Abstract: A heat dissipation structure applied to mobile device includes a heat conduction main body. The heat conduction main body has a heat dissipation side and a heat absorption side. A radiation heat dissipation layer is formed on the heat dissipation side. The heat dissipation structure is disposed in the mobile device to provide a very good heat dissipation effect for the closed space of the mobile device by way of natural convection and radiation. Therefore, the heat dissipation performance of the entire mobile device is greatly enhanced.

Abstract: A storage device assembling module for assembling a storage device in an electronic apparatus includes a main frame, an adapter, and at least one handgrip. The main frame includes a chute forming a receiving space for receiving the storage device and positioning. The adapter is combined with the main frame and includes a first connecting port connected electrically to the storage device and a second connecting port connected electrically to a circuit board. The location of the first connecting port is closed to the chute, and the connecting direction of the first connecting port is substantially perpendicular to the connecting direction of the second connecting port. Each handgrip is connected pivotally to at least one side of the main frame which is away from the circuit board. The storage device assembling module can substantially be perpendicularly detached from the circuit board by pulling the at least one handgrip.

Abstract: A camera module and a fabrication method thereof are provided. The camera module includes a lens structure and an image sensor device chip disposed under the lens structure. The lens structure includes a transparent substrate and a lens disposed on the transparent substrate. A spacer is disposed on the transparent substrate to surround the lens, wherein the spacer contains a base pattern and a dry film photoresist. The method includes forming a base pattern on a carrier and attaching a dry film photoresist on the carrier. The dry film photoresist is planarized by a lamination process and then patterned to form a spacer. A transparent substrate having a plurality of lenses is provided. The spacer is stripped from the carrier, attaching on the transparent substrate to surround each of the lenses, and then bonded with image sensor device chips.

Abstract: A heat dissipation structure enhancing heat source self heat radiation includes a heat source and a heat radiation layer formed on at least one side of an exterior of the heat source. With the heat dissipation structure, the heat source can have largely increased self heat radiation efficiency, enabling heat emitted by the heat source to be quickly dissipated into ambient environment to avoid heat accumulation on the heat source.

Abstract: A heat dissipation structure for semiconductor element includes a semiconductor element and a covering. The covering has a first side and an opposite second side and is formed on the second side with a heat radiation layer. The covering is externally covered on one side of the semiconductor element with the first side of the covering attached to the covered side of the semiconductor. By attaching the covering to one side of the semiconductor element, heat emitted by the semiconductor element during operation can be more quickly absorbed by the covering and radiated from the heat radiation layer into ambient environment to avoid heat accumulation on the semiconductor element.

Abstract: A heat dissipation device includes a main body and a radiation heat dissipation layer. The main body has a first board body and a second board body. The first and second board bodies are correspondingly mated with each other to define a receiving space. At least one capillary structure and a working fluid are disposed in the receiving space. The radiation heat dissipation layer is formed on one face of the second board body, which face is distal from the first board body. The heat dissipation device is disposed in a mobile device to provide a very good heat dissipation effect for the closed space of the mobile device by way of natural convection and radiation. Therefore, the heat dissipation performance of the entire mobile device is greatly enhanced.

Abstract: A heat dissipation structure applied to mobile device includes a heat conduction main body. The heat conduction main body has a heat dissipation side and a heat absorption side. A radiation heat dissipation layer is formed on the heat dissipation side. The heat dissipation structure is disposed in the mobile device to provide a very good heat dissipation effect for the closed space of the mobile device by way of natural convection and radiation. Therefore, the heat dissipation performance of the entire mobile device is greatly enhanced.

Abstract: A camera module and a fabrication method thereof are provided. The camera module includes a lens structure and an image sensor device chip disposed under the lens structure. The lens structure includes a transparent substrate and a lens disposed on the transparent substrate. A spacer is disposed on the transparent substrate to surround the lens, wherein the spacer contains a base pattern and a dry film photoresist. The method includes forming a base pattern on a carrier and attaching a dry film photoresist on the carrier. The dry film photoresist is planarized by a lamination process and then patterned to form a spacer. A transparent substrate having a plurality of lenses is provided. The spacer is stripped from the carrier, attaching on the transparent substrate to surround each of the lenses, and then bonded with image sensor device chips.

Abstract: A recombinant baculovirus is provided for preparing picornavirus virus-like particles (VLP), wherein Chitinase A (ChiA) and Cathepsin V (v-cath) genes of the recombinant baculovirus are functionally disrupted and the recombinant baculovirus includes a picornavirus capsid protein gene under control of a strong promoter, and includes a protease gene configured for encoding a protease for hydrolyzing the capsid protein under control of a weak promoter. The recombinant baculovirus of the present invention may adopt High Five or Sf-9 cells for manufacturing enterovirus virus-like particles with improved stability and higher yields in comparison with the conventional arts. A method for preparing virus like particles is also herein provided.

Abstract: A support structure for heat dissipation unit includes at least one main body and an oxide coating. Multiple grooves are formed on an outer circumference of the main body. The oxide coating is coated on the outer circumference of the main body and the surfaces of the grooves. The sintered powder body can be replaced with the support structure with the directional oxide coating coated on the outer circumference of the main body and the surfaces of the grooves to greatly speed the vapor-liquid circulation of the working fluid in the chamber of the heat dissipation unit so as to enhance the heat dissipation performance.

