Abstract: Embodiments are disclosed for a single RGBIR camera module that is capable of imaging at both the visible and IR wavelengths. In some embodiments, a camera module comprises: an image sensor comprising: a microlens array; a color filter array (CFA) comprising a red filter, a blue filter, a green filter and at least one infrared (IR) filter; and a pixel array comprising pixels to convert light received through the color filter array into electrical signals; and an image signal processor (ISP) configured to: initiate capture of a first frame by reading signal pixels from the pixel array; initiate capture of a second frame by reading IR pixels from the pixel array; align the first and second frames; and extract the second frame from the first frame to generate a third enhanced frame.

Abstract: Embodiments of the disclosure relate to an optoelectronic device having an epitaxial stack, an array of laser emitters, and a thermal sensor. The epitaxial stack includes a set of epitaxial layers. The array of laser emitters is formed in the set of epitaxial layers. The thermal sensor is coupled to the epitaxial stack at a location adjacent to a laser emitter of the array of laser emitters. The optoelectronic device further includes a controller configured to receive an output of the thermal sensor and determine a temperature at a junction between an active region and an inactive region in the laser emitter by in-situ measurements.

Abstract: An optical sensor module includes a module housing defining a first compartment having a first aperture and a second compartment having a second aperture, with the second aperture spaced apart from the first aperture. A set of optical emitters is disposed in the first compartment and configured to emit light through the first aperture. A first set of optical detectors is disposed in the first compartment and configured to receive a first redirected portion of the emitted light through the first aperture. A set of optical elements is disposed in the first compartment and configured to direct at least a portion of the emitted light or the first redirected portion of the emitted light. A second set of optical detectors is disposed in the second compartment and configured to receive a second redirected portion of the emitted light through the second aperture.

Abstract: Apparatus for optical sensing includes an illumination assembly, which directs first optical radiation toward a target scene over a first range of angles and second optical radiation over at least one second range of angles, which is smaller than and contained within the first range, while modulating the optical radiation with a carrier wave having at least one predetermined carrier frequency. A detection assembly includes an array of sensing elements, which output respective signals in response to the first and the second optical radiation. Processing circuitry drives the illumination assembly to direct the first and the second optical radiation toward the target scene in alternation, and processes the signals output by the sensing elements in response to the first optical radiation in order to compute depth coordinates of points in the target scene, while correcting the computed depth coordinates in response to the second optical radiation.

Abstract: An arbitrary current waveform generator operates by oversampling an input clock signal, and decimating the oversampled clock signal to a decimated clock signal. The oversampled clock signal can be provided as a clock signal to a shift register preloaded with digital values corresponding to samples of a selected waveform to provide as output, and the decimated clock signal can be used to maintain phase synchronization with the input clock signal. Digital output of the shift register is provided to a digital to analog converter, output from which may be used to drive a current-controlled electronic circuit element.

Abstract: An optoelectronic apparatus includes a heat sink, which is shaped to define a base, a first platform at a first elevation above the base, and a second platform alongside the first platform at a second elevation above the base, which is different from the first elevation. A first monolithic emitter array is mounted on the first platform and is configured to emit first optical beams. A second monolithic emitter array is mounted on the second platform and is configured to emit second optical beams. An optical element is configured to direct both the first and the second optical beams toward a target region.

Abstract: An optoelectronic assembly includes an integrated circuit (IC) chip including, on its front side, a photoconversion region and first electrical contact pads disposed alongside the photoconversion region. A circuit substrate contains a cavity into which the IC chip is inserted through the lower side and has a window opening through the upper side in communication with the cavity such that the photoconversion region of the IC chip is exposed through the window. The circuit substrate includes electrical circuit traces, which include second electrical contact pads disposed within the cavity alongside the window so as to contact the first electrical contact pads on the front side of the IC chip within the cavity. A base includes a stiff, heat-conducting material, to which the lower side of the circuit substrate is fixed. A malleable heat-conducting layer is compressed between the rear side of the IC chip and the base.

Abstract: A proximity sensor includes a light source configured to emit a beam of optical radiation and a detector configured to output an electrical signal in response to the optical radiation that is incident on the detector. A first optical multimode fiber is configured to receive the emitted beam and to direct the emitted beam toward an object. A second optical multimode fiber is configured to receive the optical radiation reflected from the object and to convey the received optical radiation to the detector. A processor is coupled to process the electrical signal so as to compute a distance to the object.

Abstract: An electronic device includes a substrate, a set of light emitters on the substrate and arranged in a plurality of axisymmetric light emitter groups, a set of lenses including a different lens disposed over each axisymmetric light emitter group of the plurality of axisymmetric light emitter groups, and a set of optical fibers. At least one optical fiber in the set of optical fibers has a proximal end, a distal end, and a bend between the proximal end and the distal end. The proximal end is positioned to receive light, through a respective lens in the set of lenses, from the light emitters of a respective axisymmetric light emitter group in the plurality of axisymmetric light emitter groups.

