Patents by Inventor Ye Rin Ryu

Ye Rin Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250115790
    Abstract: The present disclosure provides an adhesive constructure including: a substrate and a hollow structure disposed to protrude on the substrate, wherein the hollow structure includes a hollow support portion protruding from the substrate and fixed on the substrate and an adhesive portion disposed below the hollow support portion and exposed to the outside, and the adhesive portion has a larger swelling ratio than the hollow support portion and the adhesive portion has a hollow horn shape of which volume expands in a wet state.
    Type: Application
    Filed: October 2, 2024
    Publication date: April 10, 2025
    Applicant: FOUNDATION FOR RESEARCH AND BUSINESS, SEOUL NATIONAL UNIV. SCIENCE AND TECH.
    Inventors: Hyunsik YOON, Hye Min Lee, Ye Rin Ryu