Abstract: In one embodiment, a light-emitting device having a reflector cup, a light source die, a wavelength-converting layer, an optical structure, and an encapsulant is disclosed. The wavelength-converting layer may be configured to convert a narrow band light emitted from the light source die into a broad band light before the light is directed towards a first direction. The optical element may be an air ring embedded within the encapsulant and may be arranged circumscribing the wavelength-converting layer. In another embodiment, a light-emitting device with extended wavelength-converting layer in place of the air ring is presented.

Abstract: In one embodiment, a light-emitting device having a reflector cup, a light source die, a wavelength-converting layer, an optical structure, and an encapsulant is disclosed. The wavelength-converting layer may be configured to convert a narrow band light emitted from the light source die into a broad band light before the light is directed towards a first direction. The optical element may be an air ring embedded within the encapsulant and may be arranged circumscribing the wavelength-converting layer. In another embodiment, a light-emitting device with extended wavelength-converting layer in place of the air ring is presented.

Abstract: A light-emitting device having a through-hole cavity is disclosed. The optical device may contain a plurality of conductors, a light source die, a body and a transparent encapsulant material. The body may have a top surface and a bottom surface. A cavity is formed within the body extending from the bottom surface to the top surface and defining therein a bottom opening and a top opening, respectively. Optionally, the light-emitting device may comprise a lens. During manufacturing process, liquid or semi-liquid form transparent material is injected from the bottom surface into the cavity, encapsulating the light source die and forming a lens. The shape of the lens is defined by a mold aligned to the top opening of the body. In yet another embodiment, optical devices having a cavity or multiple cavities are disclosed. The optical devices may include a proximity sensor, an opto-coupler, an encoder and other similar sensors.

Abstract: A reflector housing having a plurality of cavities formed therein, and a plurality of light emitters mounted in the plurality of cavities. Each of the plurality of cavities contains a single one of the plurality of light emitters.

Abstract: A package for multiple light sources is described. The package includes a plurality of light sources aligned along a first axis and a lens substantially encapsulating the plurality of light source. The lens is designed as a mono-optical lens meaning that a radius of curvature is only created along the first axis of the lens. The lens includes substantially no radius of curvature along a second axis that is perpendicular to the first axis.

Abstract: An illumination device is disclosed. The illumination device includes a light source a pre-dip material that at least partially encapsulates the light source. The pre-dip material may include one or both of thermally-conductive particles and a cyclo-aliphatic composition. The pre-dip material may further include a resin and a hardener for the resin. Methods of manufacturing an illumination device are also disclosed.

Abstract: An illumination device is disclosed. The illumination device includes a light source a pre-dip material that at least partially encapsulates the light source. The pre-dip material may include one or both of thermally-conductive particles and a cyclo-aliphatic composition. The pre-dip material may further include a resin and a hardener for the resin. Methods of manufacturing an illumination device are also disclosed.

Abstract: A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package is configured to support a plurality of light sources. The light sources may be mounted on a mounting section of the PLCC package's lead frame and the mounting section of the lead frame may extend diagonally with respect to the housing of the lead frame.

Abstract: An illumination device is disclosed. The illumination device includes a light source and a remoter phosphor configured to alter the color of light emitted by the light source. The remoter phosphor is provided with a substantially hemispherical shape that substantially corresponds to a radiation pattern of the light source, which helps to reduce or eliminate the occurrence of the yellow ring phenomenon, among other things. Methods of manufacturing an illumination device are also disclosed.

Abstract: A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package is configured to support a plurality of light sources. The light sources may be mounted on a mounting section of the PLCC package's lead frame and the mounting section of the lead frame may extend diagonally with respect to the housing of the lead frame.

Abstract: A light-emitting device having a through-hole cavity is disclosed. The optical device may contain a plurality of conductors, a light source die, a body and a transparent encapsulant material. The body may have a top surface and a bottom surface. A cavity is formed within the body extending from the bottom surface to the top surface and defining therein a bottom opening and a top opening, respectively. Optionally, the light-emitting device may comprise a lens. During manufacturing process, liquid or semi-liquid form transparent material is injected from the bottom surface into the cavity, encapsulating the light source die and forming a lens. The shape of the lens is defined by a mold aligned to the top opening of the body. In yet another embodiment, optical devices having a cavity or multiple cavities are disclosed. The optical devices may include a proximity sensor, an opto-coupler, an encoder and other similar sensors.

