Patents by Inventor Yee Choong Lim

Yee Choong Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11658159
    Abstract: An integrated circuit may include circuitry for accessing an associated die stack. The circuitry may receive temperature information as well as a plurality of operating parameters that help determine whether it may be desirable to reroute access commands or requests to one or more die in the stack. The circuitry may include a smart crossbar switch that implements an address translation or hashing function to help map the logical user address to a physical address space. Performing thermally aware traffic management in this way can ensure that acceptable timing margins are maintained in the system to minimize the probability of errors.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: May 23, 2023
    Assignee: Intel Corporation
    Inventors: Saravanan Sethuraman, Tonia Morris, Siaw Kang Lai, Yee Choong Lim, Yu Ying Ong
  • Publication number: 20220013505
    Abstract: An integrated circuit may include circuitry for accessing an associated die stack. The circuitry may receive temperature information as well as a plurality of operating parameters that help determine whether it may be desirable to reroute access commands or requests to one or more die in the stack. The circuitry may include a smart crossbar switch that implements an address translation or hashing function to help map the logical user address to a physical address space. Performing thermally aware traffic management in this way can ensure that acceptable timing margins are maintained in the system to minimize the probability of errors.
    Type: Application
    Filed: September 24, 2021
    Publication date: January 13, 2022
    Inventors: Saravanan Sethuraman, Tonia Morris, Siaw Kang Lai, Yee Choong Lim, Yu Ying Ong
  • Patent number: 11164847
    Abstract: An integrated circuit may include circuitry for accessing an associated die stack. The circuitry may receive temperature information as well as a plurality of operating parameters that help determine whether it may be desirable to reroute access commands or requests to one or more die in the stack. The circuitry may include a smart crossbar switch that implements an address translation or hashing function to help map the logical user address to a physical address space. Performing thermally aware traffic management in this way can ensure that acceptable timing margins are maintained in the system to minimize the probability of errors.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: November 2, 2021
    Assignee: Intel Corporation
    Inventors: Saravanan Sethuraman, Tonia Morris, Siaw Kang Lai, Yee Choong Lim, Yu Ying Ong
  • Publication number: 20200105722
    Abstract: An integrated circuit may include circuitry for accessing an associated die stack. The circuitry may receive temperature information as well as a plurality of operating parameters that help determine whether it may be desirable to reroute access commands or requests to one or more die in the stack. The circuitry may include a smart crossbar switch that implements an address translation or hashing function to help map the logical user address to a physical address space. Performing thermally aware traffic management in this way can ensure that acceptable timing margins are maintained in the system to minimize the probability of errors.
    Type: Application
    Filed: December 3, 2019
    Publication date: April 2, 2020
    Applicant: Intel Corporation
    Inventors: Saravanan Sethuraman, Tonia Morris, Siaw Kang Lai, Yee Choong Lim, Yu Ying Ong