Patents by Inventor Yee Ming Chan

Yee Ming Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Kisspeptins to Predict and Treat Delayed Puberty
    Publication number: 20220313781
    Abstract: Methods of diagnosing and treating pathologic hypogonadotropic hypogonadism and reproductive endocrine dysfunction using kisspeptin and kisspeptin analogs.
    Type: Application
    Filed: June 8, 2020
    Publication date: October 6, 2022
    Inventors: Stephanie Beth Seminara, Yee-Ming Chan, Margaret Flynn Lippincott
  • Enhanced intermetal dielectric adhesion
    Patent number: 11282744
    Abstract: Device and method of forming the device are disclosed. A semiconductor device includes a back-end-of-line dielectric (BEOL) with a plurality of IMD levels over a substrate processed with front-end-of-line components. The BEOL includes an upper IMD level and upper metal lines, with a buffer layer over the upper metal lines. The buffer layer improves adhesion of the upper IMD layer which covers the upper metal lines. Improving the adhesion of the upper IMD layer improves the reliability of the device.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: March 22, 2022
    Assignee: Systems On Silicon Manufacturing Co. Pte. Ltd.
    Inventors: Pankaj Kumar Uttwani, Shankaran Chelliah, Yee Ming Chan
  • ENHANCED INTERMETAL DIELECTRIC ADHESION
    Publication number: 20210098289
    Abstract: Device and method of forming the device are disclosed. A semiconductor device includes a back-end-of-line dielectric (BEOL) with a plurality of IMD levels over a substrate processed with front-end-of-line components. The BEOL includes an upper IMD level and upper metal lines, with a buffer layer over the upper metal lines. The buffer layer improves adhesion of the upper IMD layer which covers the upper metal lines. Improving the adhesion of the upper IMD layer improves the reliability of the device.
    Type: Application
    Filed: September 30, 2019
    Publication date: April 1, 2021
    Inventors: Pankaj Kumar UTTWANI, Shankaran CHELLIAH, Yee Ming CHAN
  • Protective cage and radio combination
    Patent number: D474175
    Type: Grant
    Filed: November 29, 2001
    Date of Patent: May 6, 2003
    Assignee: Emerson Radio Corp.
    Inventors: Kazuo Furusho, Edward Arthur Holland, Yee Ming Chan, Edison Yip, Ho Kit Chan, John Joseph Raab
  • Protective cage portion
    Patent number: D474176
    Type: Grant
    Filed: November 29, 2001
    Date of Patent: May 6, 2003
    Assignee: Emerson Radio Corp.
    Inventors: Kazuo Furusho, Edward Arthur Holland, Yee Ming Chan, Edison Yip, Ho Kit Chan, John Joseph Raab
  • Protective cage
    Patent number: D474177
    Type: Grant
    Filed: November 29, 2001
    Date of Patent: May 6, 2003
    Assignee: Emerson Radio Corp.
    Inventors: Kazuo Furusho, Edward Arthur Holland, Yee Ming Chan, Edison Yip, Ho Kit Chan, John Joseph Raab
  • Protective cage and radio combination
    Patent number: D479223
    Type: Grant
    Filed: October 2, 2001
    Date of Patent: September 2, 2003
    Assignee: Emerson Radio Corp.
    Inventors: Kazuo Furusho, Edward Arthur Holland, Yee Ming Chan, Edison Yip, Ho Kit Chan, John Joseph Raab