Abstract: There is provided an optical encoder including an encoding medium, multiple photodiodes and a signal processing circuit. The encoding medium includes an index track. The index track includes a first index pattern and a second index pattern. The multiple photodiodes include a first index photodiode, a second index photodiode and a reference index photodiode for receiving modulated light from the first index pattern and the second index pattern. When the first index photodiode is aligned with the first index pattern and the second index photodiode is aligned with the second index pattern, the signal processing circuit outputs a triggering signal.

Abstract: Disclosed herein are aspects related to a device that can include a wireless communication interface and one or more processors. The one or more processors can identify a capability of the device to control a parameter related to receiving a signal via the wireless communications interface. The capability can be representative of an improvement of reception by the device. The one or more processors can provide, to a network device using the wireless communications interface, a signal indicating the capability. The one or more processors can control operation of the wireless communications interface responsive to instructions received from the network device and related to the capability.

Abstract: There is provided an optical encoding system including a photodiode array and a code disk opposite to each other. The code disk is arranged with multiple code slits at a ring area corresponding to the photodiode array. A length direction of each photodiode of the photodiode array has at least one deviation angle with respect to a length direction of the multiple code slits to reduce the total harmonic distortion in photocurrents.

Abstract: There is provided an optical encoder with alignable relative positions between elements including an encoding medium, a sensor package and a memory. The sensor package includes a photodiode array and two alignment photodiodes opposite to the encoding medium. The memory records an alignment pattern associated with output signals of the two alignment photodiodes when the encoding medium and the sensor package are at nominal operating positions. When the encoding medium and the sensor package are not at the nominal operating positions, the relative position alignment is performed by adjusting current relative positions between the encoding medium and the sensor package to cause a current pattern associated with output signals of the two alignment photodiodes to be identical to the alignment pattern.

Abstract: A method for charging a battery, which includes the steps of acquiring real-time information about the battery; receiving on-site input from a user, the on-site input comprising at least one of a user available time in which the battery is to be charged and a target State of Charge (SoC) to which the battery is to be charged; by using a capacity charging model of the battery, calculating a charging current for the battery based on the on-site input and the real-time information; charging the battery using the calculated charging current during a charging period to fulfill the user's energy requirement; and calibrating the capacity charging model based on information of the battery gathered during the charging period. The invention provides an adaptive battery charging method and system that decides an optimal charging current for batteries in view of on-site user commands inputted to the battery charger.

Abstract: There is provided an optical encoder with alignable relative positions between elements including an encoding medium, a sensor package and a memory. The sensor package includes a photodiode array and two alignment photodiodes opposite to the encoding medium. The memory records an alignment pattern associated with output signals of the two alignment photodiodes when the encoding medium and the sensor package are at nominal operating positions. When the encoding medium and the sensor package are not at the nominal operating positions, the relative position alignment is performed by adjusting current relative positions between the encoding medium and the sensor package to cause a current pattern associated with output signals of the two alignment photodiodes to be identical to the alignment pattern.

Abstract: There is provided an optical encoder including an encoding medium, multiple photodiodes and a signal processing circuit. The encoding medium includes an index track. The index track includes a first index pattern and a second index pattern. The multiple photodiodes include a first index photodiode, a second index photodiode and a reference index photodiode for receiving modulated light from the first index pattern and the second index pattern. When the first index photodiode is aligned with the first index pattern and the second index photodiode is aligned with the second index pattern, the signal processing circuit outputs a triggering signal.

Abstract: There is provided an optical encoder including an encoding medium, multiple photodiodes and a signal processing circuit. The encoding medium includes an index track. The index track includes a first index pattern and a second index pattern. The multiple photodiodes include a first index photodiode, a second index photodiode and a reference index photodiode for receiving modulated light from the first index pattern and the second index pattern. When the first index photodiode is aligned with the first index pattern and the second index photodiode is aligned with the second index pattern, the signal processing circuit outputs a triggering signal.

Abstract: There is provided an optical encoder with alignable relative positions between elements including an encoding medium, a sensor package and a memory. The sensor package includes a photodiode array and two alignment photodiodes opposite to the encoding medium. The memory records an alignment pattern associated with output signals of the two alignment photodiodes when the encoding medium and the sensor package are at nominal operating positions. When the encoding medium and the sensor package are not at the nominal operating positions, the relative position alignment is performed by adjusting current relative positions between the encoding medium and the sensor package to cause a current pattern associated with output signals of the two alignment photodiodes to be identical to the alignment pattern.

Abstract: A circuit module (e.g., an amplifier module) includes a module substrate, a thermal dissipation structure, a semiconductor die, encapsulant material, and an interposer. The module substrate has a mounting surface and a plurality of conductive pads at the mounting surface. The thermal dissipation structure extends through the module substrate, and a surface of the thermal dissipation structure is exposed at the mounting surface of the module substrate. The semiconductor die is coupled to the surface of the thermal dissipation structure. The encapsulant material covers the mounting surface of the module substrate and the semiconductor die, and a surface of the encapsulant material defines a contact surface of the circuit module. The interposer is embedded within the encapsulant material. The interposer includes a conductive terminal with a proximal end coupled to a conductive pad of the module substrate, and a distal end exposed at the contact surface of the circuit module.

