Patents by Inventor Yayun Liu

Yayun Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240134925
    Abstract: An information handling system may include at least one processor; and an information handling resource, wherein the information handling resource has hardware definition information associated therewith, and wherein the hardware definition information is not stored in a physical storage resource of the information handling resource; wherein the information handling system is configured to: determine a storage location of a database including the hardware definition information of the information handling resource; and retrieve the hardware definition information from the database.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 25, 2024
    Applicant: Dell Products L.P.
    Inventors: Yayun LIU, Wade Andrew BUTCHER, Deepaganesh PAULRAJ
  • Patent number: 11768985
    Abstract: Methods, apparatus, and processor-readable storage media for an automated platform design tool are provided herein. An example method includes extracting information from a first file corresponding to a first computing design, the information including an identifier of at least one network, components associated with the identifier, and connections for each of the components; comparing the first computing design to a second computing design, wherein the comparing comprises: detecting that a second schematic file corresponding to the second computing design comprises the identifier, and determining, for at least one given component, whether the second schematic file includes a matching component based on the set of connections for the at least one given component; determining differences between the first computing design and the second computing design based on the results of the comparing; and initiating at least one automated action based at least in part on the one or more differences.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: September 26, 2023
    Assignee: Dell Products L.P.
    Inventors: Isaac Qin Wang, Yayun Liu
  • Patent number: 11258372
    Abstract: The present invention disclosed a bridge rectifier comprising a first switching circuit, a second switching circuit, a third switching circuit, a fourth switching circuit, a first driving circuit, a second driving circuit, a third driving circuit, and a fourth driving circuit. The first driving circuit is electrically connected to the first switching circuit, the second driving circuit is electrically connected to the second switching circuit, the third driving circuit is electrically connected to the third switching circuit, the fourth driving circuit is electrically connected to the fourth switching circuit. In the disclosure, the bridge rectifier should be implemented by the combination of switch circuits with driving circuits. Such that the power dissipation of bridge rectifier could be significantly reduced to improve the function of the overall circuit due to the low impedance of the switching circuit in a closed state.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: February 22, 2022
    Assignees: Umberg Zipser LLP, LITE-ON Technology Corporation
    Inventors: Chao Peng, Yan Li, YaYun Liu, XiaoQiang Li
  • Publication number: 20210036630
    Abstract: The present invention disclosed a bridge rectifier comprising a first switching circuit, a second switching circuit, a third switching circuit, a fourth switching circuit, a first driving circuit, a second driving circuit, a third driving circuit, and a fourth driving circuit. The first driving circuit is electrically connected to the first switching circuit, the second driving circuit is electrically connected to the second switching circuit, the third driving circuit is electrically connected to the third switching circuit, the fourth driving circuit is electrically connected to the fourth switching circuit. In the disclosure, the bridge rectifier should be implemented by the combination of switch circuits with driving circuits. Such that the power dissipation of bridge rectifier could be significantly reduced to improve the function of the overall circuit due to the low impedance of the switching circuit in a closed state.
    Type: Application
    Filed: May 7, 2020
    Publication date: February 4, 2021
    Applicants: Lite-On Electronics (Guangzhou) Limited, LITE-ON Technology Corporation
    Inventors: Chao PENG, Yan LI, YaYun LIU, XiaoQiang LI
  • Patent number: 10392543
    Abstract: Disclosed is a highly fluorinated silicone resin and a method for making the same. The silicone resin includes M, T, optionally D and optionally Q type monomers and is crosslinkable. The resin has a fluorine content of at least 55 weight percent and a very low refractive index of less than 1.4. The resin is formed in a one step process and requires use of very specific solvents. Preferably the resin includes a first T type monomer having a fluoroalkane group to provide the fluorine to the resin. Preferably the resin includes a second T type monomer having a (meth)acryloyl function to enable cross-linking. The resin forms an effective liquid optically clear adhesive. The resin can be further combined with highly fluorinated (meth)acrylate monomers or perfluoro polyethers to provide even lower refractive indexes and improved adhesive properties.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: August 27, 2019
    Assignee: Henkel IP & Holding GmbH
    Inventors: Bahram Issari, Wenhua Zhang, John G. Woods, Shengqian Kong, Yayun Liu, Jiangbo Ouyang, Li Kang
  • Publication number: 20190169478
    Abstract: Dual-cure compositions for use in high temperature adhesive applications, and particularly for temporarily adhesively attaching one substrate to another substrate, are provided. These dual-cure adhesives are silicone-based compositions that can be B-staged by exposure UV radiation to provide initial green strength, followed by a C-stage cure to give adhesives that can survive high temperature processes above 200° C., especially above 300° C., yet easy to debond afterwards to allow separation of the top and bottom substrates.
