Patents by Inventor Ye Seul SHIN

Ye Seul SHIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240059890
    Abstract: A thermoplastic resin composition of the present invention comprises: approximately 100 parts by weight of a polyester resin; approximately 5-30 parts by weight of a polycarbonate resin; approximately 50-150 parts by weight of a flat glass fiber; approximately 2-10 parts by an epoxy-modified olefin-based copolymer; and approximately 2-10 parts by weight of a maleic anhydride-modified ethylene-propylene-diene monomer terpolymer, wherein the weight ratio of the epoxy-modified olefin-based copolymer and the maleic anhydride-modified ethylene-propylene-diene monomer terpolymer is approximately 1:0.5 to 1:2. The thermoplastic resin composition has excellent metal bonding property, impact resistance, stiffness, retention heat stability, balance of physical properties thereof, and the like.
    Type: Application
    Filed: December 1, 2021
    Publication date: February 22, 2024
    Inventors: Yeong Deuk SEO, Min Soo LEE, Ye Seul SHIN, Bong Jae LEE
  • Publication number: 20220380597
    Abstract: A thermoplastic resin composition comprises: about 100 parts by weight of a polycarbonate resin; about 3 parts by weight to about 20 parts by weight of a rubber-modified aromatic vinyl copolymer resin; about 12 parts by weight to about 28 parts by weight of talc having an average particle size of about 8 ?m to about 20 ?m and a blackness degree L* of less than about 90; about 5 parts by weight to about 20 parts by weight of acicular inorganic fillers; and about 10 parts by weight to about 30 parts by weight of a phosphorus flame retardant. The thermoplastic resin composition can have good properties in terms of light shielding, impact resistance, dimensional stability, flame retardancy, balance therebetween, and the like.
    Type: Application
    Filed: May 26, 2022
    Publication date: December 1, 2022
    Inventors: Ki Hong CHOI, Tae Gon KANG, Dong Yeop SHIN, Ye Seul SHIN, Sung Woo YANG, Seo Yun LEE, Dong In HA