Patents by Inventor Ye Cheng Cheng

Ye Cheng Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tape substrate, tape package and flat panel display using same
    Patent number: 7435914
    Abstract: A tape substrate having hole(s) formed discontinuously along a bent portion thereof and configured to dissipate stress applied to the bent portion. A tape package using the tape substrate may be connected to a panel and a printed circuit board using an ACF. The tape package may be bent and located behind at least one side of the panel.
    Type: Grant
    Filed: January 23, 2006
    Date of Patent: October 14, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Ye Cheng Cheng