    Type: Application
    Filed: June 5, 2018
    Publication date: June 6, 2019
    Inventors: Shengqian KONG, Yayun LIU, Wenhua ZHANG, Stephen HYNES, John G. WOODS, Jiangbo OUYANG, Chunyu SUN, Bahram ISSARI
  • Patent number: 10280349
    Abstract: The present invention relates to one-component UV and thermal curable temporary adhesives for use in high temperature applications, and particularly to adhesives for the temporary attachment of one substrate to another substrate, the adhesives comprising (i) the partial hydrosilylation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, and (ii) a photo and/or thermal radical cure initiator. Also encompassed are assemblies including such an adhesive and methods of using the adhesives.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: May 7, 2019
    Assignees: Henkel AG & Co. KGaA, Henkel IP & Holding GmbH
    Inventors: Stephen Hynes, Chunyu Sun, Jiangbo Ouyang, John Gregory Woods, Bahram Issari, Shengqian Kong, Yayun Liu, Wenhua Zhang
  • Publication number: 20190071593
    Abstract: Disclosed is a highly fluorinated silicone resin and a method for making the same. The silicone resin includes M, T, optionally D and optionally Q type monomers and is crosslinkable. The resin has a fluorine content of at least 55 weight percent and a very low refractive index of less than 1.4. The resin is formed in a one step process and requires use of very specific solvents. Preferably the resin includes a first T type monomer having a fluoroalkane group to provide the fluorine to the resin. Preferably the resin includes a second T type monomer having a (meth)acryloyl function to enable cross-linking. The resin forms an effective liquid optically clear adhesive. The resin can be further combined with highly fluorinated (meth)acrylate monomers or perfluoro polyethers to provide even lower refractive indexes and improved adhesive properties.
    Type: Application
    Filed: November 2, 2018
    Publication date: March 7, 2019
    Inventors: Bahram Issari, Wenhua Zhang, John G. Woods, Shengqian Kong, Yayun Liu, Jiangbo Ouyang, Li Kang
  • Publication number: 20170081574
    Abstract: The present invention relates to one-component UV and thermal curable temporary adhesives for use in high temperature applications, and particularly to adhesives for the temporary attachment of one substrate to another substrate, the adhesives comprising (i) the partial hydrosilylation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, and (ii) a photo and/or thermal radical cure initiator. Also encompassed are assemblies including such an adhesive and methods of using the adhesives.
    Type: Application
    Filed: December 7, 2016
    Publication date: March 23, 2017
    Inventors: Stephen Hynes, Chunyu Sun, Jiangbo Ouyang, John Gregory Woods, Bahram lssari, Shengqian Kong, Yayun Liu, Wenhua Zhang
  • Patent number: 8921464
    Abstract: The invention provides hot melt adhesives that comprise a templating agent, a polymer and a wax. It has been discovered that hot melt adhesives with an effective amount of templating agent have improved heat resistance than adhesives. The adhesives find particular use as case, carton, and tray forming, and as sealing adhesives, including heat sealing applications, for example in the packaging of cereals, cracker and beer products.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: December 30, 2014
    Assignee: Henkel US IP LLC
    Inventors: Yayun Liu, Charles W. Paul, Allison Xiao, Andrea Eodice
  • Patent number: 8426986
    Abstract: A curable composition, suitable for underfill encapsulant, has two distinct phase domains after cure, a continuous phase and a discontinuous phase, in which one phase has a modulus value of 2 GPa or greater, and the second phase has a modulus value at least 1 Gpa less than the first phase, characterized in that the phases are generated in situ as the composition cures.
    Type: Grant
    Filed: May 13, 2011
    Date of Patent: April 23, 2013
    Assignee: Henkel Corporation
    Inventors: Allison Yue Xiao, Yayun Liu
  • Publication number: 20110210454
    Abstract: A curable composition, suitable for underfill encapsulant, has two distinct phase domains after cure, a continuous phase and a discontinuous phase, in which one phase has a modulus value of 2 GPa or greater, and the second phase has a modulus value at least 1 Gpa less than the first phase, characterized in that the phases are generated in situ as the composition cures.
    Type: Application
    Filed: May 13, 2011
    Publication date: September 1, 2011
    Inventors: Allison Yue Xiao, Yayun Liu
  • Patent number: 7070822
    Abstract: The present invention is directed toward a free flowing powdered blend of a polysaccharide and a crystalline polyol for use as an edible adhesive for particulate materials such as seasonings and flavorings. The powdered adhesive blend can easily be mixed with seasonings or flavorings and will melt during a heating process to a sticky viscose liquid capable of adhering seasoning particles to the food substrate. The blends of the present invention have the benefits of being easy to prepare, use and store as they will stay a free flowing powder under most ambient conditions.
    Type: Grant
    Filed: December 20, 2002
    Date of Patent: July 4, 2006
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Yong-Cheng Shi, Yayun Liu, Robert L. Billmers, Russell Stoop, David Huang
  • Publication number: 20050048168
    Abstract: Use of starch(es) and starch derivatives in frozen desserts for improved meltdown and shape retention, including reduced expansion and contraction of the frozen dessert when transported at high altitudes, e.g., over mountain ranges. These improved characteristics are retained in the frozen dessert even after multiple heat shock cycling. The starch(es) and starch derivatives inhibit ice crystal formation in frozen after heat shock cycling.
    Type: Application
    Filed: August 26, 2004
    Publication date: March 3, 2005
    Inventors: Susanne Koxholt, Judith Whaley, Yayun Liu
  • Publication number: 20020197373
    Abstract: This invention relates to a process for preparing cereal grain having increased dietary fiber and/or resistant starch content and the process tolerant grain prepared thereby. Further, this invention provides high amylose grain with unusually high dietary fiber and resistant starch content. In particular, this invention involves the preparation of the improved grain by a combination of moisture and temperature conditions and further to use of the grain in the preparation of products containing starch.
    Type: Application
    Filed: March 26, 2001
    Publication date: December 26, 2002
    Inventors: Yong-Cheng Shi, Yayun Liu