Abstract: An LED lamp (100) includes a lamp enclosure (10), a heat sink (51) and two LED modules (30). The lamp enclosure has a recess (15) and an opening (156). The heat sink is received in the recess of the lamp enclosure. The LED modules are attached to a bottom of the heat sink and oriented downwardly and outwardly towards an internal surface (1110) of the lamp enclosure. Light emitted by the LED module is firstly directed to the internal surface and other internal surfaces (130, 1130), and then reflected from the internal surfaces to an outside of the LED lamp through the opening.

Abstract: An LED lamp (100) includes a lamp enclosure (10) and two LED modules (30). The lamp enclosure has a concave housing (11). The housing includes an elongated bottom plate (111) and two lateral plates (115) extending upwardly from two opposite lengthwise sides of the bottom plate respectively. An opening (156) is defined at a top side of the lamp enclosure. The LED modules each are mounted at a joint between the bottom plate and a corresponding of the lateral plates in such a manner that at least a portion of lights emitted by the LED modules is firstly directed to and reflected by an internal surface of the bottom plate, and then directed to an outside through the opening.

Abstract: A mounting device (10) for mounting a heat sink (20) to a printed circuit board (40) on which a heat generating electronic component (30) is disposed, includes a mounting frame (100), two clasping legs (104) and four resilient arms (105). The mounting frame includes two first mounting arms (101) and two second mounting arms (102) disposed above the first mounting arms. The first mounting arms abut on the circuit board. The clasping legs connect with the second mounting arms and are inserted through the printed circuit board to be attached to the printed circuit board. The resilient arms connect with the second mounting arms and exert a downward resilient force on the heat sink toward the heat generating electronic component.

Abstract: An LED lamp (100) includes a lamp enclosure (10), an LED module and a reflective plate (50). The lamp enclosure has a groove (15) and an opening (156). The opening is located above and communicates with the groove. The LED module and the reflective plate are received in the groove of the lamp enclosure. The LED module is oriented towards the opening. The reflective plate is located between the LED module and opening in such a manner that at least a portion of light (71) emitted by the LED module is firstly directed to the reflective plate, and then reflected from the reflective plate to an internal surface (115) of the lamp enclosure, and at last reflected from the internal surface to the opening.

Abstract: A heat dissipation device includes a heat sink and a cooling fan arranged thereon. The cooling fan includes a motor-stator and an impeller mounted around the motor-stator. The motor-stator is arranged on a middle of the heat sink. The heat sink includes a base and a plurality of fins extending upwardly from the base. The heat sink defines a plurality of notches incising the fins. The notches are angled towards the middle of the heat sink immediately under the motor-stator of the cooling fan.

Abstract: A securing device includes a securing member defining a securing hole therein, and a fastener extending through the securing hole. The fastener includes a spring, and a bolt having a main portion, a bottom fixing portion, and a top head portion. The securing hole includes a large portion, a small portion, and a concave around the small portion. A diameter of the small portion is greater than the main portion and smaller than the fixing portion. A diameter of the large portion is greater than the fixing portion and smaller than the spring. The main portion extends through the small portion with the fixing portion tightly abutting the securing member. The spring is mounted around the main portion and received in the concave. The spring is compressed between the head portion and a step of the securing member in the concave.

Abstract: A securing device (30) is used for securing a heat sink (10) to a printed circuit board (40) with a heat-generating electronic component (41) mounted thereon. The securing device includes a V-shaped elongated main body (31), a first locking leg (34), a second locking leg (332) and a resilient member (32). The first locking leg and second locking leg are connected to two opposite ends of the main body respectively for engaging with a retention frame (20) on the printed circuit board. The resilient member includes a planar-shaped supporting plate (321) engaging with a bottom portion of the main body and at least one resilient foot (322) extending downwardly from the supporting plate. The resilient foot deforms to exert a resilient force on the heat sink when the heat sink is assembled to the electronic component by the securing device.

Abstract: A light source module (100) includes a plurality of light emitting diodes (13), a heat dissipation device (30) and a thermoelectric cooler (20). The thermoelectric cooler has a cold side (21) and a hot side (23). The light emitting diodes are in thermal engagement with the cold side of the thermoelectric cooler. The heat dissipation device is in thermal engagement with the hot side of the thermoelectric cooler.

Abstract: A mounting device (10) for mounting a heat sink (40) onto a printed circuit board (60) with a heat generating electronic component (50) mounted thereon. The mounting device includes a mounting frame (101) and two resilient clips (102) attached to the mounting frame. The mounting frame includes two first mounting arms (1011) and two second mounting arms (1012) disposed above the first mounting arms. The first mounting arms are configured for being attached to the printed circuit board. The resilient clips are configured for being sandwiched between the second mounting arms of the mounting frame and the heat sink. The resilient clips each include two resilient arms (1023) configured for providing a resilient force which urges the heat sink toward the heat generating electronic component.

