Patents by Inventor Ye Ming
Ye Ming has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10985301Abstract: A light-emitting device includes a supportive substrate and a first light-emitting element on the supportive substrate. The first light-emitting element includes a first light-emitting stacked layer having a first surface and a second surface opposite to the first surface, and a first transparent layer on the first surface and electrically connected to the first light-emitting stacked layer. A second light-emitting element locates on the supportive substrate and a metal layer electrically connects to the first light-emitting element and the second light-emitting element and physically connects to the first transparent layer. The first light-emitting stacked layer includes a first width and the first transparent layer includes a second width different from the first width from a cross section view of the light-emitting device.Type: GrantFiled: June 6, 2018Date of Patent: April 20, 2021Assignee: EPISTAR CORPORATIONInventors: Shih-I Chen, Chia-Liang Hsu, Tzu-Chieh Hsu, Han-Min Wu, Ye-Ming Hsu, Chien-Fu Huang, Chao-Hsing Chen, Chiu-Lin Yao, Hsin-Mao Liu, Chien-Kai Chung
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Publication number: 20200014294Abstract: Certain aspects of the present disclosure generally relate to methods and apparatus for providing surge protection for a switched-mode power supply (SMPS), such as a SMPS used in a battery-charging circuit. One example surge protection circuit generally includes an input node; an output node; a reference potential node; a transistor coupled between the input node and the output node; a diode device having an anode coupled to the input node and a cathode coupled to a control node of the transistor; a voltage-clamping circuit coupled between the output node and the control node; and a first switch coupled between the control node of the transistor and the reference potential node.Type: ApplicationFiled: April 1, 2019Publication date: January 9, 2020Inventors: Chunping SONG, Ye Ming LI, Guoyong GUO
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Publication number: 20180287031Abstract: A light-emitting device includes a supportive substrate and a first light-emitting element on the supportive substrate. The first light-emitting element includes a first light-emitting stacked layer having a first surface and a second surface opposite to the first surface, and a first transparent layer on the first surface and electrically connected to the first light-emitting stacked layer. A second light-emitting element locates on the supportive substrate and a metal layer electrically connects to the first light-emitting element and the second light-emitting element and physically connects to the first transparent layer. The first light-emitting stacked layer includes a first width and the first transparent layer includes a second width different from the first width from a cross section view of the light-emitting device.Type: ApplicationFiled: June 6, 2018Publication date: October 4, 2018Inventors: Shih-I CHEN, Chia-Liang HSU, Tzu-Chieh HSU, Han-Min WU, Ye-Ming HSU, Chien-Fu HUANG, Chao-Hsing CHEN, Chiu-Lin YAO, Hsin-Mao LIU, Chien-Kai CHUNG
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Patent number: 9997687Abstract: A light-emitting device comprising: a supportive substrate; a transparent layer formed on the supportive substrate, and the transparent layer comprising conductive metal oxide material; a light-emitting stacked layer comprising an active layer formed on the transparent layer; and an etching-stop layer formed between the light-emitting stacked layer and the supportive substrate and contacting the transparent layer, wherein a thickness of the etching-stop layer is thicker than that of the transparent layer.Type: GrantFiled: January 9, 2017Date of Patent: June 12, 2018Assignee: EPISTAR CORPORATIONInventors: Shih-I Chen, Chia-Liang Hsu, Tzu-Chieh Hsu, Han-Min Wu, Ye-Ming Hsu, Chien-Fu Huang, Chao-Hsing Chen, Chiu-Lin Yao, Hsin-Mao Liu, Chien-Kai Chung
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Patent number: 9793451Abstract: An encapsulated light-emitting diode device is disclosed. The encapsulated light-emitting diode device includes a circuit carrier including a surface; a light-emitting device including a transparent substrate, the transparent substrate including a first surface and a second surface, and the first surface and the surface of the circuit carrier includes an included angle larger than zero; a light-emitting diode chip located on the first surface of the transparent substrate; and a first transparent glue covering the light-emitting diode chip and formed on the first surface; and a second transparent glue formed on the second surface corresponding to the first transparent glue; wherein the first transparent glue has a circular projection on the first surface and the light-emitting diode chip is substantially located at the center of the circular projection.Type: GrantFiled: November 25, 2014Date of Patent: October 17, 2017Assignee: Epistar CorporationInventors: Chia-Liang Hsu, Han-Min Wu, Ye-Ming Hsu, Chien-Fu Huang, Tzu-Chieh Hsu, Min-Hsun Hsieh
