Patents by Inventor Ye-Yong Kim
Ye-Yong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8409338Abstract: The present invention relates to a cooling system. More particularly, the present invention relates to a cooling system for removing dust from air being drawn for cooling heat generation components of an electronic product, for improving convenience in maintenance or repair of the electronic product.Type: GrantFiled: June 15, 2010Date of Patent: April 2, 2013Assignee: LG Electronics Inc.Inventors: Ye Yong Kim, Dong Joon Choi
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Patent number: 8400766Abstract: The present invention relates to a device for eliminating dust for a computer and a control method thereof. A control unit and a heat-radiating fan controlled by the control unit are provided in the main body. In addition, there is provided a cooling fin through which air stream formed by the heat-radiating fan passes. While the air stream formed by the heat-radiating fan passes through the cooling fan, heat is exchanged between the air stream and the cooling fin and the air stream is then exhausted to the outside of the main body. A vibration-generating element for generating vibration supplied with power is provided at one side of the cooling fin. The control unit controls the driving of the vibration-generating element. Vibration of the vibration-generating element is transmitted to the cooling fin to shake off dust accumulated on the cooling fin. Then, the air stream formed by the heat-radiating fan is exhausted to the outside of the main body together with the dust.Type: GrantFiled: September 29, 2008Date of Patent: March 19, 2013Assignee: LG Electronics Inc.Inventor: Ye-Yong Kim
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Patent number: 8307885Abstract: The present invention relates to a cooling apparatus for an electronic device. In the present invention, a coolant passing through a condenser 10 is introduced into and s filled in a compensator 15. The coolant passing through the compensator 15 is introduced into a vaporizer 20 and vaporized through heat exchange with an auxiliary heat source H2 provided outside of the vaporizer. In addition, a vaporizing unit 22 made of a porous material is provided in the vaporizer 20. The coolant passing through the vaporizer 20 and a liquid coolant supplied from the condenser 10 are mixed in a vortex generating unit 30 to form a coolant spray, and the coolant spray moves along a spiral trajectory to be formed into a vortex. Meanwhile, the coolant spray of a vortex is injected to be in close contact with the inner wall of an evaporator 50 to be heat-exchanged with a main heat source H1 positioned outside of the evaporator, thereby cooling the main heat source H1.Type: GrantFiled: February 20, 2009Date of Patent: November 13, 2012Assignees: LG Electronics Inc., Korea University Industrial & Academic Collaboration FoundationInventors: Ye-Yong Kim, Young-Don Choi
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Publication number: 20110027137Abstract: The present invention relates to a cooling system. More particularly, the present invention relates to a cooling system for removing dust from air being drawn for cooling heat generation components of an electronic product, for improving convenience in maintenance or repair of the electronic product.Type: ApplicationFiled: June 15, 2010Publication date: February 3, 2011Inventors: Ye Yong Kim, Dong Joon Choi
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Publication number: 20090320500Abstract: The present invention relates to a cooling apparatus for an electronic device. In the present invention, a coolant passing through a condenser 10 is introduced into and s filled in a compensator 15. The coolant passing through the compensator 15 is introduced into a vaporizer 20 and vaporized through heat exchange with an auxiliary heat source H2 provided outside of the vaporizer. In addition, a vaporizing unit 22 made of a porous material is provided in the vaporizer 20. The coolant passing through the vaporizer 20 and a liquid coolant supplied from the condenser 10 are mixed in a vortex generating unit 30 to form a coolant spray, and the coolant spray moves along a spiral trajectory to be formed into a vortex. Meanwhile, the coolant spray of a vortex is injected to be in close contact with the inner wall of an evaporator 50 to be heat-exchanged with a main heat source H1 positioned outside of the evaporator, thereby cooling the main heat source H1.Type: ApplicationFiled: February 20, 2009Publication date: December 31, 2009Inventors: Ye-Yong KIM, Young-Don Choi
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Publication number: 20090272404Abstract: The present invention relates to a device for eliminating dust for a computer and a control method thereof. A control unit and a heat-radiating fan controlled by the control unit are provided in the main body. In addition, there is provided a cooling fin through which air stream formed by the heat-radiating fan passes. While the air stream formed by the heat-radiating fan passes through the cooling fan, heat is exchanged between the air stream and the cooling fin and the air stream is then exhausted to the outside of the main body. A vibration-generating element for generating vibration supplied with power is provided at one side of the cooling fin. The control unit controls the driving of the vibration-generating element. Vibration of the vibration-generating element is transmitted to the cooling fin to shake off dust accumulated on the cooling fin. Then, the air stream formed by the heat-radiating fan is exhausted to the outside of the main body together with the dust.Type: ApplicationFiled: September 29, 2008Publication date: November 5, 2009Inventor: Ye-Yong Kim
