Abstract: An arcuate display device includes a plurality of display units each having has a plurality of pixels, a virtual axis, and a plurality of driving devices. Each pixel includes first, second, and third light-emitting elements respectively disposed at first, second, and third positions. The driving devices corresponding to the display units having the same minimum distance from the virtual axis have the same circuit layout design. The first, second, and third positions are sequentially arranged in a direction away from the virtual axis. Optical properties of the first light-emitting elements and the third light-emitting elements in at least a part of the pixels disposed at a first side of the virtual axis are respectively substantially the same as optical properties of the third light-emitting elements and the first light-emitting elements in at least a part of the pixels disposed at a second side of the virtual axis.

Abstract: A semiconductor device and method of fabricating a semiconductor device involves formation of a trench above a fin (e.g. a fin of a FinFET device) of the semiconductor device and formation of a multi-layer dielectric structure within the trench. The profile of the multi-layer dielectric structure can be controlled depending on the application to reduce shadowing effects and reduce cut failure risk, among other possible benefits. The multi-layer dielectric structure can include two layers, three layers, or any number of layers and can have a stepped profile, a linear profile, or any other type of profile.

Abstract: A magnetoresistive random access memory (MRAM) structure, including a substrate and multiple MRAM cells on the substrate, wherein the MRAM cells are arranged in a memory region adjacent to a logic region. An ultra low-k (ULK) layer covers the MRAM cells, wherein the surface portion of ultra low-k layer is doped with fluorine, and dents are formed on the surface of ultra low-k layer at the boundaries between the memory region and the logic region.

Abstract: An identification protection card is an identification card and includes a card body. The card body consists of a shielding metal sheet and two hard insulating protective layers configured to cover upper and lower surfaces of the shielding metal sheet. The card body is sized relative to an international standard chip card. A surface of at least one of the protective layers is printed with a logo, totem or character. When a chip card is inserted into a card compartment of a wallet, the identification card is placed close to one side of the chip card, thereby providing a shielding effect for the chip card. This effectively blocks the transmission and reception of electronic signals or electromagnetic waves outside the wallet, preventing the data of the chip card from being recorded.

Abstract: An RFID protection and low frequency signal isolation sheet for a folding wallet has a metal interlayer. Upper surface and the lower surface of the metal interlayer are covered with protective layers to form an RFID protection folding sheet. The RFID protection folding sheet is inserted into a cash compartment of a folding wallet. The RFID protection folding sheet has a length slightly less than that of the cash compartment. The RFID protection folding sheet has a width slightly less than a depth of the cash compartment. The RFID protection folding sheet is placed into the cash compartment and located at an inner edge close to an outer layer of the folding wallet. By folding the folding wallet, the RFID protection folding sheet forms the peripheral protection of the folding wallet, and the data of the electronic chips (RFID) of cards inside the folding wallet is blocked.