Patents by Inventor Yaxiong Wang
Yaxiong Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11739015Abstract: The disclosure belongs to the field of sewage treatment technology, in particular to a low-carbon nitrogen and phosphorus removal system and process for sewage treatment. The system of the disclosure includes a primary sedimentation fermentation tank, a mainstream modified A2O unit and a bypass anammox unit. The disclosure sets a denitrification phosphorus removal functional zone in the anoxic tank of the A2O system, and sets a deoxygenation zone in the aerobic tank. Combined with the primary sedimentation fermentation tank, the efficient utilization of the carbon source of the A2O process is strengthened. The system has good effluent quality and does not require the addition of a carbon source, and the aeration energy consumption is low, which achieves efficient and low-carbon nitrogen and phosphorus removal.Type: GrantFiled: March 2, 2023Date of Patent: August 29, 2023Assignee: NORTH CHINA MUNICIPAL ENGINEERING DESIGN & RESEARCH INSTITUTE CO., LTD.Inventors: Xingcan Zheng, Qiongqiong Xia, Pengfeng Li, Yongli Sun, Wei Shang, Wenan Zhang, Yaxiong Wang
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Publication number: 20230202893Abstract: The disclosure belongs to the field of sewage treatment technology, in particular to a low-carbon nitrogen and phosphorus removal system and process for sewage treatment. The system of the disclosure includes a primary sedimentation fermentation tank, a mainstream modified A2O unit and a bypass anammox unit. The disclosure sets a denitrification phosphorus removal functional zone in the anoxic tank of the A2O system, and sets a deoxygenation zone in the aerobic tank. Combined with the primary sedimentation fermentation tank, the efficient utilization of the carbon source of the A2O process is strengthened. The system has good effluent quality and does not require the addition of a carbon source, and the aeration energy consumption is low, which achieves efficient and low-carbon nitrogen and phosphorus removal.Type: ApplicationFiled: March 2, 2023Publication date: June 29, 2023Inventors: Xingcan ZHENG, Qiongqiong XIA, Pengfeng LI, Yongli SUN, Wei SHANG, Wenan Zhang, Yaxiong WANG
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Patent number: 11372822Abstract: A method, a device, and a computer apparatus for merging regions of a HBase table are provided. The method includes acquiring attribute information of HDFS files corresponding to each region in a plurality of regions in the HBase table, where the attribute information of the HDFS files corresponding to one region includes storage space occupied by the files corresponding to the one region, and performing merging processing on every two adjacent regions in the plurality of regions at least according to the storage space occupied by the files corresponding to each region in the plurality of regions. Performing the merging based on the storage space occupied by the files corresponding to the regions in the embodiments of the present disclosure may be beneficial for improving the precision of merging two adjacent regions.Type: GrantFiled: March 19, 2019Date of Patent: June 28, 2022Assignee: CHINA UNIONPAY CO., LTD.Inventors: Yaxiong Wang, Jien Zhou, Yingzhuo Wang
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Patent number: 11072589Abstract: A method for preparing 1,2,4-triazole includes using a fluoroborate aryl diazonium salt, a diazoester derivative and an organic nitrile as reaction substrates, a transition metal salt as a catalyst, and an inorganic base as an additive in a cyclization reaction. The method has the following characteristics: the reaction is economical; the substrate is universal; the post-functionalization is easy; the reaction conditions are mild; the reaction can be performed in air; the catalyst amount used is less; and the post-treatment is simple. Meanwhile, the raw materials, such as the reactants and the catalyst used, are inexpensive and easily available; the reaction composition is reasonable; no ligand is needed; there are less reaction steps; and only one step of reaction is required to obtain a high yield, meeting the requirements and directions of contemporary green chemistry and medicinal chemistry, being suitable for screening highly active 1,2,4-triazole drugs.Type: GrantFiled: October 11, 2020Date of Patent: July 27, 2021Inventors: Haiyan Li, Huihuang Li, Yaxiong Wang, Xiaobing Wan
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Publication number: 20210024472Abstract: A method for preparing 1,2,4-triazole includes using a fluoroborate aryl diazonium salt, a diazoester derivative and an organic nitrile as reaction substrates, a transition metal salt as a catalyst, and an inorganic base as an additive in a cyclization reaction. The method has the following characteristics: the reaction is economical; the substrate is universal; the post-functionalization is easy; the reaction conditions are mild; the reaction can be performed in air; the catalyst amount used is less; and the post-treatment is simple. Meanwhile, the raw materials, such as the reactants and the catalyst used, are inexpensive and easily available; the reaction composition is reasonable; no ligand is needed; there are less reaction steps; and only one step of reaction is required to obtain a high yield, meeting the requirements and directions of contemporary green chemistry and medicinal chemistry, being suitable for screening highly active 1,2,4-triazole drugs.Type: ApplicationFiled: October 11, 2020Publication date: January 28, 2021Inventors: Haiyan LI, Huihuang LI, Yaxiong WANG, Xiaobing WAN
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Publication number: 20200394163Abstract: A method, a device, and a computer apparatus for merging regions of a HBase table are provided. The method includes acquiring attribute information of HDFS files corresponding to each region in a plurality of regions in the HBase table, where the attribute information of the HDFS files corresponding to one region includes storage space occupied by the files corresponding to the one region, and performing merging processing on every two adjacent regions in the plurality of regions at least according to the storage space occupied by the files corresponding to each region in the plurality of regions. Performing the merging based on the storage space occupied by the files corresponding to the regions in the embodiments of the present disclosure may be beneficial for improving the precision of merging two adjacent regions.Type: ApplicationFiled: March 19, 2019Publication date: December 17, 2020Inventors: Yaxiong WANG, Jien ZHOU, Yingzhuo WANG
