Abstract: In some implementations, an electronic device includes a display stack to display content. The display stack can include a number of substrates coupled using a liquid optically clear adhesive (LOCA). In some implementations, the LOCA can have a modulus of elasticity of no greater than 80,000 Pa. Additionally, the display stack can be formed using a process that includes applying an external force to the display stack by placing the display stack between two fixtures. In an implementation, the external force can be applied while heating the display stack at a temperature of at least 60° C. and cooling the display stack according to a particular cooling rate.

Abstract: This disclosure describes methods and devices useful for adhering a first substrate of a display to a second substrate of the display. In example embodiments, a first plate may be sealed to the first substrate, and a second plate may be sealed to the second substrate. In addition, a layer of adhesive may be disposed between the first and second substrates to assist in adhering the first substrate to the second substrate. A pressure may then be applied to the first and second plates as well as the first and second substrates to assist in the adhesion process. In example embodiments, the first plate may assist in applying pressure proximate a perimeter of the first substrate such that the perimeter of the first substrate adheres to a perimeter of the second substrate.

Abstract: In some implementations, an electronic device includes a display stack to display content. The display stack can include a number of substrates coupled using a liquid optically clear adhesive (LOCA). In some implementations, the LOCA can have a modulus of elasticity of no greater than 80,000 Pa. Additionally, the display stack can be formed using a process that includes applying an external force to the display stack by placing the display stack between two fixtures. In an implementation, the external force can be applied while heating the display stack at a temperature of at least 60° C. and cooling the display stack according to a particular cooling rate.

Abstract: A side surface of a cover glass of an electronic device may be coated with a curable ink to reduce leakage of light from the side surface. The ink may be deposited on the side surface via a pen comprising a reservoir, a valve, and a nib. The nib may comprise a fiber bundle through which pigment particles may pass. The ink may be precisely deposited via the nib on the side surface without visible ink overflowing to a front surface or a back surface of the cover glass.

Abstract: In some implementations, a process includes forming a layer of a liquid optically clear adhesive (LOCA) on a surface of a first substrate. Additionally, the LOCA can be contacted with a surface of a second substrate. The LOCA can then be exposed to Ultraviolet (UV) radiation. After exposing the LOCA to UV radiation, additional substrates can be coupled to the first substrate, the second substrate, or both to form a display stack. In an implementation, the total energy/unit area for the UV radiation applied to the LOCA can be no greater than 25,000 kJ/cm2.