Abstract: The present application can provide an electrode, a method of manufacturing an electrode, and a use of the electrode. The present application can provide an electrode without forming the fat edge portion while an insulating layer formed by overlapping with the electrode active material layer on the current collector layer of the electrode effectively secures the insulation required for the electrode. In addition, even when the electrode design model is changed, the present application can provide a manufacturing method capable of manufacturing the above-described electrode by flexibly responding to the relevant change. In addition, the present application can provide a use of the electrode.

Abstract: A thermally stable polypeptide having FGF7 activity is provided. The polypeptide is a thermally stable polypeptide having FGF7 activity, wherein, in SEQ ID NO: 1, a 120th alanine (A) is substituted with cysteine (C), one including at least one substitution selected from substitution of a 126th lysine (K) with aspartic acid (D) and a 178th lysine (K) with glutamic acid (E) or aspartic acid (D) forms a salt bridge with a 175th arginine (R), and a 133rd cysteine (C) and a 137th cysteine (C) are disulfide bonded.

Abstract: Provided is a polypeptide having FGF2 activity and improved temperature stability and protease resistance. The polypeptide includes at least one substitution selected from a substitution of aspartic acid (D) with glutamic acid (E) at position 28, a substitution of cysteine (C) with isoleucine (I) or leucine (L) at position 78, or a substitution of cysteine (C) with isoleucine (I) or tryptophan (VV) at position 96 in SEQ ID NO: 1.

Abstract: A coil electronic component includes a body including a laminate structure including a plurality of coil layers, and external electrodes disposed externally on the body. Each of the plurality of coil layers includes an insulating layer, a base pattern, and a coil pattern disposed on the base pattern, and a conductive via connecting the coil pattern to an adjacent coil layer, and the base pattern includes an intermetallic compound of Cu and Sn, and the coil pattern includes a Cu component.

Abstract: A coil electronic component includes a body including a laminate structure including a plurality of coil layers, and external electrodes disposed externally on the body. Each of the plurality of coil layers includes an insulating layer, a base pattern, and a coil pattern disposed on the base pattern, and a conductive via connecting the coil pattern to an adjacent coil layer, and the base pattern includes an intermetallic compound of Cu and Sn, and the coil pattern includes a Cu component.

Abstract: There is provided a chip electronic component including: a magnetic body containing magnetic metal powder particles and a thermosetting resin; an internal coil part embedded in the magnetic body; and a surface protection layer with which a surface of the magnetic body is coated. The surface protection layer may prevent a plating spreading phenomenon occurring on a surface of the chip electronic component at the time of forming external electrodes.

Abstract: There is provided a chip electronic component including: a magnetic body containing magnetic metal powder particles and a thermosetting resin; an internal coil part embedded in the magnetic body; and a surface protection layer with which a surface of the magnetic body is coated. The surface protection layer may prevent a plating spreading phenomenon occurring on a surface of the chip electronic component at the time of forming external electrodes.