Abstract: A heat sink clip (30) includes an elongated resilient main body (31) with two spaced barbs (315) at a first end thereof, a first locking member (33) coupled with a second end of the main body and a moveable second locking member (32) movably coupled with the first end of the main body. The barbs each vertically extend and include a neck (3151) connecting with the main body and a locking end (3152) at a free end thereof. The moveable second locking member includes an operating portion (321) and a locking leg (322) defining two connecting slots (323) therein. Each of the connecting slots includes a longitudinally narrow portion (3231) and a longitudinally wide portion (3232) beside the narrow portion. The barbs enter the connecting slots through the wide portions and the necks are received in the narrow portions.

Abstract: An LED lamp (100) includes a plurality of LED modules (20) and a thermal module (30). Each of the LED modules has a plurality of LEDs (220). The thermal module is secured to a side of the LED modules. The thermal module includes a plurality of fins (320). The fins are stacked with one above another with a gap defined between two adjacent fins. Each of the fins defines two opening (325). The openings of the fins coincide with each other from top to bottom so as to form two channels (328). The channels are used for air to flow therein to exchange heat with the fins.

Abstract: An LED lamp (10) includes a lamp base (100), an optical lens system (400), an LED (500) mounted in the optical lens system and a heat dissipation device (300) interconnecting the lamp base and the optical lens system. The heat dissipation device includes a heat sink (334) and a heat pipe (332). The heat sink includes a central block (3340), a plurality of fins (3342) mounted on an outer circumferential face of the central block and a receiving hole (3346) defined axially through the central block. The heat pipe is circumferentially retained in the receiving hole and in thermal contact with the LED.

Abstract: An electronic apparatus includes a PCB with a heat generating electronic component disposed thereon, a heat sink, and a mounting device for mounting the heat sink onto the heat generating electronic component. The mounting device includes a mounting frame and a wire clip. The mounting frame surrounds the heat sink, and includes two first mounting arms and two second mounting arms disposed above the first mounting arms. The first mounting arms abut on the PCB. A pair of engaging wings are formed on the second mounting arms. The wire clip includes a pivot axis pivotably attached to the mounting frame and two resilient arms at opposite sides of the mounting frame. The resilient arms abut against the heat sink and engage with the engaging wings, thereby exerting a resilient force on the heat sink toward the heat generating electronic component.

Abstract: A mounting device (10) for mounting a heat sink (40) onto a printed circuit board (60) with a heat generating electronic component (50) mounted thereon. The mounting device includes a mounting frame (101) and two resilient clips (102) attached to the mounting frame. The mounting frame includes two first mounting arms (1011) and two second mounting arms (1012) disposed above the first mounting arms. The first mounting arms are configured for being attached to the printed circuit board. The resilient clips are configured for being sandwiched between the second mounting arms of the mounting frame and the heat sink. The resilient clips each include two resilient arms (1023) configured for providing a resilient force which urges the heat sink toward the heat generating electronic component.

Abstract: A mounting device (10) for mounting a heat sink (20) to a printed circuit board (40) on which a heat generating electronic component (30) is disposed, includes a mounting frame (100), two clasping legs (104) and four resilient arms (105). The mounting frame includes two first mounting arms (101) and two second mounting arms (102) disposed above the first mounting arms. The first mounting arms abut on the circuit board. The clasping legs connect with the second mounting arms and are inserted through the printed circuit board to be attached to the printed circuit board. The resilient arms connect with the second mounting arms and exert a downward resilient force on the heat sink toward the heat generating electronic component.

Abstract: An LED assembly (10) includes an LED (12) and a lens (16). The lens covers on an outer periphery of the LED. The LED has an encapsulant (125) and an LED chip (121) received in the encapsulant (125) and having a light emitting surface (122). The lens has a light output surface (161) over the light emitting surface. The light output surface defines a plurality of annular, concentric grooves (163). Each groove (163) is cooperatively enclosed by a first groove wall (165) and a second groove wall (166). The first groove wall is a portion of a periphery of an imaginary cone and a conical tip of the imaginary cone is located on the light emitting surface of the LED chip.

Abstract: A light emitting diode (10) includes an LED chip (14) and an encapsulant (16) enclosing the LED chip. The LED chip has a light emitting surface (141), and the encapsulant has a light output surface (161) over the light emitting surface. The light output surface defines a plurality of annular, concentric grooves (163). Each groove is cooperatively enclosed by a first groove wall (165) and a second groove wall (166). The first groove wall is a portion of a circumferential side surface of a cone, and a conical tip of the cone is located on the light emitting surface of the LED chip.

Abstract: A light source module (100) includes a plurality of light emitting diodes (13), a heat dissipation device (30) and a thermoelectric cooler (20). The thermoelectric cooler has a cold side (21) and a hot side (23). The light emitting diodes are in thermal engagement with the cold side of the thermoelectric cooler. The heat dissipation device is in thermal engagement with the hot side of the thermoelectric cooler.

Abstract: An LED lamp (100) includes a frame (12), at least one LED module (20), a heat sink (32) and a cover (50). The LED module has a plurality of LEDs (220). The heat sink is mounted on the frame. The at least one LED module is attached to a bottom of the heat sink, whereby heat generated by the LEDs can be dissipated by the heat sink. A heat pipe (35) interconnects the heat sink and the cover. Thus, the heat generated by the LEDs can also be dissipated by the cover via the heat pipe. The cover is secured so as to shield a top portion of the heat sink and space from the top portion of the heat sink.