Patents by Inventor Yean Wei YEAP

Yean Wei YEAP has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12361257
    Abstract: Electrical circuit for a smart card chip module, including an insulating layer having a front main face and a rear main face. An antenna is made in a first conductive layer laying on the rear main face. This antenna extends over an antenna area delimited by a peripheral edge. The antenna includes at least one inner loop and one outer loop. The outer loop runs along the peripheral edge except over at least one first connecting segment diverted from the peripheral edge, towards or in a central zone of the antenna area. Further, the outer loop of the antenna includes at least a second connecting segment diverted from the peripheral edge towards a central zone of the antenna area.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: July 15, 2025
    Assignee: Linxens Holding
    Inventors: Yean Wei Yeap, Wen Qiang Chin
  • Publication number: 20250021786
    Abstract: The present disclosure refers to a printed circuit for integration in a smart card, wherein the printed circuit comprises a printed circuit substrate of dielectric material, an antenna having a resonance frequency, one or more contact pads forming an external contact pattern, and at least one surface mount (SMD) capacitor connected to the antenna so as to adjust its resonance frequency, in order to match a predefined resonance frequency, for instance a resonance frequency comprised within the range defined in ISO 14443 standards. The present disclosure also refers to a module comprising the above-indicated printed circuit and an IC chip and to a corresponding smart card.
    Type: Application
    Filed: November 30, 2021
    Publication date: January 16, 2025
    Inventors: Yean Wei YEAP, Cindy NG, Thomas DECKER
  • Patent number: 12079682
    Abstract: The present invention relates to card-type information substrates, such as payment cards, in which a frame is implemented so as to impart increased weight and/or superior appearance to the card-type substrates, wherein the influence of the frame on the RF performance of the card-type substrate is taken into consideration. For example, in illustrative embodiments the influence of a conductive material in the frame is reduced by selecting one or more appropriate features countering the negative effect on the RF performance.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: September 3, 2024
    Assignee: LINXENS HOLDING
    Inventors: Yean Wei Yeap, Wen Qiang Chin, Minli Cindy Ng
  • Publication number: 20230274123
    Abstract: Electrical circuit for a smart card chip module, including an insulating layer having a front main face and a rear main face. An antenna is made in a first conductive layer laying on the rear main face. This antenna extends over an antenna area delimited by a peripheral edge. The antenna includes at least one inner loop and one outer loop. The outer loop runs along the peripheral edge except over at least one first connecting segment diverted from the peripheral edge, towards or in a central zone of the antenna area. Further, the outer loop of the antenna includes at least a second connecting segment diverted from the peripheral edge towards a central zone of the antenna area.
    Type: Application
    Filed: July 24, 2020
    Publication date: August 31, 2023
    Inventors: Yean Wei YEAP, Wen Qiang CHIN
  • Publication number: 20230145739
    Abstract: The present invention relates to card-type information substrates, such as payment cards, in which a frame is implemented so as to impart increased weight and/or superior appearance to the card-type substrates, wherein the influence of the frame on the RF performance of the card-type substrate is taken into consideration. For example, in illustrative embodiments the influence of a conductive material in the frame is reduced by selecting one or more appropriate features countering the negative effect on the RF performance.
    Type: Application
    Filed: October 18, 2019
    Publication date: May 11, 2023
    Inventors: Yean Wei YEAP, Wen Qiang CHIN, Minli Cindy NG
  • Patent number: 11640514
    Abstract: The invention relates to a chip card designed to communicate data in a contactless mode with a card reader operating at a reading frequency. The resonance frequency of the chip card may change according to the capacitance of the chip used in the contactless mode of the chip card. In order to be able to use various chips without changing the booster antenna design, the card antenna circuit is provided with a capacitance element such that the chip card including the card antenna circuit and the chip module has two different resonance frequencies, one of which being equal to, or lower than, the reading frequency and the other being equal to, or greater, than the reading frequency. This create a broadband wherein the reading frequency falls.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: May 2, 2023
    Assignee: Linxens Holding
    Inventors: Yean Wei Yeap, Minli Cindy Ng, Wen Qiang Chin
  • Publication number: 20220114411
    Abstract: The invention relates to a chip card designed to communicate data in a contactless mode with a card reader operating at a reading frequency. The resonance frequency of the chip card may change according to the capacitance of the chip used in the contactless mode of the chip card. In order to be able to use various chips without changing the booster antenna design, the card antenna circuit is provided with a capacitance element such that the chip card including the card antenna circuit and the chip module has two different resonance frequencies, one of which being equal to, or lower than, the reading frequency and the other being equal to, or greater, than the reading frequency. This create a broadband wherein the reading frequency falls.
    Type: Application
    Filed: January 31, 2019
    Publication date: April 14, 2022
    Inventors: Yean Wei YEAP, Minli Cindy NG, Wen Qiang CHIN
  • Publication number: 20210133529
    Abstract: The invention relates to a chip card including a card body made of plastic material and having several functions possibly managed by a controller and energy supplied by an electrical energy power supply device, such as a battery. Various components, like a chip for bank transactions, a sensor of biometric characteristics, a display device, etc. may be incorporated in modules placed in cavities formed in constituent layers of the body of the card. The invention relates also to a method for fabricating such a chip card.
    Type: Application
    Filed: March 5, 2018
    Publication date: May 6, 2021
    Inventors: Yean Wei YEAP, Christophe MATHIEU, Carsten NIELAND, Sven DORING