Patents by Inventor Yee C. Feng

Yee C. Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tool for dip-type ICs
    Patent number: 4879806
    Abstract: A tool for a DIP-type IC includes an inverted U-shaped body having two elastic parallel arms respectively having two free ends, and a working medium mounted on the free ends. The tool is capable of both inserting an IC on a PCB and removing the IC from the PCB.
    Type: Grant
    Filed: August 3, 1988
    Date of Patent: November 14, 1989
    Inventor: Yee C. Feng
  • Integrated circuit insertion tool
    Patent number: D310468
    Type: Grant
    Filed: August 3, 1988
    Date of Patent: September 11, 1990
    Inventor: Yee C. Feng
  • Integrated circuit insertion tool
    Patent number: D325501
    Type: Grant
    Filed: November 2, 1989
    Date of Patent: April 21, 1992
    Inventor: Yee C. Feng