, for processing signals; and an interface module, coupled to the signal processing module, powered by a high supply voltage, for outputting signals generated from the signal processing module; wherein the interface module comprises a plurality of high-voltage functional blocks integrated therein, and each of the functional blocks is configured to perform a predetermined interface functionality. In this way, the bill-of-material (BOM) cost can be reduced.

Abstract: An apparatus and a muting circuit. The apparatus comprises an amplifier, a mute circuit, a pull-down circuit, and a power detection circuit. The amplifier receives a power supply voltage and a common mode voltage, and amplifies an audio input signal to generate an audio output signal. The mute circuit, coupled to the amplifier, conducts the audio output signal to about ground level upon receiving a mute signal. The pull-down circuit, coupled to the amplifier, pulls the common mode voltage to about ground level upon receiving a pull-down signal. The power detection circuit, coupled to the mute circuit and the pull-down circuit, detects power-up or power-down of the power supply voltage, and generates the mute signal and a pull-down signal according to the power-up or power-down operation.

Abstract: A semiconductor package includes a die pad; a semiconductor die mounted on the die pad; a plurality of leads in a first horizontal plane disposed along peripheral edges of the die pad; a ground bar downset from the first horizontal plane to a second horizontal plane between the leads and the die pad; a plurality of downset tie bars connecting the ground bar with the die pad; a plurality of ground wires bonding to both of the ground bar and the die pad; and a molding compound at least partially encapsulating the die pad, inner ends of the leads such that bottom surface of the die pad is exposed within the molding compound.

Abstract: A semiconductor package includes a die pad; a semiconductor die mounted on the die pad; a plurality of leads in a first horizontal plane disposed along peripheral edges of the die pad; a ground bar downset from the first horizontal plane to a second horizontal plane between the leads and the die pad; a plurality of downset tie bars connecting the ground bar with the die pad; a plurality of ground wires bonding to both of the ground bar and the die pad; and a molding compound at least partially encapsulating the die pad, inner ends of the leads such that bottom surface of the die pad is exposed within the molding compound.

Abstract: A semiconductor package includes a die pad; a semiconductor die mounted on the die pad; a plurality of leads in a first horizontal plane disposed along peripheral edges of the die pad; a ground bar downset from the first horizontal plane to a second horizontal plane between the leads and the die pad; a plurality of downset tie bars connecting the ground bar with the die pad; a plurality of ground wires bonding to both of the ground bar and the die pad; and a molding compound at least partially encapsulating the die pad, inner ends of the leads such that bottom surface of the die pad is exposed within the molding compound.

Abstract: A signal processing system and related method are disclosed. The signal processing system includes a signal processing module, powered by a low supply voltage, for processing signals; and an interface module, coupled to the signal processing module, powered by a high supply voltage, for outputting signals generated from the signal processing module; wherein the interface module comprises a plurality of high-voltage functional blocks integrated therein, and each of the functional blocks is configured to perform a predetermined interface functionality. In this way, the bill-of-material (BOM) cost can be reduced.

Abstract: An apparatus and a muting circuit. The apparatus comprises an amplifier, a mute circuit, a pull-down circuit, and a power detection circuit. The amplifier receives a power supply voltage and a common mode voltage, and amplifies an audio input signal to generate an audio output signal. The mute circuit, coupled to the amplifier, conducts the audio output signal to about ground level upon receiving a mute signal. The pull-down circuit, coupled to the amplifier, pulls the common mode voltage to about ground level upon receiving a pull-down signal. The power detection circuit, coupled to the mute circuit and the pull-down circuit, detects power-up or power-down of the power supply voltage, and generates the mute signal and a pull-down signal according to the power-up or power-down operation.