Patents by Inventor Yea Z. Kuo

Yea Z. Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7689757
    Abstract: Application Specific Integrated Circuit (“ASIC”) devices, such as Field Programmable Gate Arrays (“FPGAs”), may be interconnected using serial I/O connections, such as high speed multi-gigabit serial transceiver (“MGT”) connections. For example, serial I/O connections may be employed to interconnect a pair of ASICs to create a high bandwidth, low signal count connection, and in a manner so that any given pair of multiple ASIC devices on a single circuit card may communicate with each other through no more than one serial data communication link connection step. A reconfigurable hardware architecture (“RHA”) may be configured to include a communications infrastructure that uses a high-bandwidth packet router to establish standard communications protocols between multiple interfaces and/or multiple devices that may be present on a single circuit card. Additionally, a communications infrastructure may be established across multiple circuit cards.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: March 30, 2010
    Assignee: L-3 Communications Intergrated Systems, L.P.
    Inventors: Jerry W. Yancey, Yea Z. Kuo
  • Patent number: 7587441
    Abstract: Systems and methods for providing a weighted overlap and add (WOLA) architecture and/or for providing polyphase WOLA FFT processing that may be employed, for example, for separation or channelization of closely-spaced frequencies of an input signal. A WOLA architecture that may be implemented as first-in-first-out (FIFO) cores in an FPGA or ASIC device. The FIFO cores may be pre-existing (e.g., provided as free FIFO cores in a commercial off the shelf (COTS) FPGA device) or may be custom-programmed into a custom ASIC device.
    Type: Grant
    Filed: June 29, 2005
    Date of Patent: September 8, 2009
    Assignee: L-3 Communications Integrated Systems L.P.
    Inventors: Jerry W. Yancey, Yea Z. Kuo
  • Patent number: 7444454
    Abstract: Application Specific Integrated Circuit (“ASIC”) devices, such as Field Programmable Gate Arrays (“FPGAs”), may be interconnected using serial I/O connections, such as high speed multi-gigabit serial transceiver (“MGT”) connections. For example, serial I/O connections may be employed to interconnect a pair of ASICs to create a high bandwidth, low signal count connection, and in a manner so that any given pair of multiple ASIC devices on a single circuit card may communicate with each other through no more than one serial data communication link connection step. A reconfigurable hardware architecture (“RHA”) may be configured to include a communications infrastructure that uses a high-bandwidth packet router to establish standard communications protocols between multiple interfaces and/or multiple devices that may be present on a single circuit card. Additionally, a communications infrastructure may be established across multiple circuit cards.
    Type: Grant
    Filed: May 11, 2004
    Date of Patent: October 28, 2008
    Assignee: L-3 Communications Integrated Systems L.P.
    Inventors: Jerry W. Yancey, Yea Z. Kuo
  • Patent number: 7426599
    Abstract: Application Specific Integrated Circuit (“ASIC”) devices, such as Field Programmable Gate Arrays (“FPGAs”), may be interconnected using serial I/O connections, such as high speed multi-gigabit serial transceiver (“MGT”) connections. For example, serial I/O connections may be employed to interconnect a pair of ASICs to create a high bandwidth, low signal count connection, and in a manner so that any given pair of multiple ASIC devices on a single circuit card may communicate with each other through no more than one serial data communication link connection step. A reconfigurable hardware architecture (“RHA”) may be configured to include a communications infrastructure that uses a high-bandwidth packet router to establish standard communications protocols between multiple interfaces and/or multiple devices that may be present on a single circuit card. Additionally, a communications infrastructure may be established across multiple circuit cards.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: September 16, 2008
    Assignee: L-3 Communications Integrated Systems L.P.
    Inventors: Jerry W. Yancey, Yea Z. Kuo