Patents by Inventor Yeh Jian-Fa

Yeh Jian-Fa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050022972
    Abstract: An improved heat sink element coupling structure comprised of a minimum of one or more folded appendages that are formed by bending along the upper or lower lateral edges, the middle, or other suitable position of a single heat sink element or along the two sides of one lateral edge or middle position of a single heat sink element; an opening disposed at the confluence of the folded appendage and the single heat sink element plate that penetrates the folded appendage to form a perforated construct; and a linking member that extends outward from the folded appendage and, furthermore, is positioned at the distal extremity of the single heat sink element plate. The features of the present invention include the following innovations. The linking member also has two lock tabs along its two sides that extend from the two sides at the leading extremity of the linking member.
    Type: Application
    Filed: October 14, 2003
    Publication date: February 3, 2005
    Inventors: Chen Cheng-Tung, Yeh Jian-Fa