Abstract: An antenna chip packaging structure and a method for preparing the antenna chip packaging structure are disclosed. The method includes forming multiple antenna structures: on a first support substrate with a redistribution layer on the first support substrate; forming each of the multiple antenna structures includes sequentially forming a first antenna layer, a first connection structure, and a first packaging layer on the redistribution layer; sequentially forming a second antenna layer, a second connection structure, and a second packaging layer above the first packaging layer; forming a third antenna layer above the second packaging layer; repeating the antenna structure forming process, before bonding a second support substrate above the last antenna structure on the last packaging layer; removing the first support substrate, and forming a UBM layer below the redistribution layer; and forming a solder ball on the UBM layer and connecting a chip to the UBM layer.

Abstract: A chip packaging structure and a method for preparing the same are disclosed. The method includes: providing a wafer having a first surface and a second surface, forming a first redistribution layer on the first surface, wherein the wafer includes TSVs having first ends exposed from the wafer; forming welding pads electrically connected to the TSVs through the first redistribution layer; forming a trimming groove in an edge area of the wafer; bonding the first surface of the wafer to a first supporting substrate, and thinning the second surface of the wafer to expose the second ends of the TSVs; forming, on the second surface of the wafer, solder balls electrically connected to the TSVs through a second redistribution layer; bonding the second surface of the wafer to a second supporting substrate, and peeling off the first supporting substrate; and connecting the welding pads to a semiconductor chip.

Abstract: A chip packaging structure and a method for preparing the same are disclosed. The method includes: providing a wafer having a first surface and a second surface, forming a first redistribution layer on the first surface, wherein the wafer includes TSVs having first ends exposed from the wafer; forming welding pads electrically connected to the TSVs through the first redistribution layer; forming a trimming groove in an edge area of the wafer; bonding the first surface of the wafer to a first supporting substrate, and thinning the second surface of the wafer to expose the second ends of the TSVs; forming, on the second surface of the wafer, solder balls electrically connected to the TSVs through a second redistribution layer; bonding the second surface of the wafer to a second supporting substrate, and peeling off the first supporting substrate; and connecting the welding pads to a semiconductor chip.

Abstract: An antenna chip packaging structure and a method for preparing the antenna chip packaging structure are disclosed. The method includes forming multiple antenna structures: on a first support substrate with a redistribution layer on the first support substrate; forming each of the multiple antenna structures includes sequentially forming a first antenna layer, a first connection structure, and a first packaging layer on the redistribution layer; sequentially forming a second antenna layer, a second connection structure, and a second packaging layer above the first packaging layer; forming a third antenna layer above the second packaging layer; repeating the antenna structure forming process, before bonding a second support substrate above the last antenna structure on the last packaging layer; removing the first support substrate, and forming a UBM layer below the redistribution layer; and forming a solder ball on the UBM layer and connecting a chip to the UBM layer.

Abstract: The present disclosure provides an antenna packaging structure and a method for forming the same. The structure includes: a supporting substrate, a rewiring layer on the supporting substrate, a first antenna layer disposed on the rewiring layer, first metal feedline pillars disposed on the first antenna layer, a first packaging layer covering the first metal feedline pillars except exposing the top surfaces of the first metal feedline pillars; a second antenna layer on the first packaging layer, second metal feedline pillars, a second packaging layer covering the second metal feedline pillars except exposing the top surfaces of the second metal feedline pillars; a third antenna layer disposed on the second packaging layer, semiconductor chips connected to the rewiring layer, a metal bump disposed inside an opening in the rewiring layer, and a third packaging layer encapsulating the semiconductor chips and the metal bump.

Abstract: The present disclosure provides an antenna packaging structure and a method for forming the same. The structure includes: a supporting substrate, a rewiring layer on the supporting substrate, a first antenna layer disposed on the rewiring layer, first metal feedline pillars disposed on the first antenna layer, a first packaging layer covering the first metal feedline pillars except exposing the top surfaces of the first metal feedline pillars; a second antenna layer on the first packaging layer, second metal feedline pillars, a second packaging layer covering the second metal feedline pillars except exposing the top surfaces of the second metal feedline pillars; a third antenna layer disposed on the second packaging layer, semiconductor chips connected to the rewiring layer, a metal bump disposed inside an opening in the rewiring layer, and a third packaging layer encapsulating the semiconductor chips and the metal bump.