Patents by Inventor Yee Lun ONG

Yee Lun ONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230112520
    Abstract: The present disclosure relates to an electronic assembly including a package substrate with a first surface and an opposing second surface; a first interconnect disposed in the package substrate and extending between the first and the second surfaces; and a second interconnect disposed in the package substrate and extending between the first and the second surfaces; wherein the first interconnect comprises a first recessed side wall and the second interconnect is arranged adjacent the first recessed side wall.
    Type: Application
    Filed: October 11, 2021
    Publication date: April 13, 2023
    Inventors: Yee Lun ONG, Teong Guan YEW, Bok Eng CHEAH, Jackson Chung Peng KONG