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Publication number: 20170117450Abstract: A light-emitting device comprising: a supportive substrate; a transparent layer formed on the supportive substrate, and the transparent layer comprising conductive metal oxide material; a light-emitting stacked layer comprising an active layer formed on the transparent layer; and an etching-stop layer formed between the light-emitting stacked layer and the supportive substrate and contacting the transparent layer, wherein a thickness of the etching-stop layer is thicker than that of the transparent layer.Type: ApplicationFiled: January 9, 2017Publication date: April 27, 2017Inventors: Shih-I CHEN, Chia-Liang HSU, Tzu-Chieh HSU, Han-Min WU, Ye-Ming HSU, Chien-Fu HUANG, Chao-Hsing CHEN, Chiu-Lin YAO, Hsin-Mao LIU, Chien-Kai CHUNG
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Patent number: 9577170Abstract: A light-emitting device is disclosed. The light-emitting device comprises a supportive substrate; a first light-emitting element and a second light-emitting element on the supportive substrate, wherein the first light-emitting element comprises a transparent layer on the supportive substrate, a first light-emitting stacked layer on the transparent layer, and a plurality of contact parts between the transparent layer and the first light-emitting stacked layer; and the second light-emitting element comprises an electrode and a second light-emitting stacked layer between the electrode and the supportive substrate; and a metal line on the supportive substrate and electrically connecting the electrode and one of the contact parts.Type: GrantFiled: March 20, 2015Date of Patent: February 21, 2017Assignee: EPISTAR CORPORATIONInventors: Shih-I Chen, Chia-Liang Hsu, Tzu-Chieh Hsu, Han-Min Wu, Ye-Ming Hsu, Chien-Fu Huang, Chao-Hsing Chen, Chiu-Lin Yao, Hsin-Mao Liu, Chien-Kai Chung
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Patent number: 9478698Abstract: A light-emitting device is disclosed and comprises: a transparent substrate; a semiconductor light-emitting stack on the transparent substrate, wherein the semiconductor light-emitting stack comprises a first semiconductor layer close to the transparent substrate, a second semiconductor layer away from the transparent substrate, and a light-emitting layer capable of emitting a light disposed between the first semiconductor layer and the second semiconductor layer; and a bonding layer between the transparent substrate and the semiconductor light-emitting stack, wherein the bonding layer has a gradually changed refractive index, and each of critical angles at the bonding layer and the transparent substrate for the light emitted from the light-emitting layer towards the transparent substrate is larger than 35 degrees.Type: GrantFiled: February 6, 2014Date of Patent: October 25, 2016Assignee: EPISTAR CORPORATIONInventors: Tsung-Hsien Yang, Tzu-Chieh Hsu, Yi-Ming Chen, Yi-Tang Lai, Jhih-Jheng Yang, Chih-Wei Wei, Ching-Sheng Chen, Shih-I Chen, Chia-Liang Hsu, Ye-Ming Hsu
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Publication number: 20150194586Abstract: A light-emitting device is disclosed. The light-emitting device comprises a supportive substrate; a first light-emitting element and a second light-emitting element on the supportive substrate, wherein the first light-emitting element comprises a transparent layer on the supportive substrate, a first light-emitting stacked layer on the transparent layer, and a plurality of contact parts between the transparent layer and the first light-emitting stacked layer; and the second light-emitting element comprises an electrode and a second light-emitting stacked layer between the electrode and the supportive substrate; and a metal line on the supportive substrate and electrically connecting the electrode and one of the contact parts.Type: ApplicationFiled: March 20, 2015Publication date: July 9, 2015Inventors: Shih-I CHEN, Chia-Liang HSU, Tzu-Chieh HSU, Han-Min WU, Ye-Ming HSU, Chien-Fu HUANG, Chao-Hsing CHEN, Chiu-Lin YAO, Hsin-Mao LIU, Chien-Kai CHUNG
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Patent number: 9012948Abstract: A light-emitting element includes a supportive substrate; a reflective layer formed on the supportive substrate; a transparent layer formed on the reflective layer; a light-emitting stacked layer formed on the transparent layer; an etching-stop layer formed between the transparent layer and the reflective layer; and a plurality of contact parts formed between the light-emitting stacked layer and the transparent layer.Type: GrantFiled: July 1, 2011Date of Patent: April 21, 2015Assignee: Epistar CorporationInventors: Shih-I Chen, Chia-Liang Hsu, Tzu-Chieh Hsu, Han-Min Wu, Ye-Ming Hsu, Chien-Fu Huang, Chao-Hsing Chen, Chiu-Lin Yao, Hsin-Mao Liu, Chien-Kai Chun
