Abstract: This application provides a circuit board assembly and an electronic device. The circuit board assembly includes a circuit board, a chip, a shielding cover, and a conductive structure. The circuit board includes a first surface and a second surface that are disposed opposite to each other. The chip is disposed on the first surface. The shielding cover defines accommodation space, a recess is provided on a surface of the shielding cover facing the first surface, and the recess runs through the shielding cover and is communicated with the accommodation space. The conductive structure is located in the recess and connected between a top wall of the recess and the first surface, and orthographic projection of the conductive structure on the circuit board at least partially falls within an orthographic projection range of the chip on the circuit board.

Abstract: An energy storage apparatus and an energy storage system. The energy storage apparatus includes a cell and a heating circuit. The heating circuit includes a heating resistor and a switch. The heating resistor and the switch are configured to be connected in series to a power supply loop. The switch in the heating circuit is controlled to be on and off, so that the heating resistor is intermittently connected to and disconnected from the power supply loop. The switch may control, based on a power supply voltage provided by the power supply loop, turn-on time and turn-off time of a line between the power supply loop and the heating resistor in each switching cycle, to dynamically adjust an average heating power of the heating circuit.

Abstract: A vacuum solution and aging treatment process for improving high-temperature plasticity of GH4738 rings includes: heating a GH4738 ring to 1020° C. to 1030° C. in a vacuum environment; injecting nitrogen; subjecting the GH4738 ring to aging treatment at 740° C. to 750° C.; and taking out and air-cooling the GH4738 ring. The method realizes the uniform distribution of the intragranular ?? precipitates and the intergranular M23C6 carbides in the GH4738 ring after heat treatment. The elongation and area reduction of the alloy ring stretched at 540° C. after heat treatment are 30% and 34% respectively, which are 25% and 36% higher than those before process optimization respectively; and that at 760° C. are 49% and 70% respectively, which are 32% and 27% higher than those before process optimization respectively. The index requirements can be fully met. This process is applicable to GH4738 rings, which have a high requirement on high-temperature plasticity after heat treatment.