Abstract: There is provided an optical encoder with alignable relative positions between elements including an encoding medium, a sensor package and a memory. The sensor package includes a photodiode array and two alignment photodiodes opposite to the encoding medium. The memory records an alignment pattern associated with output signals of the two alignment photodiodes when the encoding medium and the sensor package are at nominal operating positions. When the encoding medium and the sensor package are not at the nominal operating positions, the relative position alignment is performed by adjusting current relative positions between the encoding medium and the sensor package to cause a current pattern associated with output signals of the two alignment photodiodes to be identical to the alignment pattern.

Abstract: A method of manufacturing a semiconductor structure including the following steps is provided. A substrate is provided. The substrate has a first region and a second region. A stacked structure is formed on the substrate in the first region. The stacked structure includes a first dielectric layer, a charge storage layer, a second dielectric layer, a first conductive layer, and a first hard mask layer. A dielectric material layer is formed on the substrate in the second region. A second conductive layer is formed on the dielectric material layer in the second region. A first patterned photoresist layer is formed. The first hard mask layer exposed by the first patterned photoresist layer and a portion of the dielectric material layer exposed by the first patterned photoresist layer are removed by using the first patterned photoresist layer as a mask.

Abstract: Disclosed is a device for incision and insertion of a ventilation tube during myringotomy, comprising a cutter member configured to make an incision; a holder member configured to dispose the ventilation tube in an orientation in which a longitudinal axis of the ventilation tube is substantially perpendicular to the cutter member; and a pusher member configured to apply a pushing force to a first end of the ventilation tube in a direction substantially perpendicular to the longitudinal axis, the first end of the ventilation tube being disposed closer to the cutter member than a second end of the ventilation tube; wherein the holder member comprises a pivot element configured to releasably engage the second end of the ventilation tube such that the ventilation tube is pivotable under the pushing force applied to the first end of the ventilation tube by the pusher member, for insertion of the first end of the ventilation tube into the incision.

Abstract: Systems and methods in which a thermal conductive composite comprises a non-uniform heat absorption profile of a thermal reactive material are described. Thermal conductive composites herein may be utilized in thermal regulatory modules with a gradient structure configured to transfer heat energy away from an area near a heat source to an area with a relatively large latent heat absorbing capacity. Thermal conductive material may be provided in a frame structure having lower porosity in a first region more near a heat source and higher porosity in a second region more distant from the heat source. A thermal reactive material may be deposited so as to be disposed within the pores of the thermal conductive material frame structure wherein the density of the thermal reactive material in the first region of the thermal conductive composite is lower than that at the second region of the thermal conductive composite.

Abstract: An apparatus for a smart gym is described herein. An electronic device includes a sensor to detect movement of a user in a workout area, at least one memory, instructions, and processor circuitry to execute the instructions to: generate a skeleton frame representative of the user in the workout area; analyze the detected movements of the user; identify a posture of the user performing an exercise; and output a signal to cause posture feedback to be displayed, the posture-analysis feedback indicative of proper form of a skeleton frame of the user when performing an exercise.

Abstract: A circuit module (e.g., an amplifier module) includes a module substrate, a thermal dissipation structure, a semiconductor die, encapsulant material, and an interposer. The module substrate has a mounting surface and a plurality of conductive pads at the mounting surface. The thermal dissipation structure extends through the module substrate, and a surface of the thermal dissipation structure is exposed at the mounting surface of the module substrate. The semiconductor die is coupled to the surface of the thermal dissipation structure. The encapsulant material covers the mounting surface of the module substrate and the semiconductor die, and a surface of the encapsulant material defines a contact surface of the circuit module. The interposer is embedded within the encapsulant material. The interposer includes a conductive terminal with a proximal end coupled to a conductive pad of the module substrate, and a distal end exposed at the contact surface of the circuit module.

Abstract: An apparatus for a smart gym is described herein. The smart gym includes a platform and at least one camera. The platform comprises at least a weight sensor. The at least one camera is configured to capture movements on the platform. In some cases, an exercise is identified by comparing the joint movement to a known joint movement associated with the exercise.

Abstract: There is provided an optical encoder including an encoding medium, multiple photodiodes and a signal processing circuit. The encoding medium includes an index track. The index track includes a first index pattern and a second index pattern. The multiple photodiodes include a first index photodiode, a second index photodiode and a reference index photodiode for receiving modulated light from the first index pattern and the second index pattern. When the first index photodiode is aligned with the first index pattern and the second index photodiode is aligned with the second index pattern, the signal processing circuit outputs a triggering signal.

Abstract: The present invention relates to supplemented serum-containing cell culture media that provides enhances ARPE-19 cell growth and/or improves the yield of human cytomegalovirus (HCMV) grown in ARPE-19 cell cultures. The media of the invention includes two additives, a hormone (e.g., a glucocorticoid hormone such as dexamethasone) and a growth factor (e.g., EGF). The invention further provides methods of producing HCMV in such growth media.

Abstract: A method for preparing a magnetic chain structure is provided. The method comprises providing a plurality of magnetic particles; dispersing the plurality of magnetic particles in a solution comprising a dopamine-based material to form a reaction mixture; applying a magnetic field across the reaction mixture to align the magnetic particles in the reaction mixture; and polymerizing the dopamine-based material on the aligned magnetic particles to obtain the magnetic chain structure. A magnetic chain structure prepared by the method is also provided.