Patents by Inventor Yaw-Yeu Guan

Yaw-Yeu Guan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COB package type bi-directional transceiver module
    Patent number: 7103238
    Abstract: A COB (Chip On Board) package type bi-directional transceiver module is disclosed to include a photosensitive member bonded to a printed circuit board by COB (Chip On Board) package and adapted for receiving a first optical signal, and a light source installed by TO-can package and adapted for transmitting a second optical signal.
    Type: Grant
    Filed: May 14, 2004
    Date of Patent: September 5, 2006
    Assignee: Radiantech, Inc.
    Inventors: Hauen Chyun Shyu, Yaw-Yeu Guan
  • COB package type bi-directional transceiver module
    Publication number: 20050036730
    Abstract: A COB (Chip On Board) package type bi-directional transceiver module is disclosed to include a photosensitive member bonded to a printed circuit board by COB (Chip On Board) package and adapted for receiving a first optical signal, and a light source installed by TO-can package and adapted for transmitting a second optical signal.
    Type: Application
    Filed: May 14, 2004
    Publication date: February 17, 2005
    Applicant: RADIANTECH, INC.
    Inventors: H. Shyu, Yaw-Yeu Guan