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Patent number: 7325590Abstract: A cooling structure for a portable computer includes a cooling fan creating an air stream to release heat generated in a main body of the computer to the outside through at least one vent. First and second heat pipes transfer heat generated in first and second heat sources on a main board of the computer to a path of the air stream. A portion of the air stream is also directed to the interior of the main body.Type: GrantFiled: October 18, 2004Date of Patent: February 5, 2008Assignee: LG Electronics Inc.Inventors: Ye Yong Kim, Ki Tak Ko
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Patent number: 7312985Abstract: Disclosed is a cooler of a notebook personal computer allowing more much heat to be rapidly discharged to the outside. The cooler includes: a heat absorbing part fan for absorbing heat generated from a heat generation device of the notebook personal computer; a cooling fan for blowing air in front and side directions; at least two heat pipes of which one ends are in contact with the heat absorbing part and the other ends extend to the front and side of the cooling fan; at least two heat radiation parts provided to be facially in contact with the other ends of the heat pipes; and a lower case having a plurality of grids provided at a corner portion facing the heat radiation parts, from which air heated by the heat generation parts is forcibly discharged.Type: GrantFiled: March 7, 2003Date of Patent: December 25, 2007Assignee: LG Electronics Inc.Inventors: Harrison Lee, Ye Yong Kim
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Patent number: 7188484Abstract: Embodiments of a heat dissipating structure and method for a mobile device can cool components of a mobile terminal. The heat-dissipating structure can include a case, a device mounted in the case that generates heat in connection with its operation, and a cooling unit. The cooling unit can include a housing having a refrigerant therein, a first heat exchanging part for absorbing the heat through a thermal contact with the device and a second heat exchanging part for dissipating the heat.Type: GrantFiled: February 26, 2004Date of Patent: March 13, 2007Assignee: LG Electronics Inc.Inventor: Ye-Yong Kim
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Patent number: 7184265Abstract: A cooling system for a portable computer can include a frame having a heat-source connecting unit in its one side and having a fan housing unit in its other side. A dissipating unit on one side of the fan housing unit performs heat exchange and a dissipating fan forms an air stream that can pass through the dissipating unit. A plate-shaped cooling unit coupled to one side of the frame can deliver heat from the heat-source connecting unit to the dissipating unit. The cooling unit can include a micro cooling unit that performs heat exchange using a cooling cycle through phase change or a plate-heat pipe filled with liquid. According to embodiments of the present invention, a thickness of the cooling system can be reduced and cooling capability efficiency can be increased.Type: GrantFiled: February 26, 2004Date of Patent: February 27, 2007Assignee: LG Electronics Inc.Inventors: Ye-Yong Kim, Harrison Ford Lee, Jin-Kwan Choi
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Publication number: 20040244397Abstract: Embodiments of a heat dissipating structure and method for a mobile device can cool components of a mobile terminal. The heat-dissipating structure can include a case, a device mounted in the case that generates heat in connection with its operation, and a cooling unit. The cooling unit can include a housing having a refrigerant therein, a first heat exchanging part for absorbing the heat through a thermal contact with the device and a second heat exchanging part for dissipating the heat.Type: ApplicationFiled: February 26, 2004Publication date: December 9, 2004Applicant: LG Electronics Inc.Inventor: Ye-Yong Kim
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Publication number: 20040240178Abstract: A cooling system for a portable computer can include a frame having a heat-source connecting unit in its one side and having a fan housing unit in its other side. A dissipating unit on one side of the fan housing unit performs heat exchange and a dissipating fan forms an air stream that can pass through the dissipating unit. A plate-shaped cooling unit coupled to one side of the frame can deliver heat from the heat-source connecting unit to the dissipating unit. The cooling unit can include a micro cooling unit that performs heat exchange using a cooling cycle through phase change or a plate-heat pipe filled with liquid. According to embodiments of the present invention, a thickness of the cooling system can be reduced and cooling capability efficiency can be increased.Type: ApplicationFiled: February 26, 2004Publication date: December 2, 2004Applicant: LG Electronics Inc.Inventors: Ye-Yong Kim, Harrison Ford Lee, Jin-Kwan Choi
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Publication number: 20030161102Abstract: Disclosed is a cooler of a notebook personal computer allowing more much heat to be rapidly discharged to the outside. The cooler includes: a heat absorbing part fan for absorbing heat generated from a heat generation device of the notebook personal computer; a cooling fan for blowing air in front and side directions; at least two heat pipes of which one ends are in contact with the heat absorbing part and the other ends extend to the front and side of the cooling fan; at least two heat radiation parts provided to be facially in contact with the other ends of the heat pipes; and a lower case having a plurality of grids provided at a corner portion facing the heat radiation parts, from which air heated by the heat generation parts is forcibly discharged.Type: ApplicationFiled: March 7, 2003Publication date: August 28, 2003Inventors: Harrison Lee, Ye Yong Kim