Patents by Inventor Yaxin CUI

Yaxin CUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MAGNETRON SPUTTERING APPARATUS
    Publication number: 20240068087
    Abstract: The present disclosure provides a magnetron sputtering apparatus, including a process chamber, a bias power supply assembly, and an excitation power supply assembly. The process chamber is provided with a base assembly and a bias guide assembly. A target is arranged at a top of the process chamber. The base assembly is arranged at a bottom of the process chamber and is configured to support a wafer carrier, drive the wafer carrier to move, and heat the wafer carrier. The bias guide assembly is arranged at the base assembly and configured to support the wafer carrier. The bias guide assembly is electrically in contact with the wafer carrier. The bias power supply assembly is electrically connected to the bias guide assembly and configured to apply a bias voltage to the wafer carrier through the bias guide assembly.
    Type: Application
    Filed: December 21, 2021
    Publication date: February 29, 2024
    Inventors: Shubo WU, Yinggong MA, Shuaitao SHI, Wenxue XU, Bingliang GUO, Ziyang ZHEN, Lu ZHANG, Yaxin CUI, Hongtao ZHAI
  • Loading apparatus and physical vapor deposition apparatus
    Patent number: 11315768
    Abstract: The present disclosure provides a loading apparatus and a physical vapor deposition (PVD) apparatus. The loading apparatus includes a pedestal configured to support a workpiece; and a first support member placed on the pedestal and configured to push up a cover ring when the pedestal is at an operation position to prevent an overlapping portion of a cover ring and the workpiece from contacting each other. In the loading apparatus and the PVD apparatus, the first support member supports the cover ring, such that the cover ring does not contact the workpiece, thereby reducing stress forces on the workpiece by external components.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: April 26, 2022
    Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
    Inventors: Xuewei Wu, Tong Wang, Boyu Dong, Jun Zhang, Bingliang Guo, Jun Wang, Henan Zhang, Baogang Xu, Huaichao Ma, Shaohui Liu, Kangning Zhao, Yujie Geng, Qingxuan Wang, Yaxin Cui
  • LOADING APPARATUS AND PHYSICAL VAPOR DEPOSITION APPARATUS
    Publication number: 20200144035
    Abstract: The present disclosure provides a loading apparatus and a physical vapor deposition (PVD) apparatus. The loading apparatus includes a pedestal configured to support a workpiece; and a first support member placed on the pedestal and configured to push up a cover ring when the pedestal is at an operation position to prevent an overlapping portion of a cover ring and the workpiece from contacting each other. In the loading apparatus and the PVD apparatus, the first support member supports the cover ring, such that the cover ring does not contact the workpiece, thereby reducing stress forces on the workpiece by external components.
    Type: Application
    Filed: June 15, 2018
    Publication date: May 7, 2020
    Inventors: Xuewei WU, Tong WANG, Boyu DONG, Jun ZHANG, Bingliang GUO, Jun WANG, Henan ZHANG, Baogang XU, Huaichao MA, Shaohui LIU, Kangning ZHAO, Yujie GENG, Qingxuan WANG, Yaxin CUI