Patents by Inventor Yejin YOON

Yejin YOON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240130123
    Abstract: Disclosed are semiconductor devices, electronic systems including the same, and methods of fabricating the same. The semiconductor device comprises a first gate stack structure including a first dielectric pattern and a first conductive pattern that are alternately stacked with each other, a memory channel structure including a first memory portion that penetrates the first gate stack structure, a through contact including a first through portion at a level the same as a level of the first memory portion, and a connection contact including a first connection portion at a level the same as the level of the first memory portion and the level of the first through portion. A minimum width of the first memory portion is less than a minimum width of the first through portion and a minimum width of the first connection portion.
    Type: Application
    Filed: June 12, 2023
    Publication date: April 18, 2024
    Inventors: Yejin PARK, Seung Yoon KIM, Heesuk KIM, Hyeongjin KIM, Sehee JANG, Minsoo SHIN, Seungjun SHIN, Sanghun CHUN, Jeehoon HAN, Jae-Hwang SIM, Jongseon AHN
  • Publication number: 20230030914
    Abstract: According to various embodiments, an electronic device may comprise at least one embedded universal integrated circuit card (eUICC) each storing at least one subscriber identity information and at least one processor electrically connected to the eUICC.
    Type: Application
    Filed: July 1, 2022
    Publication date: February 2, 2023
    Inventors: Jieun JUNG, Jaehyeon SEO, Jimin PARK, Hyongjin BAN, Yejin YOON
  • Publication number: 20220345877
    Abstract: An electronic device includes at least one embedded universal integrated circuit card (eUICC) each storing at least one subscriber identification information, and at least one processor electrically connected with the eUICC. The at least one processor may be configured to control to transmit, to a first server, a first request message including information about an operation related to a subscription or a subscription transfer based on the eUICC and receive a first response message from the first server, in response to the transmission of the first request message. The first response message may include information indicating that a profile to be provided for the eUICC is not ready in response to the first request message.
    Type: Application
    Filed: April 22, 2022
    Publication date: October 27, 2022
    Inventors: Jieun JUNG, Hyongjin BAN, Jaehyeon SEO, Jimin PARK, Yejin YOON
  • Patent number: 11395132
    Abstract: An electronic device according to an embodiment may include: a first wireless communication circuit configured to support a first communication protocol, a second wireless communication circuit configured to support a second communication protocol, at least one processor operatively coupled with the first wireless communication circuit and the second wireless communication circuit, and a memory operatively coupled with the at least one processor, wherein the memory stores instructions which, when executed, cause the at least one processor to control the electronic device to: establish a short-range communication connection between the electronic device and an external electronic device through the first wireless communication circuit, acquire subscription information of a first profile stored in a first Subscriber Identification Module (SIM) of the external electronic device from the external electronic device through the first wireless communication circuit, transmit at least part of the subscription.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: July 19, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sanghwi Lee, Jieun Jung, Jimin Park, Hyongjin Ban, Jaehyeon Seo, Yejin Yoon, Sunmin Hwang
  • Publication number: 20210006964
    Abstract: An electronic device according to an embodiment may include: a first wireless communication circuit configured to support a first communication protocol, a second wireless communication circuit configured to support a second communication protocol, at least one processor operatively coupled with the first wireless communication circuit and the second wireless communication circuit, and a memory operatively coupled with the at least one processor, wherein the memory stores instructions which, when executed, cause the at least one processor to control the electronic device to: establish a short-range communication connection between the electronic device and an external electronic device through the first wireless communication circuit, acquire subscription information of a first profile stored in a first Subscriber Identification Module (SIM) of the external electronic device from the external electronic device through the first wireless communication circuit, transmit at least part of the subscription.
    Type: Application
    Filed: July 1, 2020
    Publication date: January 7, 2021
    Inventors: Sanghwi LEE, Jieun JUNG, Jimin PARK, Hyongjin BAN, Jaehyeon SEO, Yejin YOON, Sunmin HWANG