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Patent number: 7130192Abstract: A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a heat sink (10) and a fan (30) generating airflow. The heat sink has a base (11) and a plurality of first fins (13) extending therefrom. First airflow channels (132) are defined between the first fins. A plurality of second fins (15) are transversely attached to the first fins. The second fins have second airflow channels (152) defined therebetween. The second airflow channels communicate with the first airflow channels.Type: GrantFiled: April 27, 2004Date of Patent: October 31, 2006Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Yaxiong Wang, Shun Chi Dong, Chung-Yuan Huang, Aimin Huang
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Patent number: 7055577Abstract: A heat dissipation device includes a column (1) for being positioned on an electronic device for dissipating heat therefrom, a plurality of fin units (5) attached to and stacked along the column, an H-shaped securing member (3) attached to the column below the fin units for securing the heat dissipation device to the electronic device, a pair of fan supports (7) extending from opposite sides of the securing member, and a fan (9) mounted on the fan supports. The fin units define a plurality of sprial air passages along an axis of the column which consist with air flow of the fan. Each of the fin units is configured by a metal disc with a plurality of sectors (54, 54?, 54?) and channels (56, 56?, 56?) between adjacent sectors.Type: GrantFiled: February 12, 2004Date of Patent: June 6, 2006Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Yaxiong Wang, Shun Chi Dong, Chung-Yuan Huang
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Publication number: 20050237719Abstract: A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a heat sink (10) and a fan (30) generating airflow. The heat sink has a base (11) and a plurality of first fins (13) extending therefrom. First airflow channels (132) are defined between the first fins. A plurality of second fins (15) are transversely attached to the first fins. The second fins have second airflow channels (152) defined therebetween. The second airflow channels communicate with the first airflow channels.Type: ApplicationFiled: April 27, 2004Publication date: October 27, 2005Inventors: Yaxiong Wang, Shun Dong, Chung-Yuan Huang, Aimin Huang
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Patent number: 6958915Abstract: A heat dissipating device includes a retention module (20) around an electronic component (15), a heat sink (30) attached to the retention module, and a fan (90). The heat sink includes a plurality of fins (62, 64, 66, 68) and spacers (52) interleaved between the fins, two heat pipes (80) sequentially extending through lower portions of the fins, the spacers and upper portions of the fins to bond the fins and the spacers together. Each spacer includes a flat bottom face for contacting the electronic component, and an arcuate top face. The fins includes two outer fins, and a plurality of inner fins each defining a cutout (62a, 64a) cooperatively defining a chamber between the outer fins. The chamber and the arcuate spacers facilitate cooling air from the fan to blow to opposite sides of the heat sink thereby improving heat dissipation efficiency of the heat sink.Type: GrantFiled: October 7, 2003Date of Patent: October 25, 2005Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Yaxiong Wang, Chung-Yuan Huang, Shun Chi Dong
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Publication number: 20050178527Abstract: A heat dissipation device includes a column (1) for being positioned on an electronic device for dissipating heat therefrom, a plurality of fin units (5) attached to and stacked along the column, an H-shaped securing member (3) attached to the column below the fin units for securing the heat dissipation device to the electronic device, a pair of fan supports (7) extending from opposite sides of the securing member, and a fan (9) mounted on the fan supports. The fin units define a plurality of sprial air passages along an axis of the column which consist with air flow of the fan. Each of the fin units is configured by a metal disc with a plurality of sectors (54, 54?, 54?) and channels (56, 56?, 56?) between adjacent sectors.Type: ApplicationFiled: February 12, 2004Publication date: August 18, 2005Inventors: Yaxiong Wang, Shun Dong, Chung-Yuan Huang
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Publication number: 20050073811Abstract: A heat dissipating device includes a retention module (20) around an electronic component (15), a heat sink (30) attached to the retention module, and a fan (90). The heat sink includes a plurality of fins (62, 64, 66, 68) and spacers (52) interleaved between the fins, two heat pipes (80) sequentially extending through lower portions of the fins, the spacers and upper portions of the fins to bond the fins and the spacers together. Each spacer includes a flat bottom face for contacting the electronic component, and an arcuate top face. The fins includes two outer fins, and a plurality of inner fins each defining a cutout (62a, 64a) cooperatively defining a chamber between the outer fins. The chamber and the arcuate spacers facilitate cooling air from the fan to blow to opposite sides of the heat sink thereby improving heat dissipation efficiency of the heat sink.Type: ApplicationFiled: October 7, 2003Publication date: April 7, 2005Inventors: Yaxiong Wang, Chung-Yuan Huang, Shun Dong
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Patent number: 6863118Abstract: A heat pipe (100) includes a first substrate (102) including a plurality of first low fins (14) and high fins (16), and a second substrate (104) opposing the first substrate and including a plurality of second low fins (14) and high fins (16). A plurality of micro grooves (18) is formed between adjacent fins to form liquid channels (106) of the heat pipe. The first and second high fins are received in corresponding micro grooves of the heat pipe and soldered to the second and first substrates, respectively.Type: GrantFiled: February 12, 2004Date of Patent: March 8, 2005Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Yaxiong Wang, Chung-Yuan Huang