Patents by Inventor Yeh-Hsin Yu

Yeh-Hsin Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for semiconductor wafer transfer
    Patent number: 8303231
    Abstract: An apparatus for semiconductor wafer transfer comprises a first region for placement of a pod, a second region for placement of a cassette, an unloading mechanism, and a transferring mechanism for transferring wafers in the unloaded pod to the cassette horizontally. In an embodiment, the pod is unloaded by lifting the housing of the pod, and preferably the apparatus for movement of semiconductor wafers further comprises a carrying mechanism for moving the cassette toward the pod, so that the cassette can be closer to the pod for smoothing wafer transfer.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: November 6, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company Ltd.
    Inventors: Yeh-Hsin Yu, Jian-Hung Chen, Chia Ho Chuang, Hsueh Cheng Wu
  • APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER TRANSFER
    Publication number: 20090087287
    Abstract: An apparatus for semiconductor wafer transfer comprises a first region for placement of a pod, a second region for placement of a cassette, an unloading mechanism, and a transferring mechanism for transferring wafers in the unloaded pod to the cassette horizontally. In an embodiment, the pod is unloaded by lifting the housing of the pod, and preferably the apparatus for movement of semiconductor wafers further comprises a carrying mechanism for moving the cassette toward the pod, so that the cassette can be closer to the pod for smoothing wafer transfer.
    Type: Application
    Filed: September 28, 2007
    Publication date: April 2, 2009
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yeh Hsin Yu, Jian Hung Chen, Chia Ho Chuang, Hsueh Cheng Wu