Patents by Inventor Yaxu CHEN

Yaxu CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11404810
    Abstract: The present disclosure provides a dual-backplane structure and electronic device using the same. The dual-backplane structure includes: a first backplane having an opening, and the front side of the first backplane includes at least one connector connected with a connector of the second assembly surface on a main board of a control module; a second backplane disposed on the back of the first backplane, the front side of the second backplane includes a connector connected with a connector of the first assembly surface on a main board of a control module; the back side of the second backplane includes a plurality of hard disk connectors for connecting with the hard disk module. At least one connector on the front side of the second backplane is connected with the connector corresponding to the first assembly surface on the main board through the opening of the first backplane.
    Type: Grant
    Filed: April 25, 2021
    Date of Patent: August 2, 2022
    Assignee: Celestica Technology Consultancy (Shanghai) Co. Ltd
    Inventors: Yaxu Chen, Yuan Xue
  • Patent number: 11342698
    Abstract: The disclosure provides a layout method for backplane connector, a backplane, and an electronic terminal. The backplane includes: a circuit board; and a first connector unit. The first connector unit includes at least one group of first connector modules, each group of the first connector modules comprises a front connector and a back connector; pins in odd-numbered columns of the front connector have the same arrangement as pins in odd-numbered columns of the back connector, pins in even-numbered columns of the front connector have the same arrangement as pins in even-numbered columns of the back connector; the front connector is mounted on the front of the circuit board, the back connector is on the back of the circuit board, and the back connector is staggered one column of pins relative to the front of the front connector.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: May 24, 2022
    Assignee: Celestica Technology Consultancy (Shanghai) Co. Ltd
    Inventors: Yaxu Chen, Keming Ying
  • Publication number: 20210344131
    Abstract: The present disclosure provides a dual-backplane structure and electronic device using the same. The dual-backplane structure includes: a first backplane having an opening, and the front side of the first backplane includes at least one connector connected with a connector of the second assembly surface on a main board of a control module; a second backplane disposed on the back of the first backplane, the front side of the second backplane includes a connector connected with a connector of the first assembly surface on a main board of a control module; the back side of the second backplane includes a plurality of hard disk connectors for connecting with the hard disk module. At least one connector on the front side of the second backplane is connected with the connector corresponding to the first assembly surface on the main board through the opening of the first backplane.
    Type: Application
    Filed: April 25, 2021
    Publication date: November 4, 2021
    Applicant: Celestica Technology Consultancy (Shanghai) Co. Ltd
    Inventors: Yaxu CHEN, Yuan XUE
  • Publication number: 20210194163
    Abstract: The disclosure provides a layout method for backplane connector, a backplane, and an electronic terminal. The backplane includes: a circuit board; and a first connector unit. The first connector unit includes at least one group of first connector modules, each group of the first connector modules comprises a front connector and a back connector; pins in odd-numbered columns of the front connector have the same arrangement as pins in odd-numbered columns of the back connector, pins in even-numbered columns of the front connector have the same arrangement as pins in even-numbered columns of the back connector; the front connector is mounted on the front of the circuit board, the back connector is on the back of the circuit board, and the back connector is staggered one column of pins relative to the front of the front connector.
    Type: Application
    Filed: May 11, 2020
    Publication date: June 24, 2021
    Applicant: Celestica Technology Consultancy (Shanghai) Co. Ltd
    Inventors: Yaxu CHEN, Keming YING