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Publication number: 20140225138Abstract: A light-emitting device is disclosed and comprises: a transparent substrate; a semiconductor light-emitting stack on the transparent substrate, wherein the semiconductor light-emitting stack comprises a first semiconductor layer close to the transparent substrate, a second semiconductor layer away from the transparent substrate, and a light-emitting layer capable of emitting a light disposed between the first semiconductor layer and the second semiconductor layer; and a bonding layer between the transparent substrate and the semiconductor light-emitting stack, wherein the bonding layer has a gradually changed refractive index, and each of critical angles at the bonding layer and the transparent substrate for the light emitted from the light-emitting layer towards the transparent substrate is larger than 35 degrees.Type: ApplicationFiled: February 6, 2014Publication date: August 14, 2014Applicant: Epistar CorporationInventors: Tsung-Hsien YANG, Tzu-Chieh HSU, Yi-Ming CHEN, Yi-Tang LAI, Jhih-Jheng YANG, Chih-Wei WEI, Ching-Sheng CHEN, Shih-I CHEN, Chia-Liang HSU, Ye-Ming HSU
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Publication number: 20120080697Abstract: A light-emitting element includes a supportive substrate; a reflective layer formed on the supportive substrate; a transparent layer formed on the reflective layer; a light-emitting stacked layer formed on the transparent layer; an etching-stop layer formed between the transparent layer and the reflective layer; and a plurality of contact parts formed between the light-emitting stacked layer and the transparent layer.Type: ApplicationFiled: July 1, 2011Publication date: April 5, 2012Applicant: Epistar CorporationInventors: Shih-I Chen, Chia-Liang Hsu, Tzu-Chieh Hsu, Han-Min Wu, Ye-Ming Hsu, Chien-Fu Huang, Chao-Hsing Chen, Chiu-Lin Yao, Hsin-Mao Liu, Chien-Kai Chun
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Patent number: 7775979Abstract: An ultrasonic transducer probe having a highly integrated interface circuit array. Low-voltage transmit control signals from the system are transmitted on the system transmit channels via the ultrasound probe cable and into the interface circuit array. These transmit control signals are routed through the interface circuit array using a dense switching matrix. Once the low-voltage transmit control signals reach individual cells within the interface array, they are decoded and used to control local high-voltage pulser circuits to drive individual ultrasound transducer elements made up of selected subelements that are co-integrated with the interface electronics. The interface cell circuitry further comprises a high-voltage transmit/receive switch, which is closed when the high-voltage pulser is transmitting to protect the low-voltage components.Type: GrantFiled: June 29, 2005Date of Patent: August 17, 2010Assignee: General Electric CompanyInventors: Kai E. Thomenius, Robert Gideon Wodnicki, Ye-Ming Li
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Publication number: 20090105359Abstract: Disclosed is a method for the production of highly stable, liquid isocyanurate-modified PMDI compositions having relatively higher viscosity and a generally comparable functionality, as compared to conventional PMDI. An admixture of the isocyanurate-modified PMDI with conventional PMDI is suitable for use in the manufacture of a variety of polyurethane products, including rigid and flexible foams, coatings, elastomers and sealants. Foams produced using this admixture exhibit properties that are comparable to foams produced from standard polymeric MDI of comparable viscosity that don't contain isocyanurate moieties.Type: ApplicationFiled: September 16, 2008Publication date: April 23, 2009Inventors: James O'Connor, Ye Ming
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Publication number: 20090082481Abstract: Disclosed is a method for the production of highly stable, liquid isocyanurate-modified PMDI compositions having relatively higher viscosity and a generally comparable functionality, as compared to conventional PMDI. An admixture of the isocyanurate-modified PMDI with conventional PMDI is suitable for use in the manufacture of a variety of polyurethane products, including rigid and flexible foams, coatings, elastomers and sealants. Foams produced using this admixture exhibit properties that are comparable to foams produced from standard polymeric MDI of comparable viscosity that don't contain isocyanurate moieties.Type: ApplicationFiled: September 21, 2007Publication date: March 26, 2009Inventors: James O'Connor, Ye Ming
