Patents by Inventor Yauso Miyamoto

Yauso Miyamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroconductive adhesive comprising an epoxy novolak resin and phenol-aralkyl resin
    Patent number: 5183592
    Abstract: An electroconductive adhesive comprising an epoxy-novolak resin, a phenol-aralkyl resin, a glycidyl group-containing silane coupling agent, an organic borate and an electro-conductive metal power is excellent in reliability in moisture and hydrolytic resistance and useful for semiconductor devices.
    Type: Grant
    Filed: January 9, 1991
    Date of Patent: February 2, 1993
    Assignee: Hitachi Chemical Company Ltd.
    Inventors: Nobuo Ichimura, Yauso Miyamoto, Mitsuo Yamazaki