Patents by Inventor Yee Gin TEA

Yee Gin TEA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ROUGHENED CONDUCTIVE COMPONENTS
    Publication number: 20230317569
    Abstract: In some examples, a semiconductor package comprises a die pad, a semiconductor die on the die pad, and a mold compound covering the die pad and the semiconductor die. The semiconductor package includes a conductive component including a roughened surface, the roughened surface having a roughness ranging from an arithmetic mean surface height (SA) of 1.4 to 3.2. The mold compound is coupled to the roughened surface. The semiconductor package includes a bond wire coupling the semiconductor die to the roughened surface. The bond wire is directly coupled to the roughened surface without a precious metal positioned therebetween.
    Type: Application
    Filed: June 5, 2023
    Publication date: October 5, 2023
    Inventors: Yee Gin TEA, Chong Han LIM
  • Roughened conductive components
    Patent number: 11715678
    Abstract: In some examples, a semiconductor package comprises a die pad, a semiconductor die on the die pad, and a mold compound covering the die pad and the semiconductor die. The semiconductor package includes a conductive component including a roughened surface, the roughened surface having a roughness ranging from an arithmetic mean surface height (SA) of 1.4 to 3.2. The mold compound is coupled to the roughened surface. The semiconductor package includes a bond wire coupling the semiconductor die to the roughened surface. The bond wire is directly coupled to the roughened surface without a precious metal positioned therebetween.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: August 1, 2023
    Assignee: Texas Instruments Incorporated
    Inventors: Yee Gin Tea, Chong Han Lim
  • ROUGHENED CONDUCTIVE COMPONENTS
    Publication number: 20220208659
    Abstract: In some examples, a semiconductor package comprises a die pad, a semiconductor die on the die pad, and a mold compound covering the die pad and the semiconductor die. The semiconductor package includes a conductive component including a roughened surface, the roughened surface having a roughness ranging from an arithmetic mean surface height (SA) of 1.4 to 3.2. The mold compound is coupled to the roughened surface. The semiconductor package includes a bond wire coupling the semiconductor die to the roughened surface. The bond wire is directly coupled to the roughened surface without a precious metal positioned therebetween.
    Type: Application
    Filed: January 25, 2021
    Publication date: June 30, 2022
    Inventors: Yee Gin TEA, Chong Han LIM