Abstract: A light-emitting device having a through-hole cavity is disclosed. The optical device may contain a plurality of conductors, a light source die, a body and a transparent encapsulant material. The body may have a top surface and a bottom surface. A cavity is formed within the body extending from the bottom surface to the top surface and defining therein a bottom opening and a top opening, respectively. Optionally, the light-emitting device may comprise a lens. During manufacturing process, liquid or semi-liquid form transparent material is injected from the bottom surface into the cavity, encapsulating the light source die and forming a lens. The shape of the lens is defined by a mold aligned to the top opening of the body. In yet another embodiment, optical devices having a cavity or multiple cavities are disclosed. The optical devices may include a proximity sensor, an opto-coupler, an encoder and other similar sensors.

Abstract: A light-emitting device having a through-hole cavity is disclosed. The optical device may contain a plurality of conductors, a light source die, a body and a transparent encapsulant material. The body may have a top surface and a bottom surface. A cavity is formed within the body extending from the bottom surface to the top surface and defining therein a bottom opening and a top opening, respectively. Optionally, the light-emitting device may comprise a lens. During manufacturing process, liquid or semi-liquid form transparent material is injected from the bottom surface into the cavity, encapsulating the light source die and forming a lens. The shape of the lens is defined by a mold aligned to the top opening of the body. In yet another embodiment, optical devices having a cavity or multiple cavities are disclosed. The optical devices may include a proximity sensor, an opto-coupler, an encoder and other similar sensors.

Abstract: The light intensity emitted from a package is increased by adjusting a portion of the package encapsulant so that light impacting the side walls of the adjusted encapsulant portion will encounter total internal reflection (TIR) with the reflected light directed toward the top surface of the package. The adjusted portion of the package is positioned so that air can be used as the second (exterior) medium with the critical TIR angle being such that light emitted from a light source (such as from an LED die) will be directed primarily so as to escape the package from the top surface as opposed to being scattered internal to the package. In one embodiment, a lower portion of the encapsulant is surrounded by a casing to inwardly direct light from the light source that impacts the side of the encapsulant with an angle less than the critical TIR angle.

Abstract: One embodiment of a method for configuring consumption of service includes identifying a service to be consumed by a user, identifying a plurality of bearer technologies across which at least one electronic device can access the service, selecting one of the plurality of bearer technologies for use in configuring the at least one electronic device, and configuring the at least one electronic device for the service using one of a plurality of management frameworks according to the selected bearer technology.

Abstract: One embodiment of a method for configuring consumption of service includes identifying a service to be consumed by a user, identifying a plurality of bearer technologies across which at least one electronic device can access the service, selecting one of the plurality of bearer technologies for use in configuring the at least one electronic device, and configuring the at least one electronic device for the service using one of a plurality of management frameworks according to the selected bearer technology.

Abstract: An exemplary embodiment of an illumination assembly includes a reflector housing having a plurality of cavities formed therein, an a plurality of light emitters mounted in the plurality of cavities. Each of the plurality of cavities contains a single one of the plurality of light emitters.

Abstract: The light intensity emitted from a package is increased by adjusting a portion of the package encapsulant so that light impacting the side walls of the adjusted encapsulant portion will encounter total internal reflection (TIR) with the reflected light directed toward the top surface of the package. The adjusted portion of the package is positioned so that air can be used as the second (exterior) medium with the critical TIR angle being such that light emitted from a light source (such as from an LED die) will be directed primarily so as to escape the package from the top surface as opposed to being scattered internal to the package. In one embodiment, a lower portion of the encapsulant is surrounded by a casing to inwardly direct light from the light source that impacts the side of the encapsulant with an angle less than the critical TIR angle.

Abstract: A technique for collimating light from a Light Emitting Diode (LED) device involves emitting light from an LED die, collimating the light with a parabolic reflector, and further collimating the light with a lens. A device constructed according to the technique includes an LED die, a lens for collimating light, and a parabolic reflector for collimating light from the LED die toward the lens.