Patents by Inventor Ye Eun JUNG

Ye Eun JUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240271174
    Abstract: The present application relates to a method of producing or purifying an FGF21 protein by using the heat-elasticity of FGF21. The method of producing or purifying the FGF21 protein according to an embodiment of the present application utilizes the heat stability and heat-elasticity of the FGF21 protein that is not denatured or precipitated even upon heat treatment and returns to the original structure when re-cooled after heat treatment, resulting in advantages of improving efficiency by simplifying a protein production process.
    Type: Application
    Filed: September 27, 2021
    Publication date: August 15, 2024
    Inventors: Sun-Shin CHA, Soo-Bong PARK, Ye-Eun JUNG, Da-Woon BAE, Bo-Gyeong JEONG, Bu-Gyeong KANG, Jung-hyun LEE, Hyung-Soon YIM, Kyeong Won LEE, Young Jun AN
  • Patent number: 11636971
    Abstract: A coil component includes a body including a plurality of effective layers stacked in one direction; a coil portion embedded in the body, the coil portion including a plurality of coil patterns respectively disposed in the plurality of effective layers, the coil portion further including a lead-out pattern; and a core penetrating through an interior of the coil portion, wherein the coil portion further includes a resistance reducing portion extending from an outer circumferential surface of each of the coil patterns to an outside of the core in a respective one of the effective layers in a radially outward direction of the coil portion.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: April 25, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ye Eun Jung, Jin Gul Hyun, Han Lee
  • Publication number: 20230097015
    Abstract: The present disclosure relates to an artificial metabolon formed by selective self-assembly, production and use thereof, specifically, an artificial metabolon formed by de novo, in vivo assembly of multi-step metabolic pathway enzymes without using any external scaffold, production and use thereof.
    Type: Application
    Filed: September 30, 2022
    Publication date: March 30, 2023
    Applicant: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
    Inventors: Yeo Joon YOON, Nam Ki Lee, Eunji Kim, Jin A Yoon, Soojung Yi, Sora Yang, Sun-Shin Cha, Ye-Eun Jung, Da-Woon Bae, Bo-Gyeong Jeong, Bu-Gyeong Kang, Ji-Sook Hahn, Sojeong Kim, Injae Cho
  • Publication number: 20210043359
    Abstract: A coil component includes a body including a plurality of effective layers stacked in one direction; a coil portion embedded in the body, the coil portion including a plurality of coil patterns respectively disposed in the plurality of effective layers, the coil portion further including a lead-out pattern; and a core penetrating through an interior of the coil portion, wherein the coil portion further includes a resistance reducing portion extending from an outer circumferential surface of each of the coil patterns to an outside of the core in a respective one of the effective layers in a radially outward direction of the coil portion.
    Type: Application
    Filed: February 10, 2020
    Publication date: February 11, 2021
    Inventors: Ye Eun Jung, Jin Gul Hyun, Han Lee
  • Patent number: 10580564
    Abstract: An inductor includes a body having a coil, a magnetic material surrounding the coil, and a resin; and an external electrode disposed on at least a surface of the body. The body disposed in the inductor includes a particle which may soften an external impact acting on the inductor, in addition to acting on the magnetic material and the resin, and the external impact may be a physical impact or a thermal impact.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: March 3, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hee Ju, Je Ik Moon, Ye Eun Jung
  • Patent number: 10176926
    Abstract: A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes disposed to face each other with at least one among the plurality of dielectric layers interposed therebetween are stacked, and the inductor including a magnetic body including a coil part. The inductor and the capacitor are coupled to each other by an adhesive containing a first epoxy resin including a urethane modified epoxy (UME) resin, a second epoxy resin including a bisphenol A type resin, and a latent curing agent.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: January 8, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seong Min Chin, Je Ik Moon, Ye Eun Jung
  • Publication number: 20180090258
    Abstract: An inductor includes a body having a coil, a magnetic material surrounding the coil, and a resin; and an external electrode disposed on at least a surface of the body. The body disposed in the inductor includes a particle which may soften an external impact acting on the inductor, in addition to acting on the magnetic material and the resin, and the external impact may be a physical impact or a thermal impact.
    Type: Application
    Filed: April 25, 2017
    Publication date: March 29, 2018
    Inventors: Jae Hee JU, Je Ik MOON, Ye Eun JUNG
  • Publication number: 20160343509
    Abstract: A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes disposed to face each other with at least one among the plurality of dielectric layers interposed therebetween are stacked, and the inductor including a magnetic body including a coil part. The inductor and the capacitor are coupled to each other by an adhesive containing a first epoxy resin including a urethane modified epoxy (UME) resin, a second epoxy resin including a bisphenol A type resin, and a latent curing agent.
    Type: Application
    Filed: April 20, 2016
    Publication date: November 24, 2016
    Inventors: Seong Min CHIN, Je Ik MOON, Ye Eun JUNG