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Patent number: 7293462Abstract: A device comprising an array of sensors and a multiplicity of bus lines, each sensor being electrically connected to a respective bus line and comprising a respective multiplicity of groups of micromachined sensor cells, the sensor cell groups of a particular sensor being electrically coupled to each other via the bus line to which that sensor is connected, each sensor cell group comprising a respective multiplicity of micromachined sensor cells that are electrically interconnected to each other and not switchably disconnectable from each other, the device further comprising means for isolating any one of the sensor cell groups from its associated bus line and in response to any one of the micromachined sensor cells of that sensor cell group being short-circuited to ground. In one implementation, the isolating means comprise a multiplicity of fuses.Type: GrantFiled: January 4, 2005Date of Patent: November 13, 2007Assignee: General Electric CompanyInventors: Warren Lee, David Martin Mills, Glenn Scott Claydon, Kenneth Wayne Rigby, Wei-Cheng Tian, Ye-Ming Li, Jie Sun, Lowell Scott Smith, Stanley Chienwu Chu, Sam Yie-Sum Wong, Hyon-Jin Kwon
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Publication number: 20070016026Abstract: An ultrasonic transducer probe having a highly integrated interface circuit array. Low-voltage transmit control signals from the system are transmitted on the system transmit channels via the ultrasound probe cable and into the interface circuit array. These transmit control signals are routed through the interface circuit array using a dense switching matrix. Once the low-voltage transmit control signals reach individual cells within the interface array, they are decoded and used to control local high-voltage pulser circuits to drive individual ultrasound transducer elements made up of selected subelements that are co-integrated with the interface electronics. The interface cell circuitry further comprises a high-voltage transmit/receive switch, which is closed when the high-voltage pulser is transmitting to protect the low-voltage components.Type: ApplicationFiled: June 29, 2005Publication date: January 18, 2007Inventors: Kai Thomenius, Robert Wodnicki, Ye-Ming Li
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Publication number: 20060145059Abstract: A device comprising an array of sensors and a multiplicity of bus lines, each sensor being electrically connected to a respective bus line and comprising a respective multiplicity of groups of micromachined sensor cells, the sensor cell groups of a particular sensor being electrically coupled to each other via the bus line to which that sensor is connected, each sensor cell group comprising a respective multiplicity of micromachined sensor cells that are electrically interconnected to each other and not switchably disconnectable from each other, the device further comprising means for isolating any one of the sensor cell groups from its associated bus line and in response to any one of the micromachined sensor cells of that sensor cell group being short-circuited to ground. In one implementation, the isolating means comprise a multiplicity of fuses.Type: ApplicationFiled: January 4, 2005Publication date: July 6, 2006Inventors: Warren Lee, David Mills, Glenn Claydon, Kenneth Rigby, Wei-Cheng Tian, Ye-Ming Li, Jie Sun, Lowell Smith, Stanley Chu, Sam Wong, Hyon-Jin Kwon
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Publication number: 20060004289Abstract: A capacitive micromachined ultrasound transducer (cMUT) comprises a lower electrode. Furthermore, the cMUT includes a diaphragm disposed adjacent to the lower electrode such that a gap having a first gap width is formed between the diaphragm and the lower electrode. Additionally, the cMUT includes at least one element formed in the gap, where the at least one element is arranged to provide a second gap width between the diaphragm and the lower electrode.Type: ApplicationFiled: June 30, 2004Publication date: January 5, 2006Inventors: Wei-Cheng Tian, Warren Lee, Lowell Smith, Ye-Ming Li, Jie Sun
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Patent number: 5731552Abstract: Interference between sound waves of different frequencies in a speaker system having a woofer and associated transmission tube are eliminated by securing a sound absorbing diaphragm to the output end of the tube to absorb sharp and high frequency sound waves while permitting low frequency sound waves to be transmitted through the diaphragm.Type: GrantFiled: May 21, 1996Date of Patent: March 24, 1998Inventor: Ye-Ming Tsao