Abstract: A light pipe such as a fiber ribbon may be formed from fibers joined by binder such as extruded binder. The fiber ribbon or other light pipe may have bends. A light source may provide light to an input of a fiber ribbon that is guided by the fiber ribbon to a corresponding output. The output may be located in an interior portion of an electronic device or may be positioned so that light from the output exits the electronic device and illuminates external objects. The light source may have light-emitting devices on a substrate. The light-emitting devices may be vertical cavity surface-emitting laser diodes or other lasers and/or may be light-emitting diodes. Light-emitting devices may be arranged in discrete clusters corresponding to the locations of fiber cores in the fiber ribbon.

Abstract: An optical module includes an enclosure and an optical output assembly mounted on the enclosure. An emitter mounted in the enclosure is configured to emit a beam of light toward the optical output assembly. A connector, which includes two conductive layers separated by a dielectric layer, has a first side connected to the enclosure and a second side connected to the optical output assembly. An electrical trace disposed on the enclosure is connected to the first side of the connector so as to define a test circuit having a capacitance. Control circuitry is coupled to sense the capacitance of the test circuit, and configured to inhibit operation of the emitter upon sensing a change in the capacitance that exceeds a predetermined threshold.

Abstract: An optoelectronic apparatus includes a heat sink, which is shaped to define a base, a first platform at a first elevation above the base, and a second platform alongside the first platform at a second elevation above the base, which is different from the first elevation. A first monolithic emitter array is mounted on the first platform and is configured to emit first optical beams. A second monolithic emitter array is mounted on the second platform and is configured to emit second optical beams. An optical element is configured to direct both the first and the second optical beams toward a target region.

Abstract: An optoelectronic device includes a semiconductor substrate and an array of emitters disposed on the substrate, including at least first emitters disposed in a central zone of the array and second emitters disposed in at least one peripheral zone of the array, surrounding the central zone. The array includes at least one cathode and at least one anode disposed on opposing sides of the emitters. The first emitters have a first resistance between the at least one cathode and the at least one anode, and the second emitters have a second resistance, greater than the first resistance, between the at least one cathode and the at least one anode. A drive circuit is coupled to apply a selected voltage between the at least one cathode and the at least one anode so as to cause the emitters to emit optical radiation.

Abstract: An electronic module includes a circuit substrate including conductive pads interconnected by traces, including a ground pad for connection to an electrical ground. One or more electronic components are mounted on the circuit substrate. A housing including a dielectric material is mounted on the circuit substrate so as to cover the one or more electronic components. A metal lead, which has first and second ends, is embedded in the dielectric material such that the first end contacts the ground pad on the circuit substrate when the housing is mounted on the circuit substrate, and the second end is exposed at an outer surface of the dielectric material. A conductive coating is disposed over the outer surface of the housing in galvanic contact with the exposed second end of the metal lead.

Abstract: An electronic module includes a circuit substrate including conductive pads interconnected by traces, including a ground pad for connection to an electrical ground. One or more electronic components are mounted on the circuit substrate. A housing including a dielectric material is mounted on the circuit substrate so as to cover the one or more electronic components. A metal lead, which has first and second ends, is embedded in the dielectric material such that the first end contacts the ground pad on the circuit substrate when the housing is mounted on the circuit substrate, and the second end is exposed at an outer surface of the dielectric material. A conductive coating is disposed over the outer surface of the housing in galvanic contact with the exposed second end of the metal lead.

Abstract: An optical module includes first and second transparent substrates and a spacer between the first and second transparent substrates, holding the first transparent substrate in proximity to the second transparent substrate, with first and second diffractive optical elements (DOEs) on respective faces of the first and second transparent substrates. At least first and second capacitance electrodes are disposed respectively on the first and second transparent substrates in proximity to the first and second DOEs. Circuitry is coupled to measure changes in a capacitance between at least the first and second capacitance electrodes.

Abstract: An optical module includes an enclosure and an optical output assembly mounted on the enclosure. An emitter mounted in the enclosure is configured to emit a beam of light toward the optical output assembly. A connector, which includes two conductive layers separated by a dielectric layer, has a first side connected to the enclosure and a second side connected to the optical output assembly. An electrical trace disposed on the enclosure is connected to the first side of the connector so as to define a test circuit having a capacitance. Control circuitry is coupled to sense the capacitance of the test circuit, and configured to inhibit operation of the emitter upon sensing a change in the capacitance that exceeds a predetermined threshold.

Abstract: An optical module includes a diffractive optical element (DOE) with a transparent conductive trace disposed over a surface of the DOE. An emitter is configured to direct a beam of optical radiation through the DOE. Control circuitry is coupled to measure a resistance of the transparent conductive trace and to control operation of the emitter responsively to the resistance.

Abstract: An apparatus includes a main substrate, a device, and a heat spreader. The main substrate is configured for mounting the device in a mounting location thereon and having a cavity located below the mounting location. The device is mounted in the mounting location, and the heat spreader is fitted into the cavity and coupled to the device and to a heat sink. The heat spreader is configured to conduct heat from the device to the heat sink and to provide electrical insulation between the device and the heat sink.

Abstract: An optical module includes first and second transparent substrates and a spacer between the first and second transparent substrates, holding the first transparent substrate in proximity to the second transparent substrate, with first and second diffractive optical elements (DOEs) on respective faces of the first and second transparent substrates. At least first and second capacitance electrodes are disposed respectively on the first and second transparent substrates in proximity to the first and second DOEs. Circuitry is coupled to measure changes in a capacitance between at least the first and second capacitance electrodes.