Patents by Inventor Yee Ho

Yee Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170281582
    Abstract: An agent for secreting ghrelin, comprising ornithine or a salt thereof as an active ingredient, an agent for enhancing eating activity, comprising ornithine or a salt thereof as an active ingredient, and an agent for enhancing gastrointestinal activity, comprising ornithine or a salt thereof as an active ingredient.
    Type: Application
    Filed: June 14, 2017
    Publication date: October 5, 2017
    Applicant: KYOWA HAKKO BIO CO., LTD.
    Inventors: Kousaku OHINATA, Yee HO, Takafumi MIZUSHIGE, Kentaro KANEKO, Saori AKIZUKI, Koji MORISHITA
  • Publication number: 20070293467
    Abstract: The present invention provides a stereo-isomer of the demethylcantharidin platinum complex of formula I and use thereof. The stereo-isomer inhibits the growth of cisplatin, carboplatin or oxaliplatin-sensitive and -resistant tumorous cells. The invention also describes a pharmaceutical composition comprising the stereo-isomer of the demethylcantharidin platinum complex and use thereof.
    Type: Application
    Filed: April 8, 2005
    Publication date: December 20, 2007
    Inventors: Yee Ho, Steve Au-Yeung, Kin To, Xinning Wang
  • Publication number: 20060046352
    Abstract: An apparatus having and method of forming grooves in the surface of a substrate adjacent and parallel to sidewall locations for circuit chips or die mounted on the surface. The grooves have physical dimensions to retain fill material formed between the packages and the surface of the substrate so that the fill material does not bridge between chips, thus reducing warping of the substrate due to mismatches in coefficient of thermal expansion (CTE) between the fill material, the substrate, the chips, and mold material formed over the substrate, under fill, and chips.
    Type: Application
    Filed: August 25, 2004
    Publication date: March 2, 2006
    Inventors: Al Low, Yee Ho, Yew Cheong, Wei Loh