Patents by Inventor Yazdi Dinshaw Contractor

Yazdi Dinshaw Contractor has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • REUSABLE PROBE CARD WITH REMOVABLE PROBE INSERT
    Publication number: 20200386787
    Abstract: In a described example, a device includes: a probe card with a tester side surface and a device side surface opposite the tester side surface; a probe insert having a first surface that is removably affixed to the device side surface of the probe card; and at least one or more probes extending from a second surface of the probe insert that is opposite the first surface of the probe insert.
    Type: Application
    Filed: June 5, 2019
    Publication date: December 10, 2020
    Inventors: Yazdi Dinshaw Contractor, Gerard Riddick, Ray Joseph Ochotorena, Jr., John Allen Hite, William Edward Brumley, Enrique Teran
  • Visual identification of semiconductor dies
    Patent number: 10431551
    Abstract: Systems and methods for visual identification of semiconductor dies are described. In some embodiments, a method may include: receiving a semiconductor wafer having a plurality of dies and printing a unique visual identification mark on each of the plurality of dies. In other embodiments, a method may include receiving an electronic device comprising a die and a package surrounding at least a portion of the die and reading, from the electronic device, a unique visual identification mark that encodes a Cartesian coordinate of the die relative to a reference point on a semiconductor wafer.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: October 1, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Kenneth Michael Butler, Kalyan Chakravarthy Cherukuri, Stephanie Watts Butler, Venkataramanan Kalyanaraman, Hubert Joseph Payne, Yazdi Dinshaw Contractor
  • VISUAL IDENTIFICATION OF SEMICONDUCTOR DIES
    Publication number: 20180130754
    Abstract: Systems and methods for visual identification of semiconductor dies are described. In some embodiments, a method may include: receiving a semiconductor wafer having a plurality of dies and printing a unique visual identification mark on each of the plurality of dies. In other embodiments, a method may include receiving an electronic device comprising a die and a package surrounding at least a portion of the die and reading, from the electronic device, a unique visual identification mark that encodes a Cartesian coordinate of the die relative to a reference point on a semiconductor wafer.
    Type: Application
    Filed: January 11, 2018
    Publication date: May 10, 2018
    Inventors: Kenneth Michael Butler, Kalyan Chakravarthy Cherukuri, Stephanie Watts Butler, Venkataramanan Kalyanaraman, Hubert Joseph Payne, Yazdi Dinshaw Contractor
  • Visual identification of semiconductor dies
    Patent number: 9899332
    Abstract: Systems and methods for visual identification of semiconductor dies are described. In some embodiments, a method may include: receiving a semiconductor wafer having a plurality of dies and printing a unique visual identification mark on each of the plurality of dies. In other embodiments, a method may include receiving an electronic device comprising a die and a package surrounding at least a portion of the die and reading, from the electronic device, a unique visual identification mark that encodes a Cartesian coordinate of the die relative to a reference point on a semiconductor wafer.
    Type: Grant
    Filed: February 18, 2016
    Date of Patent: February 20, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Kenneth Michael Butler, Kalyan Chakravarthy Cherukuri, Stephanie Watts Butler, Venkataramanan Kalyanaraman, Hubert Joseph Payne, Yazdi Dinshaw Contractor
  • VISUAL IDENTIFICATION OF SEMICONDUCTOR DIES
    Publication number: 20170243831
    Abstract: Systems and methods for visual identification of semiconductor dies are described. In some embodiments, a method may include: receiving a semiconductor wafer having a plurality of dies and printing a unique visual identification mark on each of the plurality of dies. In other embodiments, a method may include receiving an electronic device comprising a die and a package surrounding at least a portion of the die and reading, from the electronic device, a unique visual identification mark that encodes a Cartesian coordinate of the die relative to a reference point on a semiconductor wafer.
    Type: Application
    Filed: February 18, 2016
    Publication date: August 24, 2017
    Inventors: Kenneth Michael Butler, Kalyan Chakravarthy Cherukuri, Stephanie Watts Butler, Venkataramanan Kalyanaraman, Hubert Joseph Payne, Yazdi Dinshaw Contractor