Patents by Inventor Ye-Ning Chen

Ye-Ning Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing multilayer printed circuit board with plated through holes
    Patent number: 8302300
    Abstract: A method for manufacturing multilayer printed circuit board includes steps below. A first copper clad laminate includes a central portion and a peripheral portion is provided. A group of concentric copper annular collars is formed by etching the peripheral portion. A second copper clad laminate and an adhesive layer is laminated on to the first copper clad laminate in a manner that the adhesive is sandwiched between the first copper clad laminate and the second copper clad laminate to form a multilayer substrate. A detection hole is formed run through the multilayer substrate. An offset distance is determined and plated through holes in the central portion of the multilayer substrate is formed based on the offset distance.
    Type: Grant
    Filed: April 28, 2011
    Date of Patent: November 6, 2012
    Assignees: FuKui Precision Component (Shenzhen) Co., Ltd., Zhen Ding Technology Co., Ltd.
    Inventor: Ye-Ning Chen
  • METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD WITH PLATED THROUGH HOLES
    Publication number: 20110308082
    Abstract: A method for manufacturing multilayer printed circuit board includes steps below. A first copper clad laminate includes a central portion and a peripheral portion is provided. A group of concentric copper annular collars is formed by etching the peripheral portion. A second copper clad laminate and an adhesive layer is laminated on to the first copper clad laminate in a manner that the adhesive is sandwiched between the first copper clad laminate and the second copper clad laminate to form a multilayer substrate. A detection hole is formed run through the multilayer substrate. An offset distance is determined and plated through holes in the central portion of the multilayer substrate is formed based on the offset distance.
    Type: Application
    Filed: April 28, 2011
    Publication date: December 22, 2011
    Applicants: FOXCONN ADVANCED TECHNOLOGY INC., FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
    Inventor: YE-NING CHEN