Abstract: The present application provides a fingerprint sensor. The fingerprint sensor includes an array of a plurality of optical fibers. Each of the plurality of optical fibers has a first end and second end opposite to the first end. Each of the plurality of optical fibers is configured to allow an incident light to enter into the second end and an exit light to exit from the second end. Each of the plurality of optical fibers includes a fiber core; a fiber Bragg grating in the fiber core; and a reflective film on the first end.

Abstract: A heat dissipation structure includes a housing configured to accommodate a heating element of an unmanned aerial vehicle (UAV). The housing includes a first air vent and a second air vent. The first air vent is configured to guide an airflow into the housing. The airflow includes a propeller-generated airflow generated by a propeller of the UAV during rotation. A side projection of the first air vent on a side of the housing at least partially overlaps a side projection of the propeller on the side of the housing. The second air vent is configured to guide the airflow out of the housing.

Abstract: The present application provides a fingerprint sensor. The fingerprint sensor includes an array of a plurality of optical fibers. Each of the plurality of optical fibers has a first end and second end opposite to the first end. Each of the plurality of optical fibers is configured to allow an incident light to enter into the second end and an exit light to exit from the second end. Each of the plurality of optical fibers includes a fiber core; a fiber Bragg grating in the fiber core; and a reflective film on the first end.

Abstract: A method for manufacturing a micro light-emitting diode array substrate is disclosed. The method includes: providing a drive substrate comprising a plurality of sub-pixel regions, the plurality of sub-pixel regions being configured for bearing micro light-emitting diodes of different colors, and epitaxial layers of the micro light-emitting diodes of different colors having different thicknesses; providing a base substrate, forming a plurality of micro light-emitting diodes on the base substrate, and transferring micro light-emitting diodes of same color on the base substrate as a whole onto the drive substrate; repeating the transferring process in a sequence that the thicknesses of the epitaxial layers of the micro light-emitting diodes gradually increase, until each sub-pixel region in pixel units is provided with one of the micro light-emitting diodes having same color as the each sub-pixel region.

Abstract: A rotational speed sensor, a manufacturing method thereof, a driving method thereof, and an electronic device are provided. The rotational speed sensor includes liquid crystal cell, rotational speed sensing module and rotational speed determining module; rotational speed sensing module is configured to convert rotational speed into voltage signal and apply voltage signal to liquid crystal cell; and at least a part of optical signal propagation module of rotational speed determining module is located in liquid crystal cell.

Abstract: A heat dissipation structure includes a housing configured to receive a heat generating device. The housing includes a first air inlet, a first air outlet, and an alloy heat dissipation device disposed in the housing and including heat dissipation fins disposed in parallel. A heat dissipation air channel is formed between two adjacent heat dissipation fins. The heat dissipation air channel includes a second air inlet and a second air outlet, the second air outlet being connected with the first air outlet. The heat dissipation structure further includes a heat dissipation fan configured to provide a heat dissipation air flow to an inside space of the housing. The heat dissipation fan is disposed inside the housing, and includes a third air inlet and a third air outlet. The third air inlet is connected with the first air inlet and the third air outlet is connected with the second air inlet.

Abstract: The disclosure relates to the field of display technologies, and discloses a display module, and a method for fabricating the same, and the display module includes a display panel, a backlight module, and a flexible printed circuit, wherein the flexible printed circuit is electrically connected with the display panel, the backlight module includes a light source, and the light source is fixed on a side of the flexible printed circuit facing the display panel, and electrically connected with the flexible printed circuit.

Abstract: This disclosure discloses a light-emitting diode chip, a method for fabricating the same, a backlight module, and a display device. The light-emitting diode chip includes: a transparent base substrate; at least one light-emitting diode located on one side of the base substrate; and a dimming structure located on a side of the base substrate away from the light-emitting diode, wherein the light-emitting diode is configured to emit light from double sides thereof; and the dimming structure is configured to adjust the intensity of light emitted from the side of the base substrate away from the light-emitting diode.

Abstract: The disclosure discloses an acceleration sensor, where the acceleration sensor comprises: a housing, and a mass block in the housing and connected with the housing via at least two hanging beams, where an auxiliary buffer component is further provided between the mass block and a bottom surface of the housing, and an elastic coefficient of the auxiliary buffer component decreases as force applied thereon increases.

Abstract: The disclosure relates to the field of display technologies, and discloses a display module, and a method for fabricating the same, and the display module includes a display panel, a backlight module, and a flexible printed circuit, wherein the flexible printed circuit is electrically connected with the display panel, the backlight module includes a light source, and the light source is fixed on a side of the flexible printed circuit facing the display panel, and electrically connected with the flexible printed circuit.

Abstract: One aspect of the present invention provides a method for improving power amplification efficiency of a Doherty power amplifier. The method is applied to a Doherty power amplifier that has two paths of Doherty circuit units connected in parallel. The method includes: when output power of the Doherty power amplifier is within a low out power range, adjusting, by a bias circuit, gate voltages of main power amplifiers and peak power amplifiers in the two paths of Doherty circuit units connected in parallel, in order to cause the peak power amplifiers to be in an off state, and the main power amplifiers in the two paths of Doherty circuit units connected in parallel to be in a main power amplification state and a peak power amplification state respectively.

Abstract: One aspect of the present invention provides a method for improving power amplification efficiency of a Doherty power amplifier. The method is applied to a Doherty power amplifier that has two paths of Doherty circuit units connected in parallel. The method includes: when output power of the Doherty power amplifier is within a low out power range, adjusting, by a bias circuit, gate voltages of main power amplifiers and peak power amplifiers in the two paths of Doherty circuit units connected in parallel, in order to cause the peak power amplifiers to be in an off state, and the main power amplifiers in the two paths of Doherty circuit units connected in parallel to be in a main power amplification state and a peak power amplification state respectively.