Abstract: A range finder adapted for finding the object distance of a subject having a specific height includes a shell unit, an objective lens assembly, a magnifying unit having multiple selectable magnification ratios, and a range finding unit. The range finding unit includes a scale, a pointer, and a mark. The object distance of the subject is known by comparing the scale and the pointer in an imaging plane when an end of an image of the specific height of the subject formed on the imaging plane is aligned with the mark.

Abstract: A heat dissipation device includes a first board body and a second board body. The first board body has a first face and a second face. The second face is formed with a rough structure. The second board body has a third face and a fourth face. The fourth face is mated with the second face and covered by the second face. The second and fourth faces together define a chamber. A working fluid is filled in the chamber. The rough structure is coated with a coating. By means of the rough structure and the coating, the cost for the heat dissipation device is reduced and the thermal resistance of the heat dissipation device is lowered.

Abstract: A cable management apparatus includes two mounting brackets, a cable management arm connected between the two mounting brackets and slidable vertically, and two elevating mechanisms respectively mounted between opposite ends of the cable management arm and the corresponding mounting brackets. Each of the elevating mechanisms includes a sliding plate connected to the cable management arm and slidable horizontally relative to the cable management arm, a first connecting pole with opposite ends respectively rotatably connected to the sliding plate and one of the mounting brackets adjacent to the sliding plate, and a second connecting pole with opposite ends respectively rotatably connected to the sliding block and the mounting bracket.

Abstract: A heat dissipation structure for heat dissipation unit includes a heat dissipation unit main body that internally defines a chamber, and the chamber is internally provided with at least a layer of nanoscale threadlike bodies and a working fluid. The layer of nanoscale threadlike bodies is provided on an inner wall surface of the chamber. By providing the layer of nanoscale threadlike bodies in the chamber, it is able to provide largely upgraded capillary effect in the chamber to thereby increase the vapor/liquid cycling efficiency of the working fluid in the heat dissipation unit, enabling the latter to have upgraded heat transfer performance.

Abstract: A heat dissipation structure for heat dissipation device includes a heat dissipation device main body that internally defines a chamber, and the chamber is internally provided with at least a whisker layer and a working fluid. The whisker layer is provided on an inner wall surface of the chamber. By providing the whisker layer in the chamber, it is able to provide largely upgraded capillary effect in the chamber to thereby increase the vapor/liquid cycling efficiency of the working fluid in the heat dissipation device, enabling the latter to have upgraded heat transfer performance.

Abstract: A storage device assembling module for assembling a storage device in an electronic apparatus includes a main frame, an adapter, and at least one handgrip. The main frame includes a chute forming a receiving space for receiving the storage device and positioning. The adapter is combined with the main frame and includes a first connecting port connected electrically to the storage device and a second connecting port connected electrically to a circuit board. The location of the first connecting port is closed to the chute, and the connecting direction of the first connecting port is substantially perpendicular to the connecting direction of the second connecting port. Each handgrip is connected pivotally to at least one side of the main frame which is away from the circuit board. The storage device assembling module can substantially be perpendicularly detached from the circuit board by pulling the at least one handgrip.

Abstract: A recombinant baculovirus is provided for preparing picornavirus virus-like particles (VLP), wherein Chitinase A (ChiA) and Cathepsin V (v-cath) genes of the recombinant baculovirus are functionally disrupted and the recombinant baculovirus includes a picornavirus capsid protein gene under control of a strong promoter, and includes a protease gene configured for encoding a protease for hydrolyzing the capsid protein under control of a weak promoter. The recombinant baculovirus of the present invention may adopt High Five or Sf-9 cells for manufacturing enterovirus virus-like particles with improved stability and higher yields in comparison with the conventional arts. A method for preparing virus like particles is also herein provided.

Abstract: A speed estimation method including a reference value establishing step, an actual value establishing step, an approximate location calculating step, a weight location calculating step, a weight location determining step and a speed calculating step is disclosed. The reference value establishing step determines a plurality of training locations and establishes a reference signal strength set for each training location. The actual value establishing step establishes an actual signal strength set of a communication device at a time point. The approximate location calculating step calculates a plurality of signal strength differences according to the actual signal strength set and the reference signal strength set, and generates a plurality of approximate locations. The weight location calculating step calculates a weight location of the communication device. The weight location determining step determines whether two weight locations are obtained.

Abstract: A vehicular lamp includes a reflective housing having a first recessed portion with a reflective surface. An outer housing made of heat dissipating material is fixed to the reflective housing and includes a plurality of fins on an outer surface thereof. The outer housing further includes a second recessed portion receiving the reflective housing. A receiving portion is provided behind the second recessed portion and receives a circuit board. A heat conductive seat made of heat dissipating material includes a connecting plate fixed to the outer housing. An extension extends from the connecting plate to a central, front portion of the reflective housing. The LED light module is mounted to the extension and electrically connected to the circuit board. A light-transmitting cover is mounted to and covers openings of the reflective housing and the outer housing.

Abstract: A sight device with a light-extinction structure includes a zooming outer tube, an inner tube and a zooming group. The inner tube is disposed coaxially in the zooming outer tube, and the zooming group is composed by a plurality of lenses, and the zooming group is disposed inside the inner tube and is controlled by the zooming outer tube, and thus the lenses are allowed to move inside the inner tube for adapting a focal length of the zooming group.