Patents by Inventor Yee Hao Ho

Yee Hao Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate grooves to reduce underfill fillet bridging
    Patent number: 7179683
    Abstract: An apparatus having and method of forming grooves in the surface of a substrate adjacent and parallel to sidewall locations for circuit chips or die mounted on the surface. The grooves have physical dimensions to retain fill material formed between the packages and the surface of the substrate so that the fill material does not bridge between chips, thus reducing warping of the substrate due to mismatches in coefficient of thermal expansion (CTE) between the fill material, the substrate, the chips, and mold material formed over the substrate, under fill, and chips.
    Type: Grant
    Filed: August 25, 2004
    Date of Patent: February 20, 2007
    Assignee: Intel Corporation
    Inventors: Al Ling Low, Yee Hao Ho, Yew Wee Cheong, Wei Keat Loh