Patents by Inventor Yee Wei Eric Hong

Yee Wei Eric Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin chassis near field communication (NFC) antenna integration
    Patent number: 11283173
    Abstract: Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: March 22, 2022
    Assignee: Intel Corporation
    Inventors: Songnan Yang, Hao-Han Hsu, Ulun Karacaoglu, Anand Konanur, Yee Wei Eric Hong
  • Thin chassis near field communication (NFC) antenna integration
    Patent number: 10749261
    Abstract: Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: August 18, 2020
    Assignee: Intel Corporation
    Inventors: Songnan Yang, Hao-Han Hsu, Ulun Karacaoglu, Anand S. Konanur, Yee Wei Eric Hong
  • THIN CHASSIS NEAR FIELD COMMUNICATION (NFC) ANTENNA INTEGRATION
    Publication number: 20170264342
    Abstract: Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.
    Type: Application
    Filed: May 26, 2017
    Publication date: September 14, 2017
    Applicant: Intel Corporation
    Inventors: Songnan Yang, Hao-Han Hsu, Ulun Karacaoglu, Anand S. Konanur, Yee Wei Eric Hong
  • Thin chassis near field communication (NFC) antenna integration
    Patent number: 9614592
    Abstract: Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: April 4, 2017
    Assignee: Intel Corporation
    Inventors: Songnan Yang, Hao-Han Hsu, Ulun Karacaoglu, Anand S. Konanur, Yee Wei Eric Hong
  • THIN CHASSIS NEAR FIELD COMMUNICATION (NFC) ANTENNA INTEGRATION
    Publication number: 20160191122
    Abstract: Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.
    Type: Application
    Filed: November 3, 2015
    Publication date: June 30, 2016
    Inventors: Songnan Yang, Hao-Han Hsu, Ulun Karacaoglu, Anand S. Konanur, Yee Wei Eric Hong
  • THIN CHASSIS NEAR FIELD COMMUNICATION (NFC) ANTENNA INTEGRATION
    Publication number: 20160073221
    Abstract: Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.
    Type: Application
    Filed: November 16, 2015
    Publication date: March 10, 2016
    Applicant: INTEL CORPORATION
    Inventors: Songnan Yang, Hao-Han Hsu, Ulun Karacaoglu, Anand S. Konanur, Yee Wei Eric Hong
  • Thin chassis near field communication (NFC) antenna integration
    Patent number: 9083073
    Abstract: Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: July 14, 2015
    Assignee: Intel Corporation
    Inventors: Songnan Yang, Hao-Han Hsu, Ulun Karacaoglu, Anand S Konanur, Yee Wei Eric Hong
  • THIN CHASSIS NEAR FIELD COMMUNICATION (NFC) ANTENNA INTEGRATION
    Publication number: 20140002313
    Abstract: Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.
    Type: Application
    Filed: June 28, 2012
    Publication date: January 2, 2014
    Inventors: Songnan Yang, Hao-Han Hsu, Ulun Karacaoglu, Anand S Konanur, Yee Wei Eric Hong